Inventor · disambiguated record
Abram Castro
Also filed as: CASTRO ABRAM · CASTRO ABRAM M · CASTRO ABRAM MARC
38 granted patents·14 pending applications·672 citations·filing 1995–2022
97Inventor score
Files withTEXAS INSTRUMENTS INC34SUBSTRATE TECHNOLOGIES INC5GALLEGOS BERNARDO3CASTRO ABRAM M2GERBER MARK A2
Top patents by PatentIndex Score
52 records- 0198US7898083B2Method for low stress flip-chip assembly of fine-pitch semiconductor devicesTEXAS INSTRUMENTS INC·Filed 2009·Granted Mar 1, 2011·101 cites·15 claims
- 0298US7390700B2Packaged system of semiconductor chips having a semiconductor interposerTEXAS INSTRUMENTS INC·Filed 2006·Granted Jun 24, 2008·69 cites·6 claims
- 0393US6300165B2Ball grid substrate for lead-on-chip semiconductor packageSUBSTRATE TECHNOLOGIES INC·Filed 2001·Granted Oct 9, 2001·68 cites·19 claims
- 0491US9305869B1Packaged semiconductor device having leadframe features as pressure valves against delaminationTEXAS INSTRUMENTS INC·Filed 2014·Granted Apr 5, 2016·13 cites·23 claims
- 0591US8133761B2Packaged system of semiconductor chips having a semiconductor interposerGERBER MARK A·Filed 2009·Granted Mar 13, 2012·19 cites·2 claims
- 0690US7573139B2Packed system of semiconductor chips having a semiconductor interposerTEXAS INSTRUMENTS INC·Filed 2008·Granted Aug 11, 2009·16 cites·4 claims
- 0790US5650593AThermally enhanced chip carrier packageAMKOR ELECTRONICS INC·Filed 1995·Granted Jul 22, 1997·126 cites·31 claims
- 0888US7569918B2Semiconductor package-on-package system including integrated passive componentsTEXAS INSTRUMENTS INC·Filed 2006·Granted Aug 4, 2009·14 cites·16 claims
- 0988US6107683ASequentially built integrated circuit packageSUBSTRATE TECHNOLOGIES INC·Filed 1998·Granted Aug 22, 2000·106 cites·12 claims
- 1086US9524926B2Packaged device with additive substrate surface modificationTEXAS INSTRUMENTS INC·Filed 2015·Granted Dec 20, 2016·4 cites·3 claims
- 1185US9214440B1Method for preventing die pad delaminationTEXAS INSTRUMENTS INC·Filed 2014·Granted Dec 15, 2015·6 cites·20 claims
- 1284US10566276B2Packaged semiconductor system having unidirectional connections to discrete componentsTEXAS INSTRUMENTS INC·Filed 2017·Granted Feb 18, 2020·2 cites·20 claims
- 1384US9780017B2Packaged device with additive substrate surface modificationTEXAS INSTRUMENTS INC·Filed 2016·Granted Oct 3, 2017·3 cites·20 claims
- 1484US6534861B1Ball grid substrate for lead-on-chip semiconductor packageSUBSTRATE TECHNOLOGIES INC·Filed 1999·Granted Mar 18, 2003·58 cites·23 claims
- 1576US11495524B2QFN device having a mechanism that enables an inspectable solder joint when attached to a PWB and method of making sameTEXAS INSTRUMENTS INC·Filed 2019·Granted Nov 8, 2022·2 cites·21 claims
- 1672US6801438B1Electrical circuit and method of formationTOUCH FUTURE TECHNOLOCY LTD·Filed 2000·Granted Oct 5, 2004·23 cites·10 claims
- 1771US11830793B2Multi-lead adapterTEXAS INSTRUMENTS INC·Filed 2021·Granted Nov 28, 2023·0 cites·18 claims
- 1870US9129955B2Semiconductor flip-chip system having oblong connectors and reduced trace pitchesCASTRO ABRAM M·Filed 2009·Granted Sep 8, 2015·4 cites·17 claims
- 1969US12087673B2QFN device having a mechanism that enables an inspectable solder joint when attached to a PWB and method of making sameTEXAS INSTRUMENTS INC·Filed 2022·Granted Sep 10, 2024·0 cites·20 claims
- 2069US11552005B2Integrated circuit package electronic deviceTEXAS INSTRUMENTS INC·Filed 2021·Granted Jan 10, 2023·0 cites·15 claims
- 2169US10199348B2Plastic-packaged semiconductor device having wires with polymerized insulating layerTEXAS INSTRUMENTS INC·Filed 2016·Granted Feb 5, 2019·1 cites·16 claims
- 2266US11854947B2Integrated circuit chip with a vertical connectorTEXAS INSTRUMENTS INC·Filed 2020·Granted Dec 26, 2023·0 cites·20 claims
- 2366US8530360B2Method for low stress flip-chip assembly of fine-pitch semiconductor devicesCASTRO ABRAM M·Filed 2011·Granted Sep 10, 2013·2 cites·13 claims
- 2465US9875930B2Method of packaging a circuitTEXAS INSTRUMENTS INC·Filed 2014·Granted Jan 23, 2018·1 cites·17 claims
- 2564US10756013B2Packaged semiconductor system having unidirectional connections to discrete componentsTEXAS INSTRUMENTS INC·Filed 2020·Granted Aug 25, 2020·0 cites·19 claims
- 2659US11177195B2Multi-lead adapterTEXAS INSTRUMENTS INC·Filed 2019·Granted Nov 16, 2021·0 cites·19 claims
- 2758US11838004B2Acoustic device package and method of makingTEXAS INSTRUMENTS INC·Filed 2019·Granted Dec 5, 2023·0 cites·17 claims
- 2857US11088052B2Integrated circuit package electronic device including pillar contacts and electrical terminationsTEXAS INSTRUMENTS INC·Filed 2018·Granted Aug 10, 2021·0 cites·15 claims
- 2957US9378984B2Packaging a semiconductor device having wires with polymerized insulator skinTEXAS INSTRUMENTS INC·Filed 2014·Granted Jun 28, 2016·0 cites·8 claims
- 3057US6501168B1Substrate for an integrated circuit packageSUBSTRATE TECHNOLOGIES INC·Filed 1999·Granted Dec 31, 2002·20 cites·19 claims
- 3155US2008315387A1Semiconductor Package-on-Package System Including Integrated Passive ComponentsTEXAS INSTRUMENTS INC·Filed 2008·Application pending·0 cites
- 3253US10347508B2Printed adhesion deposition to mitigate integrated circuit delaminationTEXAS INSTRUMENTS INC·Filed 2017·Granted Jul 9, 2019·0 cites·13 claims
- 3352US10284172B2Acoustic device package and method of makingTEXAS INSTRUMENTS INC·Filed 2015·Granted May 7, 2019·0 cites·16 claims
- 3452US9536781B2Method of making integrated circuitTEXAS INSTRUMENTS INC·Filed 2015·Granted Jan 3, 2017·0 cites·12 claims
- 3552US2013277816A1Plastic-packaged semiconductor device having wires with polymerized insulator skinTEXAS INSTRUMENTS INC·Filed 2013·Application pending·0 cites
- 3651US10804185B2Integrated circuit chip with a vertical connectorTEXAS INSTRUMENTS INC·Filed 2015·Granted Oct 13, 2020·0 cites·18 claims
- 3751US9142472B2Integrated circuit and method of makingGALLEGOS BERNARDO·Filed 2012·Granted Sep 22, 2015·0 cites·8 claims
- 3850US10727085B2Printed adhesion deposition to mitigate integrated circuit package delaminationTEXAS INSTRUMENTS INC·Filed 2015·Granted Jul 28, 2020·0 cites·17 claims
- 3949US9601414B2Method for preventing die pad delaminationTEXAS INSTRUMENTS INC·Filed 2015·Granted Mar 21, 2017·0 cites·19 claims
- 4048US2013075928A1Integrated circuit and method of makingGALLEGOS BERNARDO·Filed 2012·Application pending·0 cites
- 4147US2010084755A1Semiconductor Chip Package System Vertical InterconnectGERBER MARK ALLEN·Filed 2008·Application pending·0 cites
- 4246US6248612B1Method for making a substrate for an integrated circuit packageSUBSTRATE TECHNOLOGIES INC·Filed 1999·Granted Jun 19, 2001·14 cites·20 claims
- 4346US2015371963A1Semiconductor device having non-circular connectorsTEXAS INSTRUMENTS INC·Filed 2015·Application pending·0 cites
- 4446US2013075894A1Integrated circuit and method of makingGALLEGOS BERNARDO·Filed 2012·Application pending·0 cites
- 4545US2008258286A1High Input/Output, Low Profile Package-On-Package Semiconductor SystemTEXAS INSTRUMENTS INC·Filed 2007·Application pending·0 cites
- 4642US2013277825A1Method for Preventing Corrosion of Copper-Aluminum Intermetallic CompoundsTEXAS INSTRUMENTS INC·Filed 2013·Application pending·0 cites
- 4741US2007170571A1Low profile semiconductor system having a partial-cavity substrateGERBER MARK A·Filed 2006·Application pending·0 cites
- 4841US2003183418A1Electrical circuit and method of formationFiled 2003·Application pending·0 cites
- 4940US2020035577A1Packaged integrated circuitTEXAS INSTRUMENTS INC·Filed 2018·Application pending·0 cites
- 5040US2003132518A1Ball grid substrate for lead-on-chip semiconductor packageFiled 2003·Application pending·0 cites
Showing the top 50 of 52 patent records by PatentIndex Score.
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