Inventor · disambiguated record
Sudeep Mandal
Also filed as: MANDAL SUDEEP
32 granted patents·3 pending applications·125 citations·filing 2008–2023
95Inventor score
Top patents by PatentIndex Score
35 records- 0195US9008278B2Multilayer X-ray source target with high thermal conductivityGEN ELECTRIC·Filed 2012·Granted Apr 14, 2015·36 cites·45 claims
- 0294US10634890B1Miniaturized microscope for phase contrast and multicolor fluorescence imagingGEN ELECTRIC·Filed 2018·Granted Apr 28, 2020·6 cites·20 claims
- 0394US10120102B2Fluid sensor cable assembly, system, and methodGEN ELECTRIC·Filed 2015·Granted Nov 6, 2018·9 cites·20 claims
- 0494US9184112B1Cooling apparatus for an integrated circuitIBM·Filed 2014·Granted Nov 10, 2015·18 cites·20 claims
- 0593US10208587B1System and method for monitoring integrity of a wellboreGEN ELECTRIC·Filed 2017·Granted Feb 19, 2019·7 cites·23 claims
- 0692US9536732B2Low temperature fabrication of lateral thin film varistorIBM·Filed 2015·Granted Jan 3, 2017·5 cites·20 claims
- 0790US10049570B2Controlling right-of-way for priority vehiclesGLOBALFOUNDRIES INC·Filed 2015·Granted Aug 14, 2018·8 cites·15 claims
- 0889US9356089B1Low temperature fabrication of lateral thin film varistorIBM·Filed 2015·Granted May 31, 2016·4 cites·3 claims
- 0986US8552363B2System and method for optically driven separations using fluid filled core optical fibersERICKSON DAVID·Filed 2008·Granted Oct 8, 2013·12 cites·36 claims
- 1084US10393532B2Emergency responsive navigationIBM·Filed 2015·Granted Aug 27, 2019·5 cites·20 claims
- 1178US9472483B2Integrated circuit cooling apparatusIBM·Filed 2015·Granted Oct 18, 2016·3 cites·13 claims
- 1276US9871020B1Through silicon via sharing in a 3D integrated circuitGLOBALFOUNDRIES INC·Filed 2016·Granted Jan 16, 2018·4 cites·13 claims
- 1373US9913405B2Glass interposer with embedded thermoelectric devicesIBM·Filed 2015·Granted Mar 6, 2018·2 cites·8 claims
- 1473US9569571B1Method and system for timing violations in a circuitIBM·Filed 2015·Granted Feb 14, 2017·2 cites·11 claims
- 1568US10249590B2Stacked dies using one or more interposersGLOBALFOUNDRIES INC·Filed 2017·Granted Apr 2, 2019·1 cites·20 claims
- 1664US11782181B2Data fusion enhanced multi-modality wellbore integrity inspection systemGE ENERGY OILFIELD TECH INC·Filed 2018·Granted Oct 10, 2023·0 cites·21 claims
- 1764US9559283B2Integrated circuit cooling using embedded peltier micro-vias in substrateIBM·Filed 2015·Granted Jan 31, 2017·1 cites·10 claims
- 1863US10043962B2Thermoelectric cooling using through-silicon viasGLOBALFOUNDRIES INC·Filed 2016·Granted Aug 7, 2018·1 cites·19 claims
- 1962US10170224B2Low temperature fabrication of lateral thin film varistorIBM·Filed 2017·Granted Jan 1, 2019·0 cites·20 claims
- 2060US9870851B2Low temperature fabrication of lateral thin film varistorIBM·Filed 2016·Granted Jan 16, 2018·0 cites·20 claims
- 2160US9865674B2Low temperature fabrication of lateral thin film varistorIBM·Filed 2016·Granted Jan 9, 2018·0 cites·17 claims
- 2260US9068927B2Laboratory diffraction-based phase contrast imaging techniqueGEN ELECTRIC·Filed 2012·Granted Jun 30, 2015·1 cites·36 claims
- 2354US10304763B2Producing wafer level packaging using leadframe strip and related deviceGLOBALFOUNDRIES INC·Filed 2017·Granted May 28, 2019·0 cites·20 claims
- 2451US9892999B2Producing wafer level packaging using leadframe strip and related deviceGLOBALFOUNDRIES INC·Filed 2016·Granted Feb 13, 2018·0 cites·14 claims
- 2549US9869607B2Systems and methods for distributed measurementGEN ELECTRIC·Filed 2016·Granted Jan 16, 2018·0 cites·23 claims
- 2647US10013519B2Performance matching in three-dimensional (3D) integrated circuit (IC) using back-bias compensationGLOBALFOUNDRIES INC·Filed 2016·Granted Jul 3, 2018·0 cites·20 claims
- 2746US9585257B2Method of forming a glass interposer with thermal viasGLOBALFOUNDRIES INC·Filed 2015·Granted Feb 28, 2017·0 cites·10 claims
- 2846US2024318547A1Systems and methods for underwater flow analysisCOVAR LLC·Filed 2023·Application pending·0 cites
- 2944US10400574B2Apparatus and method for inspecting integrity of a multi-barrier wellboreGEN ELECTRIC·Filed 2017·Granted Sep 3, 2019·0 cites·17 claims
- 3044US9410892B2Nanoscale optofluidic devices for molecular detectionERICKSON DAVID·Filed 2008·Granted Aug 9, 2016·0 cites·6 claims
- 3143US2016117433A1Integrated circuit timing variability reductionGLOBALFOUNDRIES INC·Filed 2014·Application pending·0 cites
- 3242US9952500B2Adjusting of patterns in design layout for optical proximity correctionGLOBALFOUNDRIES INC·Filed 2016·Granted Apr 24, 2018·0 cites·20 claims
- 3342US9496234B1Wafer-level chip-scale package structure utilizing conductive polymerGLOBALFOUNDRIES INC·Filed 2015·Granted Nov 15, 2016·0 cites·9 claims
- 3437US9941458B2Integrated circuit cooling using embedded peltier micro-vias in substrateIBM·Filed 2015·Granted Apr 10, 2018·0 cites·14 claims
- 3535US2017271285A1Integrated circuit package using polymer-solder ball structures and forming methodsGLOBALFOUNDRIES INC·Filed 2016·Application pending·0 cites
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