Inventor · disambiguated record
Akihiro Itou
Also filed as: ITOU AKIHIRO
30 granted patents·6 pending applications·24 citations·filing 2001–2024
93Inventor score
Files withPANASONIC IP MAN CO LTD27JAPAN EPOXY RESINS CO LTD4MITSUBISHI CHEM CORP2KYOTO MUNICIPAL INST OF IND TECH AND CULTURE1MITSUBISHI RAYON CO1
Top patents by PatentIndex Score
36 records- 0188US10923357B2Element chip and manufacturing process thereofPANASONIC IP MAN CO LTD·Filed 2018·Granted Feb 16, 2021·5 cites·12 claims
- 0283US9458544B2Organic hydride conversion devicePANASONIC IP MAN CO LTD·Filed 2015·Granted Oct 4, 2016·2 cites·14 claims
- 0381US11189480B2Element chip manufacturing methodPANASONIC IP MAN CO LTD·Filed 2020·Granted Nov 30, 2021·1 cites·5 claims
- 0470US11959197B2Carbon fiber precursor acrylic fiber, carbon fiber, and method for producing sameMITSUBISHI CHEM CORP·Filed 2019·Granted Apr 16, 2024·0 cites·14 claims
- 0570US10892190B2Manufacturing process of element chipPANASONIC IP MAN CO LTD·Filed 2019·Granted Jan 12, 2021·1 cites·15 claims
- 0670US10497622B2Element chip manufacturing methodPANASONIC IP MAN CO LTD·Filed 2017·Granted Dec 3, 2019·1 cites·8 claims
- 0759US11830758B2Plasma processing methodPANASONIC IP MAN CO LTD·Filed 2021·Granted Nov 28, 2023·0 cites·9 claims
- 0858US2024312841A1Element chip manufacturing methodPANASONIC IP MAN CO LTD·Filed 2024·Application pending·0 cites
- 0958US2023420277A1Recipe proposal device and recipe proposal methodPANASONIC IP MAN CO LTD·Filed 2023·Application pending·0 cites
- 1057US7491774B2Producing granular epoxy resin by refining and pulverizing solid epoxy resinJAPAN EPOXY RESINS CO LTD·Filed 2007·Granted Feb 17, 2009·0 cites·2 claims
- 1157US7307128B2Epoxy compound, preparation method thereof, and use thereofJAPAN EPOXY RESINS CO LTD·Filed 2004·Granted Dec 11, 2007·7 cites·11 claims
- 1257US7304120B2Epoxy compound, preparation method thereof, and use thereofJAPAN EPOXY RESINS CO LTD·Filed 2007·Granted Dec 4, 2007·1 cites·7 claims
- 1356US7070861B2Flame retardant epoxy resin composition, and prepreg and fiber-reinforced composite materials made by using the compositionMITSUBISHI RAYON CO·Filed 2001·Granted Jul 4, 2006·4 cites·15 claims
- 1454US11817323B2Etching method and element chip manufacturing methodPANASONIC IP MAN CO LTD·Filed 2021·Granted Nov 14, 2023·0 cites·12 claims
- 1554US9896771B2Dehydrogenation devicePANASONIC IP MAN CO LTD·Filed 2015·Granted Feb 20, 2018·0 cites·16 claims
- 1653US2022402072A1Element chip manufacturing method and substrate processing methodPANASONIC IP MAN CO LTD·Filed 2022·Application pending·0 cites
- 1752US11211178B2Transparent neutron shielding materialMITSUBISHI CHEM CORP·Filed 2017·Granted Dec 28, 2021·0 cites·8 claims
- 1851US12230541B2Element chip manufacturing methodPANASONIC IP MAN CO LTD·Filed 2021·Granted Feb 18, 2025·0 cites·4 claims
- 1951US8790563B2Method of producing molded article of fiber-reinforced composite material and the molded articleTAKANO TSUNEO·Filed 2003·Granted Jul 29, 2014·2 cites·17 claims
- 2050US12500076B2Cleaning method of electronic component and manufacturing method of element chipPANASONIC IP MAN CO LTD·Filed 2020·Granted Dec 16, 2025·0 cites·9 claims
- 2150US10964597B2Element chip manufacturing methodPANASONIC IP MAN CO LTD·Filed 2019·Granted Mar 30, 2021·0 cites·7 claims
- 2249US10714356B2Plasma processing methodPANASONIC IP MAN CO LTD·Filed 2018·Granted Jul 14, 2020·0 cites·7 claims
- 2349US2022165577A1Element chip manufacturing method and plasma processing methodPANASONIC IP MAN CO LTD·Filed 2021·Application pending·0 cites
- 2448US11219929B2Element chip cleaning method, element chip cleaning apparatus, and element chip manufacturing methodPANASONIC IP MAN CO LTD·Filed 2020·Granted Jan 11, 2022·0 cites·9 claims
- 2547US11335564B2Element chip smoothing method and element chip manufacturing methodPANASONIC IP MAN CO LTD·Filed 2020·Granted May 17, 2022·0 cites·4 claims
- 2646US11688641B2Element chip isolation method using laser grooving and plasma etchingPANASONIC IP MAN CO LTD·Filed 2020·Granted Jun 27, 2023·0 cites·6 claims
- 2745US10242914B2Element chip manufacturing methodPANASONIC IP MAN CO LTD·Filed 2018·Granted Mar 26, 2019·0 cites·11 claims
- 2845US7285602B2Granular epoxy resin, production method thereof, and granular epoxy resin packageJAPAN EPOXY RESINS CO LTD·Filed 2004·Granted Oct 23, 2007·0 cites·6 claims
- 2944US10297487B2Element chip manufacturing methodPANASONIC IP MAN CO LTD·Filed 2017·Granted May 21, 2019·0 cites·10 claims
- 3043US10297489B2Plasma processing method and plasma processing apparatusPANASONIC IP MAN CO LTD·Filed 2017·Granted May 21, 2019·0 cites·12 claims
- 3143US10276423B2Method of manufacturing element chipPANASONIC IP MAN CO LTD·Filed 2018·Granted Apr 30, 2019·0 cites·7 claims
- 3240US9505915B2Fastening component and method for manufacturing the fastening componentKYOTO MUNICIPAL INST OF IND TECH AND CULTURE·Filed 2012·Granted Nov 29, 2016·0 cites·12 claims
- 3339US10236266B2Element chip manufacturing methodPANASONIC IP MAN CO LTD·Filed 2017·Granted Mar 19, 2019·0 cites·6 claims
- 3439US10049933B2Element chip manufacturing methodPANASONIC IP MAN CO LTD·Filed 2017·Granted Aug 14, 2018·0 cites·8 claims
- 3537US2017263461A1Plasma processing methodPANASONIC IP MAN CO LTD·Filed 2017·Application pending·0 cites
- 3636US2017263502A1Method for manufacturing element chipPANASONIC IP MAN CO LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →