Inventor · disambiguated record
Francois Marion
Also filed as: MARION FRANCOIS · MARION FRANÇOIS
45 granted patents·8 pending applications·354 citations·filing 1990–2017
98Inventor score
Top patents by PatentIndex Score
53 records- 0179US8093728B2Connection by fitting together two soldered insertsMARION FRANCOIS·Filed 2009·Granted Jan 10, 2012·8 cites·4 claims
- 0276US8272556B2Metal lip seal and machine fitted with same sealMARION FRANCOIS·Filed 2010·Granted Sep 25, 2012·4 cites·10 claims
- 0376US6639928B2Optic device comprising a plurality of resonant cavities of different lengths associated with different wavelengthsCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2002·Granted Oct 28, 2003·13 cites·14 claims
- 0475US6566170B1Method for forming a device having a cavity with controlled atmosphereCOMMISSARIAT ENERGIE ATOMIQUE·Filed 1999·Granted May 20, 2003·49 cites·9 claims
- 0573US7717718B2Electric component having microtips and ductile conducting bumpsCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2005·Granted May 18, 2010·6 cites·17 claims
- 0672US6942396B2Method and device for the passive alignment of optical fibers and optoelectronic componentsCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2001·Granted Sep 13, 2005·24 cites·19 claims
- 0769US8898896B2Method of making a connection component with hollow insertsMARION FRANCOIS·Filed 2009·Granted Dec 2, 2014·4 cites·12 claims
- 0869US8097827B2Method for soldering two elements together using a solder materialMARION FRANCOIS·Filed 2008·Granted Jan 17, 2012·4 cites·6 claims
- 0968US7938311B2Method for hybridization of two components by using different sized solder protrusions and a device that uses two components hybridized according to this methodCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2006·Granted May 10, 2011·4 cites·4 claims
- 1067US9985067B2Method of manufacturing a plurality of island-shaped dipoles having self-aligned electrodesCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2016·Granted May 29, 2018·1 cites·8 claims
- 1167US8291586B2Method for bonding two electronic componentsMARION FRANCOIS·Filed 2010·Granted Oct 23, 2012·2 cites·5 claims
- 1267US7031578B2Method and device for passive alignment of optical waveguides and optoelectronic components and optical system using said deviceCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2001·Granted Apr 18, 2006·11 cites·12 claims
- 1367US6151173AAssembly of optical components optically aligned and method for making this assemblyCOMMISSARIAT ENERGIE ATOMIQUE·Filed 1997·Granted Nov 21, 2000·38 cites·10 claims
- 1463US9406662B2Flip-chip assembly process comprising pre-coating interconnect elementsCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2014·Granted Aug 2, 2016·3 cites·8 claims
- 1563US8058656B2Method for producing a matrix of individual electronic components and matrix produced therebyMARION FRANCOIS·Filed 2008·Granted Nov 15, 2011·2 cites·20 claims
- 1659US7772041B2Method of sealing or welding two elements to one anotherCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2008·Granted Aug 10, 2010·1 cites·6 claims
- 1759US6170155B1System of components to be hybridized and hybridization process allowing for thermal expansionsCOMMISSARIAT ENERGIE ATOMIQUE·Filed 1997·Granted Jan 9, 2001·25 cites·18 claims
- 1858US5591959ARadiation detection device having abutting detection elements and process for the production of said deviceCOMMISSARIAT ENERGIE ATOMIQUE·Filed 1994·Granted Jan 7, 1997·26 cites·6 claims
- 1957US8735819B2Detector system with an optical function and method for making such a systemFENDLER MANUEL·Filed 2009·Granted May 27, 2014·3 cites·15 claims
- 2054US7645686B2Method of bonding chips on a strained substrate and method of placing under strain a semiconductor reading circuitCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2008·Granted Jan 12, 2010·1 cites·6 claims
- 2152US5574285AElectromagnetic radiation detector and its production processCOMMISSARIAT ENERGIE ATOMIQUE·Filed 1995·Granted Nov 12, 1996·23 cites·14 claims
- 2252US2014075747A1Connecting component equipped with hollow insertsCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2013·Application pending·0 cites
- 2350US8252363B2Method of thinning a block transferred to a substrateMARION FRANCOIS·Filed 2009·Granted Aug 28, 2012·0 cites·10 claims
- 2449US6281039B1Hybrid device and a method of producing electrically active components by an assembly operationCOMMISSARIAT ENERGIE ATOMIQUE·Filed 1999·Granted Aug 28, 2001·12 cites·20 claims
- 2549US5119240AAssembly of parts forming an angle between them and process for obtaining said assemblyCOMMISSARIAT ENERGIE ATOMIQUE·Filed 1990·Granted Jun 2, 1992·20 cites·9 claims
- 2648US10002842B2Method of producing a hybridized device including microelectronic componentsCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2016·Granted Jun 19, 2018·0 cites·9 claims
- 2748US8168478B2Method for producing a matrix of individual electronic components and matrix produced therebyMARION FRANCOIS·Filed 2011·Granted May 1, 2012·0 cites·13 claims
- 2848US5496769AProcess for coating electronic components hybridized by bumps on a substrateCOMMISSARIAT ENERGIE ATOMIQUE·Filed 1994·Granted Mar 5, 1996·18 cites·3 claims
- 2947US2005213896A1Process and device for the passive alignment of supports, particularly plates comprising optical componentsMARION FRANCOIS·Filed 2005·Application pending·0 cites
- 3046US2011041332A1Connection component provided with inserts comprising compensating blocksCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2009·Application pending·0 cites
- 3145US9793141B2Hybrid electronic device protected against humidity and method of protecting a hybrid electronic device against humidityCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2017·Granted Oct 17, 2017·0 cites·9 claims
- 3245US5552596AThree-dimensional radiation detection device and process for the production of said device having elementary reading circuits hybridized by welding microbeadsCOMMISSARIAT ENERGIE ATOMIQUE·Filed 1995·Granted Sep 3, 1996·17 cites·10 claims
- 3344US9368473B2Assembly method, of the flip-chip type, for connecting two electronic components, assembly obtained by the methodCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2013·Granted Jun 14, 2016·0 cites·24 claims
- 3444US8329311B2Nanoprinted device comprising metallic patterns and method of nanoprinting metallic patternsMARION FRANCOIS·Filed 2005·Granted Dec 11, 2012·0 cites·10 claims
- 3544US7691735B2Method for manufacturing metal chips by plasma from a layer comprising several elementsCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2008·Granted Apr 6, 2010·0 cites·9 claims
- 3643US8664778B2Method of flip-chip hybridization for the forming of tight cavities and systems obtained by such a methodMARION FRANCOIS·Filed 2012·Granted Mar 4, 2014·0 cites·14 claims
- 3743US7524704B2Method for encapsulating a component, especially an electric or electronic component, by means of an improved solder seamCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2006·Granted Apr 28, 2009·0 cites·8 claims
- 3841US6741787B2Process and device for connection/disconnection of an optical fiber with an optoelectronic componentCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2002·Granted May 25, 2004·0 cites·22 claims
- 3940US7569940B2Method and device for connecting chipsCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2004·Granted Aug 4, 2009·0 cites·23 claims
- 4040US2005074203A1Device for multiplexing an array of optical channels, use for wavelength and add-drop multiplexingFiled 2002·Application pending·0 cites
- 4139US2003077050A1Method for passive alignment of supports, particularly plates bearing optical componentsFiled 2001·Application pending·0 cites
- 4238US9166338B2Connecting elements for producing hybrid electronic circuitsCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2013·Granted Oct 20, 2015·0 cites·4 claims
- 4338US5131584AMethod to interconnect electric components by means of solder elementsCOMMISSARIAT ENERGIE ATOMIQUE·Filed 1990·Granted Jul 21, 1992·11 cites·5 claims
- 4438US2001026969A1Hybrid device and a method of producing electrically active components by an assembly operationCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2001·Application pending·0 cites
- 4537US6166368APhotodetection device, process for the production of this device and application to multispectral detectionCOMMISSARIAT ENERGIE ATOMIQUE·Filed 1998·Granted Dec 26, 2000·7 cites·24 claims
- 4636US7759261B2Method for producing layers located on a hybrid circuitCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2004·Granted Jul 20, 2010·0 cites·7 claims
- 4735US2012120622A1Airtight assembly of two components and method for producing such an assemblyMARION FRANCOIS·Filed 2010·Application pending·0 cites
- 4831US5602385ATwo wave band radiation detector having two facing photodetectors and method for making sameCOMMISSARIAT ENERGIE ATOMIQUE·Filed 1994·Granted Feb 11, 1997·5 cites·11 claims
- 4931US5107078AElectric connection or disconnection element, integrated circuit including such elements and the corresponding connection or disconnection methodCOMMISSARIAT ENERGIE ATOMIQUE·Filed 1990·Granted Apr 21, 1992·4 cites·2 claims
- 5031US2021280628A1Method for connecting cross-components at optimised densityCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2017·Application pending·0 cites
Showing the top 50 of 53 patent records by PatentIndex Score.
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