Inventor · disambiguated record
Tohru Fujinawa
Also filed as: FUJINAWA TOHRU
24 granted patents·8 pending applications·322 citations·filing 1998–2012
96Inventor score
Files withHITACHI CHEMICAL CO LTD16ARIFUKU MOTOHIRO7TATSUZAWA TAKASHI3FUJINAWA TOHRU2KATOGI SHIGEKI2
Top patents by PatentIndex Score
32 records- 0194US7629050B2Circuit-connecting material and circuit terminal connected structure and connecting methodHITACHI CHEMICAL CO LTD·Filed 2007·Granted Dec 8, 2009·11 cites·8 claims
- 0294US7241644B2Adhesive, method of connecting wiring terminals and wiring structureHITACHI CHEMICAL CO LTD·Filed 2005·Granted Jul 10, 2007·28 cites·12 claims
- 0393US7141645B2Wiring-connecting material and wiring-connected board production process using the sameHITACHI CHEMICAL CO LTD·Filed 2004·Granted Nov 28, 2006·36 cites·6 claims
- 0491US6939913B1Adhesive agent, method of connecting wiring terminals and wiring structureHITACHI CHEMICAL CO LTD·Filed 2000·Granted Sep 6, 2005·30 cites·13 claims
- 0590US7604868B2Electronic circuit including circuit-connecting materialHITACHI CHEMICAL CO LTD·Filed 2005·Granted Oct 20, 2009·16 cites·10 claims
- 0690US7553890B2Circuit-connecting material and circuit terminal connected structure and connecting methodHITACHI CHEMICAL CO LTD·Filed 2007·Granted Jun 30, 2009·11 cites·9 claims
- 0788US6777464B1Circuit connecting material, and structure and method of connecting circuit terminalHITACHI CHEMICAL CO LTD·Filed 1998·Granted Aug 17, 2004·86 cites·15 claims
- 0887US8115322B2Adhesive, method of connecting wiring terminals and wiring structureARIFUKU MOTOHIRO·Filed 2010·Granted Feb 14, 2012·6 cites·13 claims
- 0987US7777335B2Wiring structure having a wiring-terminal-connecting adhesive comprising silicone particlesHITACHI CHEMICAL CO LTD·Filed 2005·Granted Aug 17, 2010·11 cites·16 claims
- 1086US7618713B2Circuit-connecting material and circuit terminal connected structure and connecting methodHITACHI CHEMICAL CO LTD·Filed 2005·Granted Nov 17, 2009·11 cites·8 claims
- 1185US6762249B1Wiring-connecting material and process for producing circuit board with the sameHITACHI CHEMICAL CO LTD·Filed 1999·Granted Jul 13, 2004·39 cites·21 claims
- 1278US7208105B2Adhesive for circuit connection, circuit connection method using the same, and circuit connection structureHITACHI CHEMICAL CO LTD·Filed 2001·Granted Apr 24, 2007·16 cites·13 claims
- 1377US8029911B2Adhesive for circuit connection, circuit connection method using the same, and circuit connected structureHITACHI CHEMICAL CO LTD·Filed 2010·Granted Oct 4, 2011·4 cites·12 claims
- 1475US8120189B2Wiring terminal-connecting adhesiveARIFUKU MOTOHIRO·Filed 2008·Granted Feb 21, 2012·1 cites·13 claims
- 1575US7968196B2Circuit-connecting material and circuit terminal connected structure and connecting methodHITACHI CHEMICAL CO LTD·Filed 2007·Granted Jun 28, 2011·1 cites·24 claims
- 1667US7629056B2Circuit-connecting material and circuit terminal connected structure and connecting methodHITACHI CHEMICAL CO LTD·Filed 2004·Granted Dec 8, 2009·12 cites·9 claims
- 1765US7879956B2Circuit-connecting material and circuit terminal connected structure and connecting methodHITACHI CHEMICAL CO LTD·Filed 2007·Granted Feb 1, 2011·0 cites·18 claims
- 1859US8518303B2Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor deviceKATOGI SHIGEKI·Filed 2006·Granted Aug 27, 2013·2 cites·15 claims
- 1959US8497431B2Circuit connection material, circuit member connecting structure and method of connecting circuit memberARIFUKU MOTOHIRO·Filed 2006·Granted Jul 30, 2013·0 cites·20 claims
- 2059US7967943B2Circuit-connecting material and circuit terminal connected structure and connecting methodHITACHI CHEMICAL CO LTD·Filed 2005·Granted Jun 28, 2011·0 cites·92 claims
- 2152US8142605B2Circuit-connecting material and circuit terminal connected structure and connecting methodWATANABE ITSUO·Filed 2011·Granted Mar 27, 2012·0 cites·27 claims
- 2249US8541688B2Circuit connection material, circuit member connecting structure and method of connecting circuit memberARIFUKU MOTOHIRO·Filed 2010·Granted Sep 24, 2013·1 cites·17 claims
- 2349US2006252843A1Wiring-connecting material and wiring-connected board production process using the sameFUJINAWA TOHRU·Filed 2006·Application pending·0 cites
- 2448US8696942B2Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor deviceKATOGI SHIGEKI·Filed 2012·Granted Apr 15, 2014·0 cites·13 claims
- 2548US2007166549A1Adhesive for circuit connection, circuit connection method using the same, and circuit connected structureNOMURA SATOYUKI·Filed 2007·Application pending·0 cites
- 2648US2010265685A1Wiring-connecting material and wiring-connected board production process using the sameFUJINAWA TOHRU·Filed 2010·Application pending·0 cites
- 2742US2012085579A1Adhesive composition, circuit connecting material and connecting structure of circuit memberTATSUZAWA TAKASHI·Filed 2006·Application pending·0 cites
- 2839US8558118B2Circuit connection material, circuit member connecting structure and method of connecting circuit memberARIFUKU MOTOHIRO·Filed 2010·Granted Oct 15, 2013·0 cites·15 claims
- 2937US2012015126A1Adhesive material reelTATSUZAWA TAKASHI·Filed 2010·Application pending·0 cites
- 3037US2012138868A1Circuit connecting material, film-like circuit connecting material using the circuit connecting material, structure for connecting circuit member, and method for connecting circuit memberARIFUKU MOTOHIRO·Filed 2010·Application pending·0 cites
- 3137US2012097902A1Anisotropic conductive particlesARIFUKU MOTOHIRO·Filed 2010·Application pending·0 cites
- 3237US2011300326A1Adhesive material reelTATSUZAWA TAKASHI·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →