Inventor · disambiguated record
Hsin-Yi Liao
Also filed as: LIAO HSIN-YI
21 granted patents·5 pending applications·66 citations·filing 2010–2020
93Inventor score
Files withSILICONWARE PRECISION INDUSTRIES CO LTD10CHANG CHIANG-CHENG4CHANG HONG-DA3CHIU CHI-HSIN2HUANG CHUN-AN2
Top patents by PatentIndex Score
26 records- 0192US8420430B2Fabrication method of package structure having MEMS elementCHIU CHI-HSIN·Filed 2010·Granted Apr 16, 2013·17 cites·9 claims
- 0289US9040361B2Chip scale package with electronic component received in encapsulant, and fabrication method thereofCHANG CHIANG-CHENG·Filed 2010·Granted May 26, 2015·13 cites·23 claims
- 0385US9133021B2Wafer level package having a pressure sensor and fabrication method thereofCHANG HONG-DA·Filed 2011·Granted Sep 15, 2015·9 cites·8 claims
- 0485US8399940B2Package structure having MEMS elements and fabrication method thereofLIN CHEN-HAN·Filed 2011·Granted Mar 19, 2013·8 cites·24 claims
- 0576US8334174B2Chip scale package and fabrication method thereofCHANG CHIANG-CHENG·Filed 2010·Granted Dec 18, 2012·6 cites·9 claims
- 0674US8610272B2Package structure with micro-electromechanical element and manufacturing method thereofHUANG CHUN-AN·Filed 2010·Granted Dec 17, 2013·4 cites·7 claims
- 0772US8716070B2Fabrication method of package structure having MEMS elementSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted May 6, 2014·2 cites·26 claims
- 0865US9487393B2Fabrication method of wafer level package having a pressure sensorSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Nov 8, 2016·1 cites·8 claims
- 0965US8766456B2Method of fabricating a semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Granted Jul 1, 2014·2 cites·20 claims
- 1065US8525324B2Semiconductor package and method of fabricating the sameCHANG HONG-DA·Filed 2012·Granted Sep 3, 2013·1 cites·18 claims
- 1163US8866236B2Package structure having MEMS elementCHIU CHI-HSIN·Filed 2010·Granted Oct 21, 2014·1 cites·14 claims
- 1258US9254994B2Package structure having MEMS elementSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Feb 9, 2016·0 cites·13 claims
- 1356US8829672B2Semiconductor package, package structure and fabrication method thereofCHEN YAN-HENG·Filed 2012·Granted Sep 9, 2014·1 cites·14 claims
- 1455US8633048B2Method for fabricating package structure having MEMS elementsLIN CHEN-HAN·Filed 2011·Granted Jan 21, 2014·1 cites·16 claims
- 1552US11195812B2Method for fabricating an encapsulated electronic package using a supporting plateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Dec 7, 2021·0 cites·10 claims
- 1652US9117698B2Fabrication method of semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Aug 25, 2015·0 cites·11 claims
- 1752US8741693B2Method for manufacturing package structure with micro-electromechanical elementSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Jun 3, 2014·0 cites·13 claims
- 1846US11114412B2Electronic package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2019·Granted Sep 7, 2021·0 cites·20 claims
- 1944US11508739B2Method of manufacturing memory structurePOWERCHIP SEMICONDUCTOR MFG CORP·Filed 2020·Granted Nov 22, 2022·0 cites·20 claims
- 2040US8878356B2Package structure having micro-electro-mechanical system element and method of fabrication the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Granted Nov 4, 2014·0 cites·38 claims
- 2137US2012086117A1Package with embedded chip and method of fabricating the sameCHANG CHIANG-CHENG·Filed 2010·Application pending·0 cites
- 2237US2012313243A1Chip-scale packageCHANG CHIANG-CHENG·Filed 2011·Application pending·0 cites
- 2336US2014117537A1Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Application pending·0 cites
- 2436US2014042638A1Semiconductor package and method of fabricating the sameSILICONWARE PREC IND CO L·Filed 2012·Application pending·0 cites
- 2534US8288189B2Package structure having MEMS element and fabrication method thereofHUANG CHUN-AN·Filed 2010·Granted Oct 16, 2012·0 cites·19 claims
- 2633US2013320463A1Package structure having mems element and fabrication method thereofCHANG HONG-DA·Filed 2012·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Hsin-Yi Liao files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →