Inventor · disambiguated record
Jurgen Hupe
Also filed as: HUPE JUERGEN · HUPE JURGEN
10 granted patents·3 pending applications·172 citations·filing 1985–2007
90Inventor score
Top patents by PatentIndex Score
13 records- 0179US5194313AThrough-hole plated printed circuit board and process for manufacturing sameBLAS BERG OBERFLACHENTECHNIK G·Filed 1989·Granted Mar 16, 1993·47 cites·15 claims
- 0277US6821323B1Process for the non-galvanic tin plating of copper or copper alloysENTHONE·Filed 2000·Granted Nov 23, 2004·24 cites·50 claims
- 0373US5373629AThrough-hole plate printed circuit board with resist and process for manufacturing sameBLASBERG OBERFLAECHENTECH·Filed 1990·Granted Dec 20, 1994·42 cites·22 claims
- 0453US6589593B1Method for metal coating of substratesBLASBERG OBERFLAECHENTECH·Filed 1999·Granted Jul 8, 2003·20 cites·7 claims
- 0547US2005266165A1Method for metallizing plastic surfacesENTHONE·Filed 2005·Application pending·0 cites
- 0646US7815785B2Direct metallization of electrically non-conductive polyimide substrate surfacesENTHONE·Filed 2007·Granted Oct 19, 2010·0 cites·19 claims
- 0744US5145572AProcess for manufacturing through-hole contacting plated printed circuitBLASBERG OBERFLAECHENTECH·Filed 1991·Granted Sep 8, 1992·15 cites·9 claims
- 0841US4750976AElectrically conductive copper layers and process for preparing sameBLASBERG OBERFLAECHENTECH·Filed 1985·Granted Jun 14, 1988·8 cites·28 claims
- 0936US2004026254A1Method for selectively metalizing dieletric materialsFiled 2001·Application pending·0 cites
- 1033US6007866AProcess and device for producing through-connected printed circuit boards and multilayered printed circuit boardsBLASBERG OBERFLAECHENTECH·Filed 1996·Granted Dec 28, 1999·7 cites·5 claims
- 1133US2002157959A1Process for electroplating a work piece coated with an electrically conducting polymerFiled 2001·Application pending·0 cites
- 1230US4990395AElectrically conductive copper layers and process for preparing sameBLASBERG OBERFLAECHENTECH·Filed 1988·Granted Feb 5, 1991·3 cites·11 claims
- 1328US6576111B1Process for the copper plating of substratesBLASBERG OBERFLAECHENTECH·Filed 1999·Granted Jun 10, 2003·6 cites·4 claims
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