Inventor · disambiguated record
Cheng-Hsiang Liu
Also filed as: LIU CHENG · LIU CHENG-HSIANG
5 granted patents·5 pending applications·3 citations·filing 2006–2023
64Inventor score
Files withSILICONWARE PRECISION INDUSTRIES CO LTD2WINBOND ELECTRONICS CORP2YUAN YINGJIN2CHANG HONG-DA1IND TECH RES INST1
Top patents by PatentIndex Score
10 records- 0157US9636627B2Method for recovering ethylene during the process for producing VAC and a device thereofYUAN YINGJIN·Filed 2012·Granted May 2, 2017·2 cites·4 claims
- 0255US8633048B2Method for fabricating package structure having MEMS elementsLIN CHEN-HAN·Filed 2011·Granted Jan 21, 2014·1 cites·16 claims
- 0355US2025054807A1Method for reducing wafer edge defectsWINBOND ELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 0454US2023312456A1Vinyl acetate production process and deviceUNIV TIANJIN·Filed 2021·Application pending·0 cites
- 0544US10201086B2Electronic deviceSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Feb 5, 2019·0 cites·6 claims
- 0641US11152270B2Monitoring structure for critical dimension of lithography processWINBOND ELECTRONICS CORP·Filed 2019·Granted Oct 19, 2021·0 cites·20 claims
- 0740US8878356B2Package structure having micro-electro-mechanical system element and method of fabrication the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Granted Nov 4, 2014·0 cites·38 claims
- 0839US2007131554A1Multi-sample microfluidic dielectrophoresis separating device and method thereofIND TECH RES INST·Filed 2006·Application pending·0 cites
- 0933US2013320463A1Package structure having mems element and fabrication method thereofCHANG HONG-DA·Filed 2012·Application pending·0 cites
- 1030US2014303398A1Method for producing vinyl acetateYUAN YINGJIN·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →