Inventor · disambiguated record
Maria Cristina Estacio
Also filed as: ESTACIO MARIA C · ESTACIO MARIA C B · ESTACIO MARIA CRISTINA · ESTACIO MARIA CRISTINA B
50 granted patents·10 pending applications·1,096 citations·filing 2000–2025
98Inventor score
Files withFAIRCHILD SEMICONDUCTOR26SEMICONDUCTOR COMPONENTS IND LLC21JEON OSEOB2Nexperia BV2QUINONES MARIA CLEMENS Y2
Top patents by PatentIndex Score
60 records- 0197US7157799B2Semiconductor die package including carrier with mask and semiconductor dieFAIRCHILD SEMICONDUCTOR·Filed 2003·Granted Jan 2, 2007·131 cites·13 claims
- 0297US6645791B2Semiconductor die package including carrier with maskFAIRCHILD SEMICONDUCTOR·Filed 2001·Granted Nov 11, 2003·128 cites·18 claims
- 0396US6830959B2Semiconductor die package with semiconductor die having side electrical connectionFAIRCHILD SEMICONDUCTOR·Filed 2003·Granted Dec 14, 2004·120 cites·18 claims
- 0496US6806580B2Multichip module including substrate with an array of interconnect structuresFAIRCHILD SEMICONDUCTOR·Filed 2002·Granted Oct 19, 2004·102 cites·18 claims
- 0595US7838340B2Pre-molded clip structureFAIRCHILD SEMICONDUCTOR·Filed 2010·Granted Nov 23, 2010·17 cites·10 claims
- 0695US7315077B2Molded leadless package having a partially exposed lead frame padFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2004·Granted Jan 1, 2008·107 cites·27 claims
- 0794US8183088B2Semiconductor die package and method for making the sameJEON OSEOB·Filed 2010·Granted May 22, 2012·22 cites·14 claims
- 0894US6867489B1Semiconductor die package processable at the wafer levelFAIRCHILD SEMICONDUCTOR·Filed 2003·Granted Mar 15, 2005·93 cites·25 claims
- 0993US11791247B2Concealed gate terminal semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Oct 17, 2023·2 cites·20 claims
- 1092US6646329B2Power chip scale packageFAIRCHILD SEMICONDUCTOR INC·Filed 2001·Granted Nov 11, 2003·66 cites·8 claims
- 1191US11984424B2Semiconductor packages using package in package systems and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted May 14, 2024·2 cites·20 claims
- 1290US7768105B2Pre-molded clip structureFAIRCHILD SEMICONDUCTOR·Filed 2007·Granted Aug 3, 2010·15 cites·16 claims
- 1389US6870254B1Flip clip attach and copper clip attach on MOSFET deviceFAIRCHILD SEMICONDUCTOR·Filed 2000·Granted Mar 22, 2005·50 cites·8 claims
- 1489US6777786B2Semiconductor device including stacked dies mounted on a leadframeFAIRCHILD SEMICONDUCTOR·Filed 2001·Granted Aug 17, 2004·47 cites·6 claims
- 1588US2025372467A1Sic mosfet semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 1687US8664752B2Semiconductor die package and method for making the sameJEON OSEOB·Filed 2012·Granted Mar 4, 2014·9 cites·10 claims
- 1787US7052938B2Flip clip attach and copper clip attach on MOSFET deviceFAIRCHILD SEMICONDUCTOR·Filed 2005·Granted May 30, 2006·14 cites·8 claims
- 1887US2025140659A1Package including multiple semiconductor devicesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 1986US9536800B2Packaged semiconductor devices and methods of manufacturingFAIRCHILD SEMICONDUCTOR·Filed 2014·Granted Jan 3, 2017·8 cites·20 claims
- 2085US11088046B2Semiconductor device package with clip interconnect and dual side coolingSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Aug 10, 2021·3 cites·11 claims
- 2185US9177925B2Apparatus related to an improved package including a semiconductor dieFAIRCHILD SEMICONDUCTOR·Filed 2013·Granted Nov 3, 2015·7 cites·29 claims
- 2285US7638861B2Flip chip MLP with conductive inkFAIRCHILD SEMICONDUCTOR·Filed 2006·Granted Dec 29, 2009·14 cites·8 claims
- 2384US6617655B1MOSFET device with multiple gate contacts offset from gate contact area and over source areaFAIRCHILD SEMICONDUCTOR·Filed 2002·Granted Sep 9, 2003·63 cites·40 claims
- 2482US12417999B2Semiconductor packages using package in package systems and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Granted Sep 16, 2025·0 cites·20 claims
- 2582US8106501B2Semiconductor die package including low stress configurationQUINONES MARIA CLEMENS Y·Filed 2008·Granted Jan 31, 2012·10 cites·11 claims
- 2682US7972906B2Semiconductor die package including exposed connectionsFAIRCHILD SEMICONDUCTOR·Filed 2008·Granted Jul 5, 2011·10 cites·12 claims
- 2781US11621203B2SiC MOSFET semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Apr 4, 2023·2 cites·20 claims
- 2880US12142551B2Package including multiple semiconductor devicesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Nov 12, 2024·0 cites·20 claims
- 2979US2024363471A1Semiconductor device package with clip interconnect and dual side coolingSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 3078US12463103B2SiC MOSFET semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Nov 4, 2025·0 cites·20 claims
- 3178US8008759B2Pre-molded clip structureFAIRCHILD SEMICONDUCTOR·Filed 2010·Granted Aug 30, 2011·3 cites·17 claims
- 3276US12300583B2Concealed gate terminal semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted May 13, 2025·0 cites·20 claims
- 3375US6861286B2Method for making power chip scale packageFAIRCHILD SEMICONDUCTOR·Filed 2003·Granted Mar 1, 2005·18 cites·10 claims
- 3475US2025125297A1Submodule semiconductor packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 3574US11545421B2Package including multiple semiconductor devicesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Jan 3, 2023·0 cites·20 claims
- 3674US10319670B2Package including multiple semiconductor devicesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Jun 11, 2019·1 cites·18 claims
- 3774US9478519B2Package including a semiconductor die and a capacitive componentFAIRCHILD SEMICONDUCTOR·Filed 2015·Granted Oct 25, 2016·2 cites·19 claims
- 3874US2025233055A1Electronic device packaging with galvanic isolationSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 3972US11735508B2Vertical and horizontal circuit assembliesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Aug 22, 2023·0 cites·20 claims
- 4071US12205918B2Submodule semiconductor packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Jan 21, 2025·0 cites·20 claims
- 4170US12051635B2Semiconductor device package with clip interconnect and dual side coolingSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Jul 30, 2024·0 cites·17 claims
- 4269US8513059B2Pre-molded clip structureCRUZ ERWIN VICTOR·Filed 2011·Granted Aug 20, 2013·2 cites·10 claims
- 4369US7071033B2Method for forming semiconductor device including stacked diesFAIRCHILD SEMICONDUCTOR·Filed 2004·Granted Jul 4, 2006·13 cites·8 claims
- 4465US12278169B2Electronic device packaging with galvanic isolationSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Apr 15, 2025·0 cites·20 claims
- 4565US6649961B2Supporting gate contacts over source region on MOSFET devicesFAIRCHILD SEMICONDUCTOR·Filed 2002·Granted Nov 18, 2003·15 cites·46 claims
- 4664US2025105076A1Semiconductor package for a pcbNexperia BV·Filed 2024·Application pending·0 cites
- 4763US10910297B2Package including multiple semiconductor devicesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Feb 2, 2021·0 cites·20 claims
- 4859US11177203B2Vertical and horizontal circuit assembliesFAIRCHILD SEMICONDUCTOR·Filed 2019·Granted Nov 16, 2021·0 cites·22 claims
- 4958US11296069B2Substrate interposer on a leaderframeFAIRCHILD SEMICONDUCTOR·Filed 2020·Granted Apr 5, 2022·0 cites·16 claims
- 5055US10256178B2Vertical and horizontal circuit assembliesFAIRCHILD SEMICONDUCTOR·Filed 2017·Granted Apr 9, 2019·0 cites·20 claims
Showing the top 50 of 60 patent records by PatentIndex Score.
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