Inventor · disambiguated record
Yogita Pareek
Also filed as: PAREEK YOGITA
7 granted patents·6 pending applications·113 citations·filing 2014–2020
78Inventor score
Files withAPPLIED MATERIALS INC13
Top patents by PatentIndex Score
13 records- 0196US9903020B2Generation of compact alumina passivation layers on aluminum plasma equipment componentsAPPLIED MATERIALS INC·Filed 2014·Granted Feb 27, 2018·108 cites·5 claims
- 0285US10941303B2Chemical conversion of yttria into yttrium fluoride and yttrium oxyfluoride to develop pre-seasoned corossion resistive coating for plasma componentsAPPLIED MATERIALS INC·Filed 2017·Granted Mar 9, 2021·4 cites·20 claims
- 0368US10233554B2Aluminum electroplating and oxide formation as barrier layer for aluminum semiconductor process equipmentAPPLIED MATERIALS INC·Filed 2017·Granted Mar 19, 2019·1 cites·19 claims
- 0460US11976357B2Methods for forming a protective coating on processing chamber surfaces or componentsAPPLIED MATERIALS INC·Filed 2019·Granted May 7, 2024·0 cites·11 claims
- 0559US11118263B2Method for forming a protective coating film for halide plasma resistanceAPPLIED MATERIALS INC·Filed 2019·Granted Sep 14, 2021·0 cites·7 claims
- 0654US10253406B2Method for forming yttrium oxide on semiconductor processing equipmentAPPLIED MATERIALS INC·Filed 2017·Granted Apr 9, 2019·0 cites·19 claims
- 0752US10886137B2Selective nitride removalAPPLIED MATERIALS INC·Filed 2019·Granted Jan 5, 2021·0 cites·17 claims
- 0844US2022277936A1Protective multilayer coating for processing chamber componentsAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 0940US2016258064A1Barrier anodization methods to develop aluminum oxide layer for plasma equipment componentsAPPLIED MATERIALS INC·Filed 2015·Application pending·0 cites
- 1038US2017056935A1Method for removing aluminum fluoride contamination from semiconductor processing equipmentAPPLIED MATERIALS INC·Filed 2015·Application pending·0 cites
- 1136US2018061617A1Method to deposit aluminum oxy-fluoride layer for fast recovery of etch amount in etch chamberAPPLIED MATERIALS INC·Filed 2017·Application pending·0 cites
- 1235US2018330929A1In-situ removal of accumulated process byproducts from components of a semiconductor processing chamberAPPLIED MATERIALS INC·Filed 2017·Application pending·0 cites
- 1335US2018374706A1Corrosion resistant coating for semiconductor process equipmentAPPLIED MATERIALS INC·Filed 2016·Application pending·0 cites
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