Inventor · disambiguated record
Sandeep Ahuja
Also filed as: AHUJA SANDEEP
29 granted patents·24 pending applications·305 citations·filing 2000–2025
95Inventor score
Top patents by PatentIndex Score
53 records- 0197US7742299B2Piezo fans for cooling an electronic deviceINTEL CORP·Filed 2008·Granted Jun 22, 2010·68 cites·19 claims
- 0294US9257364B2Integrated heat spreader that maximizes heat transfer from a multi-chip packageAHUJA SANDEEP·Filed 2012·Granted Feb 9, 2016·34 cites·19 claims
- 0393US9646910B2Integrated heat spreader that maximizes heat transfer from a multi-chip packageINTEL CORP·Filed 2016·Granted May 9, 2017·13 cites·21 claims
- 0493US7042727B2Heat sink mounting and interface mechanism and method of assembling sameINTEL CORP·Filed 2003·Granted May 9, 2006·90 cites·9 claims
- 0592US6943324B2Combination heating system for a cooking applianceMAYTAG CORP·Filed 2003·Granted Sep 13, 2005·46 cites·11 claims
- 0691US10275001B2Thermal throttling of electronic devicesINTEL CORP·Filed 2015·Granted Apr 30, 2019·15 cites·16 claims
- 0786US7751189B2Cooling arrangement to cool components on circuit boardINTEL CORP·Filed 2007·Granted Jul 6, 2010·15 cites·13 claims
- 0884US8260474B2Sensor-based thermal specification enabling a real-time metric for complianceAHUJA SANDEEP·Filed 2009·Granted Sep 4, 2012·11 cites·16 claims
- 0976US12131977B2Electronic systems with inverted circuit board with heat sink to chassis attachmentINTEL CORP·Filed 2023·Granted Oct 29, 2024·0 cites·20 claims
- 1073US8538598B2Power and thermal optimization of processor and coolingSTEINBRECHER ROBIN A·Filed 2010·Granted Sep 17, 2013·5 cites·19 claims
- 1172US10248173B2Determining thermal margins in a multi-die processorINTEL CORP·Filed 2016·Granted Apr 2, 2019·2 cites·14 claims
- 1270US11137807B2System, apparatus and method for controllable processor configuration based on a temperature specificationINTEL CORP·Filed 2018·Granted Oct 5, 2021·1 cites·20 claims
- 1368US9116050B2Sensor-based thermal specification enabling a real-time metric for complianceAHUJA SANDEEP·Filed 2012·Granted Aug 25, 2015·2 cites·20 claims
- 1466US10877530B2Apparatus and method to provide a thermal parameter report for a multi-chip packageINTEL CORP·Filed 2015·Granted Dec 29, 2020·1 cites·20 claims
- 1565US12453054B2Cooling assembly with strap element to diminish lateral movement of cooling mass during installation of the cooling massINTEL CORP·Filed 2022·Granted Oct 21, 2025·0 cites·20 claims
- 1663US11842943B2Electronic systems with inverted circuit board with heat sink to chassis attachmentINTEL CORP·Filed 2020·Granted Dec 12, 2023·0 cites·22 claims
- 1762US9494996B2Processor having frequency of operation information for guaranteed operation under high temperature eventsINTEL CORP·Filed 2013·Granted Nov 15, 2016·1 cites·22 claims
- 1861US2025008637A1Isolation and protection of computing components from liquid immersion cooling fluidsCARTE CASEY JAMESEN·Filed 2024·Application pending·0 cites
- 1960US11495518B2Multi-surface heat sink suitable for multi-chip packagesINTEL CORP·Filed 2019·Granted Nov 8, 2022·1 cites·16 claims
- 2059US11543868B2Apparatus and method to provide a thermal parameter report for a multi-chip packageINTEL CORP·Filed 2020·Granted Jan 3, 2023·0 cites·12 claims
- 2158US2024008226A1Method and apparatus for real time, in-situ immersion coolant characterization and filtration system control in response theretoINTEL CORP·Filed 2023·Application pending·0 cites
- 2257US2024032248A1Immersion cooling system with multiple cooling liquidsINTEL CORP·Filed 2023·Application pending·0 cites
- 2357US2024096741A1Cooling systems with main and remote cooling masses having integrated flexibilityINTEL CORP·Filed 2023·Application pending·0 cites
- 2455US2023038805A1Methods, systems, apparatus, and articles of manufacture to control load distribution of integrated circuit packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 2554US12315780B2Technologies for processor loading mechanismsINTEL CORP·Filed 2021·Granted May 27, 2025·0 cites·10 claims
- 2654US12309966B2Thermally conductive chamber with stiffening structure for thermal cooling assembly of semiconductor chip package under high loading forceINTEL CORP·Filed 2021·Granted May 20, 2025·0 cites·17 claims
- 2753US12309933B2Magnetically secured semiconductor chip package loading assemblyINTEL CORP·Filed 2021·Granted May 20, 2025·0 cites·20 claims
- 2853US9971890B2Securing thermal management parameters in firmware from cyber attackINTEL CORP·Filed 2016·Granted May 15, 2018·0 cites·12 claims
- 2953US2024064931A1Immersion cooling system with first and second primary loopsINTEL CORP·Filed 2023·Application pending·0 cites
- 3052US2023253288A1Immersion cooling for integrated circuit devicesINTEL CORP·Filed 2022·Application pending·0 cites
- 3152US2024172393A1Methods and apparatus for immersion cooling systemsINTEL CORP·Filed 2024·Application pending·0 cites
- 3252US2023380102A1Methods and apparatus for immersion cooling systemsINTEL CORP·Filed 2023·Application pending·0 cites
- 3351US9355249B2Securing thermal management parameters in firmware from cyber attackAHUJA SANDEEP·Filed 2012·Granted May 31, 2016·0 cites·19 claims
- 3451US2022117079A1Cooling assembly with dampened oscillation responseINTEL CORP·Filed 2021·Application pending·0 cites
- 3551US2022117080A1Ball grid array chip (bga) package cooling assembly with bolster plateINTEL CORP·Filed 2021·Application pending·0 cites
- 3651US2023031457A1Methods, systems, apparatus, and articles of manufacture to crimp a tubeINTEL CORP·Filed 2022·Application pending·0 cites
- 3750US10908660B2Determining thermal margins in a multi-die processorINTEL CORP·Filed 2019·Granted Feb 2, 2021·0 cites·20 claims
- 3850US2024029539A1Methods, systems, apparatus, and articles of manufacture to monitor heat exchangers and associated reservoirsINTEL CORP·Filed 2023·Application pending·0 cites
- 3950US2023309262A1Flow enhancement structure for immersion cooled electronic systemsINTEL CORP·Filed 2023·Application pending·0 cites
- 4048US2024357777A1Methods and apparatus for localized temperature control and leakage protection in a server housingWONDIMU BERHANU KEBEDE·Filed 2024·Application pending·0 cites
- 4148US2024260228A1Immersion cooling systems, apparatus, and related methodsINTEL CORP·Filed 2022·Application pending·0 cites
- 4247US10667438B2Maintenance prediction of electronic devices using periodic thermal evaluationINTEL CORP·Filed 2012·Granted May 26, 2020·0 cites·30 claims
- 4346US6572912B1Cooking processINST GAS TECHNOLOGY·Filed 2000·Granted Jun 3, 2003·0 cites·4 claims
- 4445US2021321526A1Technologies for sealed liquid cooling systemKULKARNI DEVDATTA PRAKASH·Filed 2021·Application pending·0 cites
- 4545US2021185850A1Hybrid liquid coolingINTEL CORP·Filed 2021·Application pending·0 cites
- 4644US2025324546A1Cooling configuration for memory device and related computer systemINTEL CORP·Filed 2025·Application pending·0 cites
- 4741US2009096087A1Microelectronic assembly and method of preparing sameSAUCIUC IOAN·Filed 2007·Application pending·0 cites
- 4839US9142482B2Transient thermal management systems for semiconductor devicesAHUJA SANDEEP·Filed 2011·Granted Sep 22, 2015·0 cites·22 claims
- 4937US2018270993A1Cooling using a wick with varied thicknessINTEL CORP·Filed 2017·Application pending·0 cites
- 5037US2005117305A1Integrated heat sink assemblyFiled 2003·Application pending·0 cites
Showing the top 50 of 53 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →