Inventor · disambiguated record
Shu Kin Yau
Also filed as: YAU SHU KIN
9 granted patents·24 citations·filing 2012–2022
78Inventor score
Files withHONG KONG APPLIED SCIENCE & TECH RESEARCH INST CO LTD7HK APPLIED SCIENCE & TECH RES1YANG DAN1
Top patents by PatentIndex Score
9 records- 0192US10777689B1Silicon-carbide shielded-MOSFET embedded with a trench Schottky diode and heterojunction gateHONG KONG APPLIED SCIENCE & TECH RESEARCH INST CO LTD·Filed 2019·Granted Sep 15, 2020·22 cites·20 claims
- 0266US9991161B1Alternate plating and etching processes for through hole fillingHONG KONG APPLIED SCIENCE & TECH RESEARCH INST CO LTD·Filed 2017·Granted Jun 5, 2018·2 cites·20 claims
- 0354US9617653B2Apparatus and method for fast evaluation of electroplating formulation performance in microvia fillingHONG KONG APPLIED SCIENCE & TECH RESEARCH INST CO LTD·Filed 2013·Granted Apr 11, 2017·0 cites·20 claims
- 0453US9273407B2Additive for electrodepositionHK APPLIED SCIENCE & TECH RES·Filed 2014·Granted Mar 1, 2016·0 cites·13 claims
- 0553US8823126B2Low cost backside illuminated CMOS image sensor package with high integrationYANG DAN·Filed 2012·Granted Sep 2, 2014·0 cites·14 claims
- 0647US10100420B2Plating leveler for electrodeposition of copper pillarHONG KONG APPLIED SCIENCE & TECH RESEARCH INST CO LTD·Filed 2015·Granted Oct 16, 2018·0 cites·14 claims
- 0745US12310048B2Silicon-carbide (SiC) metal-oxide-semiconductor field-effect transistor (MOSFET) with short circuit protectionHONG KONG APPLIED SCIENCE & TECH RESEARCH INST CO LTD·Filed 2022·Granted May 20, 2025·0 cites·15 claims
- 0839US10615292B2High voltage silicon carbide Schottky diode flip chip arrayHONG KONG APPLIED SCIENCE & TECH RESEARCH INST CO LTD·Filed 2018·Granted Apr 7, 2020·0 cites·17 claims
- 0938US10916626B2High voltage power device with hybrid Schottky trenches and method of fabricating the sameHONG KONG APPLIED SCIENCE & TECH RESEARCH INST CO LTD·Filed 2018·Granted Feb 9, 2021·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →