Inventor · disambiguated record
Kenichi Nishino
Also filed as: NISHINO KENICHI
19 granted patents·1 pending application·242 citations·filing 1982–2014
95Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD8TAKEDA CHEMICAL INDUSTRIES LTD5PANASONIC CORP2TERAOKA SEIKO KK2IWAI HISAYUKI1
Top patents by PatentIndex Score
20 records- 0184US6544377B1Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic componentsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Apr 8, 2003·40 cites·13 claims
- 0275US4932857ACompression molding apparatusTAKEDA CHEMICAL INDUSTRIES LTD·Filed 1989·Granted Jun 12, 1990·36 cites·4 claims
- 0373US7490652B2Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic componentsPANASONIC CORP·Filed 2005·Granted Feb 17, 2009·5 cites·6 claims
- 0471US7938929B2Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic componentsPANASONIC CORP·Filed 2009·Granted May 10, 2011·4 cites·8 claims
- 0569US4456744AComposition for producing polyurethane resin at ambient temperatureTAKEDA CHEMICAL INDUSTRIES LTD·Filed 1982·Granted Jun 26, 1984·17 cites·10 claims
- 0666US9123214B2Commodity sales data processing deviceTERAOKA SEIKO KK·Filed 2014·Granted Sep 1, 2015·2 cites·8 claims
- 0760US4640950AThixotropic polyurethane resin compositionsTAKEDA CHEMICAL INDUSTRIES LTD·Filed 1985·Granted Feb 3, 1987·16 cites·6 claims
- 0859US7220922B2Electronic component, component mounting equipment, and component mounting methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted May 22, 2007·12 cites·20 claims
- 0959US6246789B1Component mounting apparatus and methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Jun 12, 2001·31 cites·28 claims
- 1055US9354107B2Item registration apparatus and measuring deviceTERAOKA SEIKO KK·Filed 2014·Granted May 31, 2016·0 cites·14 claims
- 1155US4603181AIn-mold coating compositionTAKEDA CHEMICAL INDUSTRIES LTD·Filed 1985·Granted Jul 29, 1986·12 cites·4 claims
- 1250US6647616B1Bump bonding unit with tray storage and transport apparatusesMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Nov 18, 2003·17 cites·3 claims
- 1348US5462626AMethod of bonding an external lead and a tool thereforMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1993·Granted Oct 31, 1995·13 cites·14 claims
- 1447US6055724AMethod and device for sealing IC chipMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted May 2, 2000·13 cites·11 claims
- 1543US4952652AUnsaturated polyester compositions and molded products therefromTOYOTA MOTOR CO LTD·Filed 1988·Granted Aug 28, 1990·7 cites·10 claims
- 1640US2003121616A1Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic componentsFiled 2003·Application pending·0 cites
- 1736US6129203AIC discarding apparatus for flip chip mounting facilityMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Oct 10, 2000·7 cites·6 claims
- 1835US5582341ABonding apparatus for terminal componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Dec 10, 1996·6 cites·4 claims
- 1930US5164448ACurable unsaturated polyester dresin compositionTAKEDA CHEMICAL INDUSTRIES LTD·Filed 1991·Granted Nov 17, 1992·1 cites·5 claims
- 2024US5064900ACurable unsaturated polyester resin compositionIWAI HISAYUKI·Filed 1990·Granted Nov 12, 1991·3 cites·12 claims
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