Inventor · disambiguated record
Chien Rhone Wang
Also filed as: WANG CHIEN RHONE
18 granted patents·3 pending applications·341 citations·filing 1990–2024
92Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD11TAIWAN SEMICONDUCTOR MFG3WANG CHIEN RHONE3APPLIED MATERIALS INC2LAI CHIH-WEI1
Top patents by PatentIndex Score
21 records- 0193US5108570AMultistep sputtering process for forming aluminum layer over stepped semiconductor waferAPPLIED MATERIALS INC·Filed 1990·Granted Apr 28, 1992·170 cites·20 claims
- 0290US11626304B2Machine learning on overlay managementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 11, 2023·2 cites·20 claims
- 0389US5171412AMaterial deposition method for integrated circuit manufacturingAPPLIED MATERIALS INC·Filed 1991·Granted Dec 15, 1992·138 cites·21 claims
- 0487US10964566B2Machine learning on overlay virtual metrologyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 30, 2021·4 cites·20 claims
- 0585US9430605B2Adjusting sizes of connectors of package componentsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 30, 2016·4 cites·20 claims
- 0679US8791579B2Adjusting sizes of connectors of package componentsLAI CHIH-WEI·Filed 2011·Granted Jul 29, 2014·6 cites·17 claims
- 0778US9010617B2Solder joint reflow process for reducing packaging failure rateYU CHEN-HUA·Filed 2011·Granted Apr 21, 2015·5 cites·9 claims
- 0878US8945983B2System and method to improve package and 3DIC yield in underfill processTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 3, 2015·6 cites·20 claims
- 0977US12237188B2Machine learning on overlay managementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 25, 2025·0 cites·20 claims
- 1076US2025123572A1Machine learning on overlay managementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1172US9508653B2Die-tracing in integrated circuit manufacturing and packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Nov 29, 2016·3 cites·20 claims
- 1265US12197138B2Machine learning on overlay managementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 14, 2025·0 cites·20 claims
- 1365US9390491B2System and method for automatic quality control for assembly line processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jul 12, 2016·2 cites·18 claims
- 1457US9390060B2Packaging methods, material dispensing methods and apparatuses, and automated measurement systemsWANG CHIEN RHONE·Filed 2012·Granted Jul 12, 2016·1 cites·14 claims
- 1556US9111064B2Adjusting sizes of connectors of package componentsTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Aug 18, 2015·0 cites·20 claims
- 1655US9588505B2Near non-adaptive virtual metrology and chamber controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Mar 7, 2017·0 cites·20 claims
- 1754US10054938B2Clustering for prediction models in process control and for optimal dispatchingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 21, 2018·0 cites·20 claims
- 1846US2015051860A1Automatic optical appearance inspection by line scan apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Application pending·0 cites
- 1945US2013024019A1Apparatus and methods for end point determination in semiconductor processingTAIWAN SEMICONDUCTOR MFG·Filed 2011·Application pending·0 cites
- 2040US8445296B2Apparatus and methods for end point determination in reactive ion etchingWANG CHIEN RHONE·Filed 2011·Granted May 21, 2013·0 cites·15 claims
- 2139US9153506B2System and method for through silicon via yieldWANG CHIEN RHONE·Filed 2012·Granted Oct 6, 2015·0 cites·20 claims
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