Inventor · disambiguated record
Haruo Ogino
Also filed as: OGINO HARUO
5 granted patents·173 citations·filing 1988–2014
80Inventor score
Files withHITACHI CHEMICAL CO LTD5
Top patents by PatentIndex Score
5 records- 0194US4902551AProcess for treating copper surfaceHITACHI CHEMICAL CO LTD·Filed 1988·Granted Feb 20, 1990·109 cites·14 claims
- 0282US5690837AProcess for producing multilayer printed circuit boardHITACHI CHEMICAL CO LTD·Filed 1995·Granted Nov 25, 1997·55 cites·13 claims
- 0370US9966164B2Insulated coated wire having a wire coating layer of a resin surrounded by a wire adhesive layer of a resinHITACHI CHEMICAL CO LTD·Filed 2014·Granted May 8, 2018·2 cites·11 claims
- 0444US10027012B2Multilayer wiring plate and method for fabricating sameHITACHI CHEMICAL CO LTD·Filed 2014·Granted Jul 17, 2018·0 cites·12 claims
- 0536US5243144AWiring board and process for producing the sameHITACHI CHEMICAL CO LTD·Filed 1989·Granted Sep 7, 1993·7 cites·2 claims
Join the waitlist — get patent alerts
Get an alert when Haruo Ogino files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →