Inventor · disambiguated record
Takashi Naganuma
Also filed as: NAGANUMA TAKASHI
4 granted patents·1 pending application·40 citations·filing 1997–2004
78Inventor score
Technology areasH10P
Top patents by PatentIndex Score
5 records- 0169US6368905B1Process for manufacturing a semiconductor wafer, a semiconductor wafer, process for manufacturing a semiconductor integrated circuit device, and semiconductor integrated circuit deviceHITACHI LTD·Filed 2000·Granted Apr 9, 2002·9 cites·17 claims
- 0263US6806130B2Process for manufacturing a semiconductor wafer, a semiconductor wafer, process for manufacturing a semiconductor integrated circuit device, and semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2001·Granted Oct 19, 2004·6 cites·11 claims
- 0362US6630375B2Process for manufacturing a semiconductor wafer, a semiconductor wafer, process for manufacturing a semiconductor integrated circuit device, and semiconductor integrated circuit deviceHITACHI LTD·Filed 2001·Granted Oct 7, 2003·6 cites·4 claims
- 0461US6043114AProcess for manufacturing a semiconductor wafer, a semiconductor wafer, process for manufacturing a semiconductor integrated circuit device, and semiconductor integrated circuit deviceHITACHI LTD·Filed 1997·Granted Mar 28, 2000·19 cites·42 claims
- 0542US2004219727A1Process for manufacturing a semiconductor wafer, a semiconductor wafer, process for manufacturing a semiconductor integrated circuit device, and semiconductor integrated circuit deviceKAWAGOE HIROTO·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →