Inventor · disambiguated record
Koji Fujishima
Also filed as: FUJISHIMA KOJI
8 granted patents·1 pending application·94 citations·filing 2003–2016
87Inventor score
Files withRENESAS ELECTRONICS CORP3KANAOKA TAKU2RENESAS TECH CORP2HITACHI ULSI SYS CO LTD1SAKANISHI KOICHIRO1
Top patents by PatentIndex Score
9 records- 0193US7342302B2Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2006·Granted Mar 11, 2008·20 cites·31 claims
- 0292US7759804B2Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2008·Granted Jul 20, 2010·20 cites·4 claims
- 0389US7102223B1Semiconductor device and a method of manufacturing the sameHITACHI ULSI SYS CO LTD·Filed 2003·Granted Sep 5, 2006·38 cites·34 claims
- 0486US8183691B2Semiconductor device with pads overlapping wiring layers including dummy wiringKANAOKA TAKU·Filed 2010·Granted May 22, 2012·7 cites·9 claims
- 0581US8969929B2Power semiconductor device having gate electrode coupling portions for etchant controlSAKANISHI KOICHIRO·Filed 2011·Granted Mar 3, 2015·9 cites·20 claims
- 0657US10199338B2Semiconductor device and a method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2016·Granted Feb 5, 2019·0 cites·15 claims
- 0756US2014159245A1Semiconductor device and a method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 0852US8669659B2Semiconductor device and a method of manufacturing the sameKANAOKA TAKU·Filed 2012·Granted Mar 11, 2014·0 cites·19 claims
- 0942US9231082B2Power semiconductor device having gate electrode coupling portions for etchant controlRENESAS ELECTRONICS CORP·Filed 2015·Granted Jan 5, 2016·0 cites·6 claims
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