Inventor · disambiguated record
Milind Weling
Also filed as: WELING MILIND · WELING MILIND G · WELING MILIND GANESH
55 granted patents·4 pending applications·1,460 citations·filing 1992–2015
99Inventor score
Files withVLSI TECHNOLOGY INC34INTERMOLECULAR INC7KONINKL PHILIPS ELECTRONICS NV5PHILIPS ELECTRONICS NA3HUCKABAY JUDY2
Top patents by PatentIndex Score
59 records- 0195US9231203B1Doped narrow band gap nitrides for embedded resistors of resistive random access memory cellsINTERMOLECULAR INC·Filed 2014·Granted Jan 5, 2016·14 cites·20 claims
- 0295US7856613B1Method for self-aligned doubled patterning lithographyCADENCE DESIGN SYSTEMS INC·Filed 2008·Granted Dec 21, 2010·31 cites·15 claims
- 0393US9224951B1Current-limiting electrodesINTERMOLECULAR INC·Filed 2014·Granted Dec 29, 2015·11 cites·20 claims
- 0492US5420796AMethod of inspecting planarity of wafer surface after etchback step in integrated circuit fabricationVLSI TECHNOLOGY INC·Filed 1993·Granted May 30, 1995·141 cites·19 claims
- 0590US9246094B2Stacked bi-layer as the low power switchable RRAMINTERMOLECULAR INC·Filed 2013·Granted Jan 26, 2016·8 cites·19 claims
- 0690US6193860B1Method and apparatus for improved copper plating uniformity on a semiconductor wafer using optimized electrical currentsVLSI TECHNOLGY INC·Filed 1999·Granted Feb 27, 2001·79 cites·24 claims
- 0789US8981332B2Nonvolatile resistive memory element with an oxygen-gettering layerINTERMOLECULAR INC·Filed 2013·Granted Mar 17, 2015·10 cites·10 claims
- 0889US6214734B1Method of using films having optimized optical properties for chemical mechanical polishing endpoint detectionVLSI TECHNOLOGY INC·Filed 1998·Granted Apr 10, 2001·87 cites·26 claims
- 0987US5757502AMethod and a system for film thickness sample assisted surface profilometryVLSI TECHNOLOGY INC·Filed 1996·Granted May 26, 1998·66 cites·16 claims
- 1087US5639697ADummy underlayers for improvement in removal rate consistency during chemical mechanical polishingVLSI TECHNOLOGY INC·Filed 1996·Granted Jun 17, 1997·73 cites·8 claims
- 1185US6569757B1Methods for forming co-axial interconnect lines in a CMOS process for high speed applicationsPHILIPS ELECTRONICS NA·Filed 1999·Granted May 27, 2003·74 cites·18 claims
- 1285US5953612ASelf-aligned silicidation technique to independently form silicides of different thickness on a semiconductor deviceVLSI TECHNOLOGY INC·Filed 1997·Granted Sep 14, 1999·63 cites·24 claims
- 1384US5861342AOptimized structures for dummy fill mask designVLSI TECHNOLOGY INC·Filed 1995·Granted Jan 19, 1999·75 cites·19 claims
- 1483US8679981B1Method for self-aligned doubled patterning lithographyWELING MILIND·Filed 2010·Granted Mar 25, 2014·6 cites·10 claims
- 1583US6139428AConditioning ring for use in a chemical mechanical polishing machineVSLI TECHNOLOGY INC·Filed 1996·Granted Oct 31, 2000·60 cites·14 claims
- 1681US6545338B1Methods for implementing co-axial interconnect lines in a CMOS process for high speed RF and microwave applicationsKONINKL PHILIPS ELECTRONICS NV·Filed 1999·Granted Apr 8, 2003·63 cites·5 claims
- 1780US8716135B1Method of eliminating a lithography operationHUCKABAY JUDY·Filed 2008·Granted May 6, 2014·6 cites·25 claims
- 1879US5540958AMethod of making microscope probe tipsVLSI TECHNOLOGY INC·Filed 1994·Granted Jul 30, 1996·42 cites·18 claims
- 1978US6387720B1Waveguide structures integrated with standard CMOS circuitry and methods for making the samePHILLIPS ELECTRONICS NORTH AME·Filed 1999·Granted May 14, 2002·51 cites·15 claims
- 2076US6572439B1Customized polishing pad for selective process performance during chemical mechanical polishingKONINKL PHILIPS ELECTRONICS NV·Filed 2000·Granted Jun 3, 2003·15 cites·10 claims
- 2176US5522957AMethod for leak detection in etching chambersVLSI TECHNOLOGY INC·Filed 1993·Granted Jun 4, 1996·28 cites·7 claims
- 2275US5653622AChemical mechanical polishing system and method for optimization and control of film removal uniformityVLSI TECHNOLOGY INC·Filed 1995·Granted Aug 5, 1997·38 cites·8 claims
- 2374US6380092B1Gas phase planarization process for semiconductor wafersVLSI TECHNOLOGY INC·Filed 2000·Granted Apr 30, 2002·13 cites·20 claims
- 2472US8912518B2Resistive random access memory cells having doped current limiting layersINTERMOLECULAR INC·Filed 2012·Granted Dec 16, 2014·4 cites·20 claims
- 2571US6319796B1Manufacture of an integrated circuit isolation structureVLSI TECHNOLOGY INC·Filed 1999·Granted Nov 20, 2001·44 cites·27 claims
- 2670US8656321B1Method of eliminating a lithography operationHUCKABAY JUDY·Filed 2011·Granted Feb 18, 2014·2 cites·12 claims
- 2770US5399533AMethod improving integrated circuit planarization during etchbackVLSI TECHNOLOGY INC·Filed 1993·Granted Mar 21, 1995·41 cites·15 claims
- 2868US9331276B2Nonvolatile resistive memory element with an oxygen-gettering layerINTERMOLECULAR INC·Filed 2015·Granted May 3, 2016·2 cites·20 claims
- 2965US5952241AMethod and apparatus for improving alignment for metal masking in conjuction with oxide and tungsten CMPVLSI TECHNOLOGY INC·Filed 1997·Granted Sep 14, 1999·24 cites·30 claims
- 3065US5378318APlanarizationVLSI TECHNOLOGY INC·Filed 1992·Granted Jan 3, 1995·33 cites·50 claims
- 3164US8440569B2Method of eliminating a lithography operationWELING MILIND·Filed 2007·Granted May 14, 2013·2 cites·13 claims
- 3263US6267076B1Gas phase planarization process for semiconductor wafersVLSI TECHNOLOGY INC·Filed 2000·Granted Jul 31, 2001·6 cites·32 claims
- 3362US5618757AMethod for improving the manufacturability of the spin-on glass etchback processVLSI TECHNOLOGY INC·Filed 1996·Granted Apr 8, 1997·27 cites·12 claims
- 3460US5965941AUse of dummy underlayers for improvement in removal rate consistency during chemical mechanical polishingVLSI TECHNOLOGY INC·Filed 1996·Granted Oct 12, 1999·21 cites·6 claims
- 3554US6057245AGas phase planarization process for semiconductor wafersVLSI TECHNOLOGY INC·Filed 1999·Granted May 2, 2000·14 cites·15 claims
- 3653US6315645B1Patterned polishing pad for use in chemical mechanical polishing of semiconductor wafersVLSI TECHNOLOGY INC·Filed 1999·Granted Nov 13, 2001·16 cites·16 claims
- 3753US6242805B1Method of using a polish stop film to control dishing during copper chemical mechanical polishingVLSI TECHNOLOGY INC·Filed 1999·Granted Jun 5, 2001·15 cites·7 claims
- 3853US6114246AMethod of using a polish stop film to control dishing during copper chemical mechanical polishingVLSI TECHNOLOGY INC·Filed 1999·Granted Sep 5, 2000·15 cites·8 claims
- 3953US6028013AMoisture repellant integrated circuit dielectric material combinationVLSI TECHNOLOGY INC·Filed 1999·Granted Feb 22, 2000·17 cites·14 claims
- 4051US5783488AOptimized underlayer structures for maintaining chemical mechanical polishing removal ratesVLSI TECHNOLOGY INC·Filed 1996·Granted Jul 21, 1998·14 cites·19 claims
- 4150US6916525B2Method of using films having optimized optical properties for chemical mechanical polishing endpoint detectionKONINKL PHILIPS ELECTRONICS NV·Filed 2003·Granted Jul 12, 2005·2 cites·4 claims
- 4250US6649253B1Method of using films having optimized optical properties for chemical mechanical polishing endpoint detectionKONINKL PHILIPS ELECTRONICS NV·Filed 2000·Granted Nov 18, 2003·2 cites·8 claims
- 4349US6372522B1Use of optimized film stacks for increasing absorption for laser repair of fuse linksVLSI TECHNOLOGY INC·Filed 2000·Granted Apr 16, 2002·3 cites·6 claims
- 4449US6013558ASilicon-enriched shallow trench oxide for reduced recess during LDD spacer etchVLSI TECHNOLOGY INC·Filed 1997·Granted Jan 11, 2000·15 cites·5 claims
- 4549US5496774AMethod improving integrated circuit planarization during etchbackVLSI TECHNOLOGY INC·Filed 1994·Granted Mar 5, 1996·17 cites·10 claims
- 4646US6274940B1Semiconductor wafer, a chemical-mechanical alignment mark, and an apparatus for improving alignment for metal masking in conjunction with oxide and tungsten CMPVLSI TECHNOLOGY INC·Filed 1999·Granted Aug 14, 2001·10 cites·16 claims
- 4744US6353261B1Method and apparatus for reducing interconnect resistance using an interconnect wellVLSI TECHNOLOGY INC·Filed 1999·Granted Mar 5, 2002·11 cites·6 claims
- 4843US6034434AOptimized underlayer structures for maintaining chemical mechanical polishing removal ratesVLSI TECHNOLOGY INC·Filed 1998·Granted Mar 7, 2000·9 cites·10 claims
- 4942US6196900B1Ultrasonic transducer slurry dispenserVLSI TECHNOLOGY INC·Filed 1999·Granted Mar 6, 2001·9 cites·12 claims
- 5042US6022265AComplementary material conditioning system for a chemical mechanical polishing machineVLSI TECHNOLOGY INC·Filed 1998·Granted Feb 8, 2000·10 cites·15 claims
Showing the top 50 of 59 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →