Inventor · disambiguated record
Bernd Rakow
Also filed as: RAKOW BERND
7 granted patents·1 pending application·32 citations·filing 2006–2020
80Inventor score
Top patents by PatentIndex Score
8 records- 0189US7868465B2Semiconductor device with a metallic carrier and two semiconductor chips applied to the carrierINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jan 11, 2011·18 cites·15 claims
- 0278US7737537B2Electronic deviceINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jun 15, 2010·9 cites·7 claims
- 0371US9683278B2Diffusion solder bonding using solder preformsINFINEON TECHNOLOGIES AG·Filed 2015·Granted Jun 20, 2017·2 cites·24 claims
- 0463US8030741B2Electronic deviceINFINEON TECHNOLOGIES AG·Filed 2010·Granted Oct 4, 2011·2 cites·20 claims
- 0558US7893532B2External contact material for external contacts of a semiconductor device and method of making the sameINFINEON TECHNOLOGIES AG·Filed 2006·Granted Feb 22, 2011·1 cites·13 claims
- 0654US11393742B2Method for fabricating a semiconductor flip-chip packageINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jul 19, 2022·0 cites·19 claims
- 0748US8642408B2Semiconductor deviceOTREMBA RALF·Filed 2010·Granted Feb 4, 2014·0 cites·24 claims
- 0841US2007018308A1Electronic component and electronic configurationSCHOTT ALBERT·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →