Inventor · disambiguated record
Kam S. Law
Also filed as: LAW KAM · LAW KAM S
71 granted patents·14 pending applications·8,507 citations·filing 1986–2017
99Inventor score
Files withAPPLIED MATERIALS INC49APPLIED KOMATSU TECHNOLOGY INC20LAW KAM S3BLONIGAN WENDELL THOMAS2MAK CECILIA Y2
Top patents by PatentIndex Score
85 records- 0199US6825134B2Deposition of film layers by alternately pulsing a precursor and high frequency power in a continuous gas flowAPPLIED MATERIALS INC·Filed 2002·Granted Nov 30, 2004·595 cites·33 claims
- 0299US6182603B1Surface-treated shower head for use in a substrate processing chamberAPPLIED KOMATSU TECHNOLOGY INC·Filed 1998·Granted Feb 6, 2001·692 cites·6 claims
- 0399US5362526APlasma-enhanced CVD process using TEOS for depositing silicon oxideAPPLIED MATERIALS INC·Filed 1991·Granted Nov 8, 1994·484 cites·15 claims
- 0499US5000113AThermal CVD/PECVD reactor and use for thermal chemical vapor deposition of silicon dioxide and in-situ multi-step planarized processAPPLIED MATERIALS INC·Filed 1986·Granted Mar 19, 1991·1.1k cites·19 claims
- 0599US4892753AProcess for PECVD of silicon oxide using TEOS decompositionAPPLIED MATERIALS INC·Filed 1988·Granted Jan 9, 1990·503 cites·12 claims
- 0699US4872947ACVD of silicon oxide using TEOS decomposition and in-situ planarization processAPPLIED MATERIALS INC·Filed 1988·Granted Oct 10, 1989·522 cites·14 claims
- 0798US6167834B1Thermal CVD/PECVD reactor and use for thermal chemical vapor deposition of silicon dioxide and in-situ multi-step planarized processAPPLIED MATERIALS INC·Filed 1992·Granted Jan 2, 2001·367 cites·5 claims
- 0898US5788778ADeposition chamber cleaning technique using a high power remote excitation sourceAPPLIED KOMATSU TECHNOLOGY INC·Filed 1996·Granted Aug 4, 1998·281 cites·21 claims
- 0998US5366585AMethod and apparatus for protection of conductive surfaces in a plasma processing reactorAPPLIED MATERIALS INC·Filed 1993·Granted Nov 22, 1994·462 cites·29 claims
- 1098US4960488AReactor chamber self-cleaning processAPPLIED MATERIALS INC·Filed 1989·Granted Oct 2, 1990·529 cites·16 claims
- 1197US6818529B2Apparatus and method for forming a silicon film across the surface of a glass substrateAPPLIED MATERIALS INC·Filed 2002·Granted Nov 16, 2004·151 cites·13 claims
- 1297US6235634B1Modular substrate processing systemAPPLIED KOMATSU TECHNOLOGY INC·Filed 1998·Granted May 22, 2001·420 cites·83 claims
- 1395US6857387B1Multiple frequency plasma chamber with grounding capacitor at cathodeAPPLIED MATERIALS INC·Filed 2000·Granted Feb 22, 2005·92 cites·33 claims
- 1495US6055927AApparatus and method for white powder reduction in silicon nitride deposition using remote plasma source cleaning technologyAPPLIED KOMATSU TECHNOLOGY INC·Filed 1997·Granted May 2, 2000·129 cites·15 claims
- 1595US6024044ADual frequency excitation of plasma for film depositionAPPLIED KOMATSU TECHNOLOGY INC·Filed 1997·Granted Feb 15, 2000·184 cites·7 claims
- 1694US6500356B2Selectively etching silicon using fluorine without plasmaAPPLIED MATERIALS INC·Filed 2000·Granted Dec 31, 2002·67 cites·10 claims
- 1794US5354715AThermal chemical vapor deposition of silicon dioxide and in-situ multi-step planarized processAPPLIED MATERIALS INC·Filed 1992·Granted Oct 11, 1994·132 cites·16 claims
- 1893US8444364B2Auto-sequencing multi-directional inline processing apparatusBLONIGAN WENDELL THOMAS·Filed 2010·Granted May 21, 2013·17 cites·19 claims
- 1993US6647993B2Surface-treated shower head for use in a substrate processing chamberAPPLIED KOMATSU TECHNOLOGY INC·Filed 2000·Granted Nov 18, 2003·48 cites·3 claims
- 2093US5399387APlasma CVD of silicon nitride thin films on large area glass substrates at high deposition ratesAPPLIED MATERIALS INC·Filed 1994·Granted Mar 21, 1995·127 cites·7 claims
- 2191US6355108B1Film deposition using a finger type shadow frameAPPLIED KOMATSU TECHNOLOGY INC·Filed 1999·Granted Mar 12, 2002·90 cites·27 claims
- 2290US5755886AApparatus for preventing deposition gases from contacting a selected region of a substrate during deposition processingAPPLIED MATERIALS INC·Filed 1995·Granted May 26, 1998·91 cites·28 claims
- 2390US5589233ASingle chamber CVD process for thin film transistorsAPPLIED MATERIALS INC·Filed 1995·Granted Dec 31, 1996·124 cites·17 claims
- 2488US6887776B2Methods to form metal lines using selective electrochemical depositionAPPLIED MATERIALS INC·Filed 2003·Granted May 3, 2005·42 cites·22 claims
- 2588US6451390B1Deposition of TEOS oxide using pulsed RF plasmaAPPLIED MATERIALS INC·Filed 2000·Granted Sep 17, 2002·27 cites·5 claims
- 2688USRE36623EProcess for PECVD of silicon oxide using TEOS decompositionAPPLIED MATERIALS INC·Filed 1996·Granted Mar 21, 2000·79 cites·13 claims
- 2786US5871811AMethod for protecting against deposition on a selected region of a substrateAPPLIED MATERIALS INC·Filed 1995·Granted Feb 16, 1999·69 cites·45 claims
- 2885US6869838B2Deposition of passivation layers for active matrix liquid crystal display (AMLCD) applicationsAPPLIED MATERIALS INC·Filed 2002·Granted Mar 22, 2005·35 cites·14 claims
- 2984US6902682B2Method and apparatus for electrostatically maintaining substrate flatnessAPPLIED MATERIALS INC·Filed 2002·Granted Jun 7, 2005·21 cites·15 claims
- 3084US5380566AMethod of limiting sticking of body to susceptor in a deposition treatmentAPPLIED MATERIALS INC·Filed 1993·Granted Jan 10, 1995·55 cites·19 claims
- 3182US9287152B2Auto-sequencing multi-directional inline processing methodORBOTECH LT SOLAR LLC·Filed 2013·Granted Mar 15, 2016·4 cites·18 claims
- 3282US7220685B2Method for depositing porous filmsMAK CECILIA Y·Filed 2006·Granted May 22, 2007·8 cites·64 claims
- 3382US6880561B2Fluorine process for cleaning semiconductor process chamberAPPLIED MATERIALS INC·Filed 2003·Granted Apr 19, 2005·23 cites·12 claims
- 3482US5892328AHigh-power, plasma-based, reactive species generatorAPPLIED KOMATSU TECHNOLOGY INC·Filed 1997·Granted Apr 6, 1999·37 cites·23 claims
- 3581US5928732AMethod of forming silicon oxy-nitride films by plasma-enhanced chemical vapor depositionAPPLIED MATERIALS INC·Filed 1995·Granted Jul 27, 1999·57 cites·28 claims
- 3681US5895937ATapered dielectric etch in semiconductor devicesAPPLIED KOMATSU TECHNOLOGY INC·Filed 1997·Granted Apr 20, 1999·52 cites·17 claims
- 3781US5607602AHigh-rate dry-etch of indium and tin oxides by hydrogen and halogen radicals such as derived from HCl gasAPPLIED KOMATSU TECHNOLOGY INC·Filed 1995·Granted Mar 4, 1997·63 cites·28 claims
- 3880US8672603B2Auto-sequencing inline processing apparatusBLONIGAN WENDELL THOMAS·Filed 2010·Granted Mar 18, 2014·4 cites·20 claims
- 3979US7029529B2Method and apparatus for metallization of large area substratesAPPLIED MATERIALS INC·Filed 2002·Granted Apr 18, 2006·21 cites·47 claims
- 4079US6500265B1Apparatus for electrostatically maintaining subtrate flatnessAPPLIED MATERIALS INC·Filed 2000·Granted Dec 31, 2002·16 cites·23 claims
- 4179US5204288AMethod for planarizing an integrated circuit structure using low melting inorganic materialAPPLIED MATERIALS INC·Filed 1992·Granted Apr 20, 1993·67 cites·24 claims
- 4278US7732010B2Method for supporting a glass substrate to improve uniform deposition thicknessAPPLIED MATERIALS INC·Filed 2006·Granted Jun 8, 2010·1 cites·8 claims
- 4378US6468601B1Apparatus and method for white powder reduction in silicon nitride deposition using remote plasma source cleaning technologyAPPLIED KOMATSU TECHNOLOGY INC·Filed 2000·Granted Oct 22, 2002·14 cites·14 claims
- 4477US8617349B2Showerhead assembly for plasma processing chamberLAW KAM S·Filed 2010·Granted Dec 31, 2013·6 cites·29 claims
- 4577US6338874B1Method for multilayer CVD processing in a single chamberAPPLIED MATERIALS INC·Filed 1995·Granted Jan 15, 2002·59 cites·24 claims
- 4676US5902650AMethod of depositing amorphous silicon based films having controlled conductivityAPPLIED KOMATSU TECHNOLOGY INC·Filed 1995·Granted May 11, 1999·44 cites·21 claims
- 4775US5851602ADeposition of high quality conformal silicon oxide thin films for the manufacture of thin film transistorsAPPLIED MATERIALS INC·Filed 1996·Granted Dec 22, 1998·44 cites·5 claims
- 4874US7439191B2Deposition of silicon layers for active matrix liquid crystal display (AMLCD) applicationsAPPLIED MATERIALS INC·Filed 2002·Granted Oct 21, 2008·18 cites·72 claims
- 4974US5861197ADeposition of high quality conformal silicon oxide thin films on glass substratesAPPLIED MATERIALS INC·Filed 1996·Granted Jan 19, 1999·40 cites·2 claims
- 5071US7056830B2Method for plasma etching a dielectric layerAPPLIED MATERIALS INC·Filed 2003·Granted Jun 6, 2006·14 cites·21 claims
Showing the top 50 of 85 patent records by PatentIndex Score.
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