Inventor · disambiguated record
Osamu Matsuura
Also filed as: MATSUURA OSAMU
37 granted patents·7 pending applications·411 citations·filing 1982–2021
97Inventor score
Top patents by PatentIndex Score
44 records- 0197US4557519AAutomobile body structureMAZDA MOTOR·Filed 1983·Granted Dec 10, 1985·92 cites·13 claims
- 0295US10074665B2Three-dimensional semiconductor memory device including slit with lateral surfaces having periodicityTOSHIBA MEMORY CORP·Filed 2016·Granted Sep 11, 2018·12 cites·16 claims
- 0389US9673214B2Semiconductor deviceTOSHIBA KK·Filed 2016·Granted Jun 6, 2017·7 cites·13 claims
- 0489US7633107B2Semiconductor device and manufacturing method thereofFUJITSU MICROELECTRONICS LTD·Filed 2006·Granted Dec 15, 2009·16 cites·6 claims
- 0588US7528561B2Linear drive apparatusFANUC LTD·Filed 2007·Granted May 5, 2009·16 cites·5 claims
- 0682US4807925AFront vehicle body structureMAZDA MOTOR·Filed 1987·Granted Feb 28, 1989·39 cites·6 claims
- 0781US6855974B2Ferroelectric capacitor, process for production thereof and semiconductor device using the sameFUJITSU LTD·Filed 2003·Granted Feb 15, 2005·23 cites·14 claims
- 0880US4471992AAutomobile body structureTOYO KOGYO CO·Filed 1982·Granted Sep 18, 1984·31 cites·6 claims
- 0979US4552400ATwo-door type automobile body structureMAZDA MOTOR·Filed 1985·Granted Nov 12, 1985·38 cites·6 claims
- 1078US10797072B2Semiconductor deviceTOSHIBA MEMORY CORP·Filed 2019·Granted Oct 6, 2020·2 cites·26 claims
- 1178US4804222AFront structure of vehicle bodyMAZDA MOTOR·Filed 1986·Granted Feb 14, 1989·34 cites·8 claims
- 1277US11069617B2Semiconductor device and nonvolatile memoryTOSHIBA MEMORY CORP·Filed 2019·Granted Jul 20, 2021·2 cites·18 claims
- 1376US9390781B2Semiconductor device and method for manufacturing semiconductor deviceFUJITSU SEMICONDUCTOR LTD·Filed 2014·Granted Jul 12, 2016·5 cites·10 claims
- 1474US10199498B2Semiconductor memory deviceTOSHIBA MEMORY CORP·Filed 2016·Granted Feb 5, 2019·2 cites·18 claims
- 1571US7698717B2System for recording/reproducing photosensitive recording mediumFUJIFILM CORP·Filed 2006·Granted Apr 13, 2010·2 cites·12 claims
- 1668US6812510B2Ferroelectric capacitor, process for manufacturing thereof and ferroelectric memoryFUJITSU LTD·Filed 2003·Granted Nov 2, 2004·11 cites·11 claims
- 1766US10403636B2Semiconductor memory device and method for manufacturing the sameTOSHIBA MEMORY CORP·Filed 2016·Granted Sep 3, 2019·1 cites·19 claims
- 1865US7247504B2Ferroelectric capacitor, process for production thereof and semiconductor device using the sameFUJITSU LTD·Filed 2004·Granted Jul 24, 2007·9 cites·10 claims
- 1965US4600968ASemiconductor device package having regions of different thermal propertiesFUJI ELECTRIC CO LTD·Filed 1984·Granted Jul 15, 1986·32 cites·1 claims
- 2062US10797077B2Three-dimensional semiconductor memory device including slit with lateral surfaces having periodicityTOSHIBA MEMORY CORP·Filed 2019·Granted Oct 6, 2020·0 cites·8 claims
- 2161US6906367B2Semiconductor device and method of fabricating the sameFUJITSU LTD·Filed 2003·Granted Jun 14, 2005·9 cites·9 claims
- 2261US6866500B2Clamping apparatusSONY CORP·Filed 2002·Granted Mar 15, 2005·4 cites·1 claims
- 2360US10541251B2Three-dimensional semiconductor memory device including slit with lateral surfaces having periodicityTOSHIBA MEMORY CORP·Filed 2018·Granted Jan 21, 2020·0 cites·2 claims
- 2458US4718713AFront structure of vehicle bodyMAZDA MOTOR·Filed 1986·Granted Jan 12, 1988·17 cites·8 claims
- 2557US5832327APhotographic film cassetteFUJI PHOTO FILM CO LTD·Filed 1997·Granted Nov 3, 1998·5 cites·12 claims
- 2652US7657660B2Input-output device and control method thereofFUJITSU MICROELECTRONICS LTD·Filed 2007·Granted Feb 2, 2010·2 cites·10 claims
- 2750US7624407B2Photosensitive recording medium cartridge with movement of shutter limited by lid and step portion and method for producing the sameFUJIFILM CORP·Filed 2006·Granted Nov 24, 2009·0 cites·18 claims
- 2848US11594549B2Semiconductor memory deviceKIOXIA CORP·Filed 2021·Granted Feb 28, 2023·0 cites·20 claims
- 2947US2011120130A1Fossil Fuel Combustion Thermal Power System Including Carbon Dioxide Separation and Capture UnitHITACHI LTD·Filed 2010·Application pending·0 cites
- 3046US2007040196A1Semiconductor device and manufacturing method thereof, and thin film deviceFUJITSU LTD·Filed 2006·Application pending·0 cites
- 3145US12500172B23D semiconductor memory device including inter-finger structure and interlayer insulating layers configured to absorb compressing stressKIOXIA CORP·Filed 2021·Granted Dec 16, 2025·0 cites·12 claims
- 3245US8021896B2Method of manufacturing semiconductor device, method of manufacturing semiconductor substrate and semiconductor substrateFUJITSU SEMICONDUCTOR LTD·Filed 2008·Granted Sep 20, 2011·0 cites·8 claims
- 3345US2011183440A1Semiconductor device and manufacturing method thereof, and thin film deviceFUJITSU SEMICONDUCTOR LTD·Filed 2011·Application pending·0 cites
- 3444US12261128B2Semiconductor memory deviceKIOXIA CORP·Filed 2021·Granted Mar 25, 2025·0 cites·19 claims
- 3544US11139312B2Semiconductor deviceTOSHIBA MEMORY CORP·Filed 2019·Granted Oct 5, 2021·0 cites·20 claims
- 3643US7303718B2Injection molding apparatus and injection molding methodSONY DISC & DIGITAL SOLUTIONS·Filed 2003·Granted Dec 4, 2007·0 cites·4 claims
- 3742US7521745B2Semiconductor device reducing leakage across a ferroelectric layerFUJITSU LTD·Filed 2006·Granted Apr 21, 2009·0 cites·6 claims
- 3841US2022302155A1Semiconductor memory deviceKIOXIA CORP·Filed 2021·Application pending·0 cites
- 3940US2020091064A1Semiconductor deviceTOSHIBA MEMORY CORP·Filed 2019·Application pending·0 cites
- 4039US2007040198A1Semiconductor device and manufacturing method thereof, and thin film deviceFUJITSU LTD·Filed 2006·Application pending·0 cites
- 4138US9852942B2Semiconductor memory device and method for manufacturing the sameTOSHIBA MEMORY CORP·Filed 2016·Granted Dec 26, 2017·0 cites·6 claims
- 4235US10998328B2Semiconductor memory deviceTOSHIBA MEMORY CORP·Filed 2018·Granted May 4, 2021·0 cites·12 claims
- 4335US2006083059A1Semiconductor device, reset control system and memory reset methodFUJITSU LTD·Filed 2005·Application pending·0 cites
- 4429US7101171B2Molding die for disc substrateSONY DISC & DIGITAL SOLUTIONS·Filed 2002·Granted Sep 5, 2006·0 cites·8 claims
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