Inventor · disambiguated record
Hiromichi Sugiyama
Also filed as: SUGIYAMA HIROMICHI
7 granted patents·6 pending applications·19 citations·filing 1998–2024
77Inventor score
Top patents by PatentIndex Score
13 records- 0179US9341949B2Photosensitive compositions and applications thereofPROMERUS LLC·Filed 2014·Granted May 17, 2016·6 cites·30 claims
- 0268US9696623B2Photosensitive compositions and applications thereofPROMERUS LLC·Filed 2016·Granted Jul 4, 2017·2 cites·5 claims
- 0358US7678514B2Positive-type photosensitive resin composition, cured film, protecting film, insulating film and semiconductor device and display device using these filmsSUMITOMO BAKELITE CO·Filed 2008·Granted Mar 16, 2010·1 cites·12 claims
- 0457US8492469B2Positive-type photosensitive resin composition, cured film, protective film, insulating film, and semiconductor device and display device including the cured filmSUGIYAMA HIROMICHI·Filed 2009·Granted Jul 23, 2013·0 cites·10 claims
- 0557US2013280654A1Positive-type photosensitive resin composition, cured film, protective film, insulating film, and semiconductor device and display device including the cured filmSUMITOMO BAKELITE CO·Filed 2013·Application pending·0 cites
- 0656US2025110399A1Photosensitive composition containing pfas-free polycycloolefinic terpolymers and semiconductor device made thereofPROMERUS LLC·Filed 2024·Application pending·0 cites
- 0751US2025110403A1Photosensitive composition containing pfas-free polycycloolefinic polymers and semiconductor device made thereofPROMERUS LLC·Filed 2024·Application pending·0 cites
- 0848US6007615AWater-swellable compositions and sealantsKUNIMINE IND CO LTD·Filed 1998·Granted Dec 28, 1999·10 cites·22 claims
- 0940US8440734B2Positive photosensitive resin composition, cured film, protecting film, insulating film, and semiconductor device and display device using the sameSUGIYAMA HIROMICHI·Filed 2009·Granted May 14, 2013·0 cites·8 claims
- 1035US2013009172A1Method of manufacture of light-emitting element and light-emitting element manufactured therebySUMITOMO BAKELITE CO·Filed 2011·Application pending·0 cites
- 1132US2012228782A1Method for manufacturing electronic device, electronic device, method for manufacturing electronic device package and electronic device packageKAWATA MASAKAZU·Filed 2010·Application pending·0 cites
- 1230US2011263095A1Temporary bonding adhesive for a semiconductor wafer and method for manufacturing a semiconductor device using the sameSUMITOMO BAKELITE CO·Filed 2010·Application pending·0 cites
- 1327US9399725B2Temporary bonding adhesive for a semiconductor wafer and method for manufacturing a semiconductor device using the sameTAKEUCHI ETSU·Filed 2010·Granted Jul 26, 2016·0 cites·23 claims
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