Inventor · disambiguated record
Masanori Shibamoto
Also filed as: SHIBAMOTO MASANORI
22 granted patents·3 pending applications·409 citations·filing 1996–2008
97Inventor score
Top patents by PatentIndex Score
25 records- 0194US6521981B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Feb 18, 2003·37 cites·18 claims
- 0294US6342728B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Jan 29, 2002·38 cites·12 claims
- 0392US6670215B2Semiconductor device and manufacturing method thereofRENESAS TECH CORP·Filed 2002·Granted Dec 30, 2003·28 cites·4 claims
- 0492US6472727B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Oct 29, 2002·31 cites·20 claims
- 0591US6342726B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 1999·Granted Jan 29, 2002·42 cites·9 claims
- 0686US6642083B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2002·Granted Nov 4, 2003·17 cites·10 claims
- 0785US6365439B2Method of manufacturing a ball grid array type semiconductor packageHITACHI LTD·Filed 2001·Granted Apr 2, 2002·17 cites·19 claims
- 0884US6404049B1Semiconductor device, manufacturing method thereof and mounting boardHITACHI LTD·Filed 1996·Granted Jun 11, 2002·59 cites·30 claims
- 0983US6355500B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Mar 12, 2002·14 cites·15 claims
- 1078US7477520B2Memory moduleELPIDA MEMORY INC·Filed 2006·Granted Jan 13, 2009·8 cites·17 claims
- 1171US6664135B2Method of manufacturing a ball grid array type semiconductor packageRENESAS TECH CORP·Filed 2002·Granted Dec 16, 2003·7 cites·16 claims
- 1270US6621160B2Semiconductor device and mounting boardHITACHI LTD·Filed 2002·Granted Sep 16, 2003·13 cites·1 claims
- 1369US6563212B2Semiconductor deviceHITACHI LTD·Filed 2002·Granted May 13, 2003·12 cites·2 claims
- 1468US7667317B2Semiconductor package with bypass capacitorELPIDA MEMORY INC·Filed 2007·Granted Feb 23, 2010·4 cites·17 claims
- 1568US6353255B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Mar 5, 2002·6 cites·7 claims
- 1668US6307269B1Semiconductor device with chip size packageHITACHI LTD·Filed 1998·Granted Oct 23, 2001·32 cites·23 claims
- 1767US7332800B2Semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted Feb 19, 2008·15 cites·13 claims
- 1867US6515371B2Semiconductor device with elastic structure and wiringHITACHI LTD·Filed 2001·Granted Feb 4, 2003·13 cites·8 claims
- 1965US7615870B2Semiconductor device, manufacturing method thereof, and connection method of circuit boardELPIDA MEMORY INC·Filed 2006·Granted Nov 10, 2009·3 cites·12 claims
- 2062US6355975B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Mar 12, 2002·4 cites·15 claims
- 2160US8203849B2Semiconductor device and manufacture method thereofSHIBAMOTO MASANORI·Filed 2007·Granted Jun 19, 2012·3 cites·16 claims
- 2257US6639323B2Semiconductor device and its manufacturing methodHITACHI LTD·Filed 2001·Granted Oct 28, 2003·6 cites·29 claims
- 2345US2008197509A1Semiconductor package having stacked semiconductor chipsELPIDA MEMORY INC·Filed 2008·Application pending·0 cites
- 2441US2007228580A1Semiconductor device having stacked structure and method of manufacturing the sameELPIDA MEMORY INC·Filed 2007·Application pending·0 cites
- 2537US2006249829A1Stacked type semiconductor deviceKATAGIRI MITSUAKI·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →