Inventor · disambiguated record
Daniel A. Lawlyes
Also filed as: LAWLYES DANIEL A · LAWLYES DANIEL ALAN
16 granted patents·7 pending applications·341 citations·filing 1993–2011
94Inventor score
Top patents by PatentIndex Score
23 records- 0195US7294007B1Electronics enclosure and method of fabricating an electronics enclosureDELPHI TECH INC·Filed 2006·Granted Nov 13, 2007·50 cites·8 claims
- 0294US7563992B2Electronic enclosure with continuous ground contact surfaceDELPHI TECH INC·Filed 2006·Granted Jul 21, 2009·38 cites·17 claims
- 0388US7510108B2Method of making an electronic assemblyDELPHI TECH INC·Filed 2005·Granted Mar 31, 2009·19 cites·3 claims
- 0488US6549426B1Electronic enclosure with improved EMC performanceDELPHI TECNOLOGIES INC·Filed 2002·Granted Apr 15, 2003·61 cites·18 claims
- 0586US6821816B1Relaxed tolerance flip chip assemblyDELPHI TECH INC·Filed 2003·Granted Nov 23, 2004·36 cites·6 claims
- 0681US6536286B1Pressure sensor connectorDELPHI TECH INC·Filed 2000·Granted Mar 25, 2003·29 cites·19 claims
- 0776US6308725B1Apparatus for controlling hydraulic fluid pressureDELPHI TECH INC·Filed 2000·Granted Oct 30, 2001·21 cites·19 claims
- 0875US6998706B2Relaxed tolerance flip chip assemblyDELPHI TECH INC·Filed 2004·Granted Feb 14, 2006·17 cites·11 claims
- 0964US5359761AMethod of making a header or housing for electrical connection to a hybrid circuit including an in-cavity trim of a terminal frameDELCO ELECTRONICS CORP·Filed 1993·Granted Nov 1, 1994·25 cites·4 claims
- 1062US6447342B1Pressure sensor connectorDELPHI TECH INC·Filed 2001·Granted Sep 10, 2002·11 cites·21 claims
- 1157US6626767B2Apparatus for golf putting practiceFiled 2002·Granted Sep 30, 2003·8 cites·4 claims
- 1248US5324890ADirect bond copper-output footprintDELCO ELECTRONICS CORP·Filed 1993·Granted Jun 28, 1994·17 cites·4 claims
- 1344US6822868B2Heat sink with integrated electronicsDELPHI TECH INC·Filed 2002·Granted Nov 23, 2004·1 cites·22 claims
- 1442US2005098900A1Relaxed tolerance flip chip assemblyDELPHI TECH INC·Filed 2004·Application pending·0 cites
- 1542US2008053700A1Sealed electronic componentO'CONNOR KURT F·Filed 2006·Application pending·0 cites
- 1641US6565365B2High density wirebond connector assemblyDELPHI TECH INC·Filed 2001·Granted May 20, 2003·1 cites·19 claims
- 1740US2005088824A1Heat sink with integrated electronicsDELPHI TECH INC·Filed 2004·Application pending·0 cites
- 1836US2013036826A1Multiple hydraulic circuit pressure sensorDELPHI TECH INC·Filed 2011·Application pending·0 cites
- 1935US2003035278A1Partitioned circuit assemblyFiled 2001·Application pending·0 cites
- 2032US5895883AApparatus for dampening movement of passivation material in an electronic moduleDELCO ELECTRONICS CORP·Filed 1997·Granted Apr 20, 1999·6 cites·19 claims
- 2132US2001045206A1Air/fuel module with integrated components and electronicsFiled 2001·Application pending·0 cites
- 2227US6309224B1High density wirebond connector assemblyDELPHI TECH INC·Filed 1999·Granted Oct 30, 2001·1 cites·16 claims
- 2321US2003143899A1High density wire bondable connector assemblyFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →