Inventor · disambiguated record
Joseph Brand
Also filed as: BRAND JOSEPH · BRAND JOSEPH H · BRAND JOSEPH M
33 granted patents·4 pending applications·582 citations·filing 1976–2022
97Inventor score
Top patents by PatentIndex Score
37 records- 0196US11503076B2System and method for encryption key management, federation and distributionFORNETIX LLC·Filed 2020·Granted Nov 15, 2022·7 cites·24 claims
- 0295US6210992B1Controlling packaging encapsulant leakageMICRON TECHNOLOGY INC·Filed 1999·Granted Apr 3, 2001·172 cites·18 claims
- 0393US9729577B2System and method for encryption key management, federation and distributionFORNETIX LLC·Filed 2014·Granted Aug 8, 2017·20 cites·22 claims
- 0491US10257230B2System and method for encryption key management, federation and distributionFORNETIX LLC·Filed 2017·Granted Apr 9, 2019·8 cites·21 claims
- 0591US6008074AMethod of forming a synchronous-link dynamic random access memory edge-mounted deviceMICRON TECHNOLOGY INC·Filed 1998·Granted Dec 28, 1999·85 cites·28 claims
- 0690US6383292B1Semiconductor device encapsulatorsMICRON TECHNOLOGY INC·Filed 2000·Granted May 7, 2002·57 cites·7 claims
- 0787US10965459B2Server-client key escrow for applied key management system and processFORNETIX LLC·Filed 2016·Granted Mar 30, 2021·6 cites·25 claims
- 0886US10742689B2System and method for encryption key management, federation and distributionFORNETIX LLC·Filed 2019·Granted Aug 11, 2020·3 cites·20 claims
- 0984US10403598B2Methods and system for processing semiconductor device structuresMICRON TECHNOLOGY INC·Filed 2017·Granted Sep 3, 2019·3 cites·21 claims
- 1084US10257175B2Encryption deployment discoveryFORNETIX LLC·Filed 2016·Granted Apr 9, 2019·10 cites·16 claims
- 1181US6521980B1Controlling packaging encapsulant leakageMICRON TECHNOLOGY INC·Filed 2000·Granted Feb 18, 2003·25 cites·12 claims
- 1279US7306974B2Microelectronic devices and methods for manufacturing and operating packaged microelectronic device assembliesMICRON TECHNOLOGY INC·Filed 2005·Granted Dec 11, 2007·7 cites·9 claims
- 1379US6461894B2Methods of forming a circuit and methods of preparing an integrated circuitMICRON TECHNOLOGY INC·Filed 2001·Granted Oct 8, 2002·21 cites·30 claims
- 1476US6498052B2Circuit, method of adhering an integrated circuit device to a substrate, and method of forming a circuitMICRON TECHNOLOGY INC·Filed 2001·Granted Dec 24, 2002·17 cites·46 claims
- 1575US6528890B1Circuit, method of adhering an integrated circuit device to a substrate, and method of forming a circuitMICRON TECHNOLOGY INC·Filed 2000·Granted Mar 4, 2003·17 cites·11 claims
- 1673US10679967B2Systems enabling lower-stress processing of semiconductor device structures and related structuresMICRON TECHNOLOGY INC·Filed 2019·Granted Jun 9, 2020·1 cites·20 claims
- 1772US2023083120A1System and method for encryption key management, federation and distributionFORNETIX LLC·Filed 2022·Application pending·0 cites
- 1870US7273769B1Method and apparatus for removing encapsulating material from a packaged microelectronic deviceMICRON TECHNOLOGY INC·Filed 2000·Granted Sep 25, 2007·13 cites·25 claims
- 1968US7405487B2Method and apparatus for removing encapsulating material from a packaged microelectronic deviceMICRON TECHNOLOGY INC·Filed 2002·Granted Jul 29, 2008·11 cites·4 claims
- 2065US6395579B2Controlling packaging encapsulant leakageMICRON TECHNOLOGY INC·Filed 2001·Granted May 28, 2002·10 cites·9 claims
- 2163US6949838B2Integrated circuit deviceMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 27, 2005·7 cites·37 claims
- 2261US6399425B1Method of encapsulating semiconductor devices utilizing a dispensing apparatus with rotating orificesMICRON TECHNOLOGY INC·Filed 1998·Granted Jun 4, 2002·21 cites·55 claims
- 2360US6706565B2Methods of forming an integrated circuit deviceMICRON TECHNOLOGY INC·Filed 1999·Granted Mar 16, 2004·17 cites·74 claims
- 2460US6355985B1Integrated circuit device and synchronous-link dynamic random access memory deviceMICRON TECHNOLOGY INC·Filed 1999·Granted Mar 12, 2002·17 cites·39 claims
- 2559US11924345B2Server-client key escrow for applied key management system and processFORNETIX LLC·Filed 2021·Granted Mar 5, 2024·0 cites·20 claims
- 2653US6812068B2Semiconductor device encapsulators, methods of encapsulating semiconductor devices and methods of forming electronic packagesMICRON TECHNOLOGY INC·Filed 2002·Granted Nov 2, 2004·4 cites·19 claims
- 2753US6423581B1Method of fabricating an encapsulant lock feature in integrated circuit packagingMICRON TECHNOLOGY INC·Filed 2000·Granted Jul 23, 2002·4 cites·10 claims
- 2851US6355506B1Method of forming heat sink and semiconductor chip assembliesMICRON TECHNOLOGY INC·Filed 2000·Granted Mar 12, 2002·3 cites·17 claims
- 2950US2007031998A1Method and apparatus for removing encapsulating material from a packaged microelectronic deviceMICRON TECHNOLOGY INC·Filed 2006·Application pending·0 cites
- 3040US7067905B2Packaged microelectronic devices including first and second casingsMICRON TECHNOLOGY INC·Filed 2002·Granted Jun 27, 2006·0 cites·23 claims
- 3140US6908795B2Method of fabricating an encapsulant lock feature in integrated circuit packagingMICRON TECHNOLOGY INC·Filed 2002·Granted Jun 21, 2005·0 cites·14 claims
- 3240US6706560B2Method of forming heat sink and semiconductor chip assembliesMICRON TECHNOLOGY INC·Filed 2002·Granted Mar 16, 2004·0 cites·16 claims
- 3338US6114190AMethod of forming heat sink and semiconductor chip assembliesMICRON TECHNOLOGY INC·Filed 1998·Granted Sep 5, 2000·5 cites·46 claims
- 3435US2006032983A1Foreign object damage tolerant nacelle anti-icing systemBRAND JOSEPH H·Filed 2004·Application pending·0 cites
- 3530US6379991B2Encapsulation methods for semiconductive die packagesMICRON TECHNOLOGY INC·Filed 1999·Granted Apr 30, 2002·0 cites·40 claims
- 3630US2002030257A1Semiconductor device utiling an encapsulant for locking a semiconductor die to circuit substrateFiled 1999·Application pending·0 cites
- 3728US4031320ASound producing deviceBRAND BRIDGET A·Filed 1976·Granted Jun 21, 1977·11 cites·7 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →