Inventor · disambiguated record
Shih-Hsun Hsu
Also filed as: HSU SHIH-HSUN
37 granted patents·7 pending applications·354 citations·filing 2002–2025
97Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD16TAIWAN SEMICONDUCTOR MFG10UNITED MICROELECTRONICS CORP4CHEN HSIEN-WEI3HSU SHIH-HSUN3
Top patents by PatentIndex Score
44 records- 0199US11302738B2Image sensor with improved quantum efficiency surface structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 12, 2022·6 cites·17 claims
- 0297US7235424B2Method and apparatus for enhanced CMP planarization using surrounded dummy designTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Jun 26, 2007·150 cites·16 claims
- 0396US11222913B2Image sensor device having first lens over a light-sensing region and surrounded by a grid layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 11, 2022·3 cites·20 claims
- 0495US11901390B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 13, 2024·2 cites·20 claims
- 0595US8125052B2Seal ring structure with improved cracking protectionJENG SHIN-PUU·Filed 2007·Granted Feb 28, 2012·42 cites·18 claims
- 0693US10283548B1CMOS sensors and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 7, 2019·9 cites·20 claims
- 0792US7646078B2Die saw crack stopperTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Jan 12, 2010·25 cites·17 claims
- 0891US11189657B2Image sensor with improved quantum efficiency surface structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 30, 2021·2 cites·20 claims
- 0991US10665627B2Image sensor device and method for forming the image sensor device having a first lens and a second lens over the first lensTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 26, 2020·5 cites·19 claims
- 1091US10644060B2Image sensor with high quantum efficiency surface structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 5, 2020·6 cites·20 claims
- 1189US7679384B2Parametric testline with increased test pattern areasTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Mar 16, 2010·12 cites·20 claims
- 1287US8772137B2Semiconductor wafer with assisting dicing structure and dicing method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 8, 2014·7 cites·12 claims
- 1383US12364049B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
- 1483US2025267959A1Image sensor with high quantum efficiency surface structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1582US2025311466A1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1681US9601443B2Test structure for seal ring quality monitorTSAI HAO-YI·Filed 2007·Granted Mar 21, 2017·8 cites·20 claims
- 1779US7692274B2Reinforced semiconductor structuresTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Apr 6, 2010·6 cites·20 claims
- 1879US7538346B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted May 26, 2009·5 cites·11 claims
- 1978US11791356B2Image sensor device having a first lens and a second lens over the first lensTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 17, 2023·0 cites·20 claims
- 2077US12324258B2Image sensor with improved quantum efficiency surface structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 3, 2025·0 cites·20 claims
- 2177US8629532B2Semiconductor wafer with assisting dicing structure and dicing method thereofCHEN HSIEN-WEI·Filed 2007·Granted Jan 14, 2014·6 cites·8 claims
- 2276US7714443B2Pad structure design with reduced densityTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted May 11, 2010·7 cites·20 claims
- 2375US8643147B2Seal ring structure with improved cracking protection and reduced problemsJENG SHIN-PUU·Filed 2007·Granted Feb 4, 2014·6 cites·13 claims
- 2474US8227917B2Bond pad design for fine pitch wire bondingHSU SHIH-HSUN·Filed 2007·Granted Jul 24, 2012·7 cites·11 claims
- 2569US8072076B2Bond pad structures and integrated circuit chip having the sameHSU SHIH-HSUN·Filed 2006·Granted Dec 6, 2011·6 cites·10 claims
- 2669US7884473B2Method and structure for increased wire bond density in packages for semiconductor chipsTAIWAN SEMICONDUCTOR MFG CO INC·Filed 2007·Granted Feb 8, 2011·4 cites·20 claims
- 2766US8749020B2Metal e-fuse structure designCHEN HSIEN-WEI·Filed 2007·Granted Jun 10, 2014·3 cites·24 claims
- 2865US8519512B2Test line placement to improve die sawing qualityTSAI HAO-YI·Filed 2006·Granted Aug 27, 2013·2 cites·18 claims
- 2965US8125233B2Parametric testline with increased test pattern areasCHEN HSIEN-WEI·Filed 2010·Granted Feb 28, 2012·1 cites·20 claims
- 3064US8993355B2Test line placement to improve die sawing qualityTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 31, 2015·1 cites·16 claims
- 3164US6660627B2Method for planarization of wafers with high selectivitiesUNITED MICROELECTRONICS CORP·Filed 2002·Granted Dec 9, 2003·9 cites·24 claims
- 3259US2023387158A1Embedded light shield structure for cmos image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3358US11177308B2CMOS sensors and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 16, 2021·0 cites·20 claims
- 3458US7834351B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Nov 16, 2010·0 cites·7 claims
- 3555US6797190B2Wafer carrier assembly for a chemical mechanical polishing apparatus and a polishing method using the sameUNITED MICROELECTRONICS CORP·Filed 2003·Granted Sep 28, 2004·5 cites·3 claims
- 3655US6638391B1Wafer carrier assembly for a chemical mechanical polishing apparatus and a polishing method using the sameUNITED MICROELECTRONICS CORP·Filed 2002·Granted Oct 28, 2003·5 cites·14 claims
- 3752US12021099B2Embedded light shield structure for CMOS image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 25, 2024·0 cites·20 claims
- 3850US6709544B2Chemical mechanical polishing equipmentUNITED MICROELECTRONICS CORP·Filed 2002·Granted Mar 23, 2004·4 cites·20 claims
- 3948US10522585B2Method for manufacturing CMOS image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 31, 2019·0 cites·20 claims
- 4043US2008246031A1PCM pad design for peeling preventionTSAI HAO-YI·Filed 2007·Application pending·0 cites
- 4142US2008277659A1Test structure for semiconductor chipHSU SHIH-HSUN·Filed 2007·Application pending·0 cites
- 4240US12155258B2Method for controlling power suppliesLU CHIH CHERNG·Filed 2021·Granted Nov 26, 2024·0 cites·8 claims
- 4339US2006125059A1Semiconductor wafer with protection structure against damage during a die separation processTAIWAN SEMICONDUCTOR MFG·Filed 2004·Application pending·0 cites
- 4436US2021018571A1Method for controlling power suppliesCHEN TE LUNG·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →