Inventor · disambiguated record
Hee-Mo Koo
Also filed as: KOO HEE-MO
1 granted patent·1 pending application·6 citations·filing 2002–2004
29Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD1
Top patents by PatentIndex Score
2 records- 0151US6776598B2Semiconductor chip molding apparatus and method of detecting when a lead frame has been improperly positioned in the sameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Aug 17, 2004·6 cites·6 claims
- 0234US2004222567A1Semiconductor chip molding apparatus and method of detecting when a lead frame has been improperly positioned in the sameFiled 2004·Application pending·0 cites
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