Inventor · disambiguated record
Ying-Hao Chen
Also filed as: Chen ying-hao
33 granted patents·6 pending applications·79 citations·filing 2013–2025
96Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD35TAIWAN SEMICONDUCTOR MFG2CORNING INC1WINBOND ELECTRONICS CORP1
Top patents by PatentIndex Score
39 records- 0198US10854530B1Heat dissipation structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 1, 2020·22 cites·20 claims
- 0296US11367745B2Apparatus and methods for sensing long wavelength lightTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 21, 2022·3 cites·20 claims
- 0395US11810933B2Image sensor device and fabrication method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 7, 2023·3 cites·20 claims
- 0493US11670562B2Heat dissipation structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 6, 2023·2 cites·20 claims
- 0592US12364043B2Image sensor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 15, 2025·1 cites·20 claims
- 0689US9812569B2Semiconductor device and fabricating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 7, 2017·6 cites·4 claims
- 0789US2025329601A1Heat dissipation structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0888US12400928B2Heat dissipation structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 26, 2025·0 cites·20 claims
- 0988US10090392B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Oct 2, 2018·9 cites·19 claims
- 1086US9728637B2Mechanism for forming semiconductor device with gateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 8, 2017·4 cites·20 claims
- 1185US9768221B2Pad structure layout for semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 19, 2017·8 cites·19 claims
- 1285US2025318300A1Image sensor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1383US12113086B2Apparatus and methods for sensing long wavelength lightTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 8, 2024·0 cites·20 claims
- 1483US9252180B2Bonding pad on a back side illuminated image sensorTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 2, 2016·5 cites·20 claims
- 1582US12046528B2Heat dissipation structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 23, 2024·0 cites·20 claims
- 1682US9281215B2Mechanism for forming gateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Mar 8, 2016·5 cites·13 claims
- 1781US12224297B2Method of forming an image sensor having stress releasing structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 11, 2025·0 cites·20 claims
- 1880US10680103B2Method of forming semiconductor device with gateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 9, 2020·2 cites·20 claims
- 1979US2024387595A1Image Sensors With Stress Adjusting LayersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2079US2025185403A1Image sensor having stress releasing structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2178US12389625B2Semiconductor device with gateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 12, 2025·0 cites·20 claims
- 2278US11798969B2Apparatus and methods for sensing long wavelength lightTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 24, 2023·0 cites·20 claims
- 2378US11011566B2Bonding pad on a back side illuminated image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 18, 2021·2 cites·20 claims
- 2477US11569289B2Image sensor having stress releasing structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 31, 2023·0 cites·20 claims
- 2576US12154933B2Image sensors with stress adjusting layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 26, 2024·0 cites·20 claims
- 2676US11569288B2Image sensor having stress releasing structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 31, 2023·0 cites·20 claims
- 2775US9659859B2Metal pad offset for multi-layer metal layoutTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 23, 2017·2 cites·20 claims
- 2869US11600727B2Method of forming semiconductor device with gateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 7, 2023·0 cites·20 claims
- 2969US9865731B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 9, 2018·2 cites·20 claims
- 3068US9728511B2Semiconductor wafer and semiconductor dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 8, 2017·2 cites·20 claims
- 3166US2021273009A1Bonding Pad on a Back Side Illuminated Image SensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Application pending·0 cites
- 3264US10985199B2Image sensor having stress releasing structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 20, 2021·0 cites·20 claims
- 3364US9093430B2Metal pad offset for multi-layer metal layoutTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 28, 2015·1 cites·21 claims
- 3463US11171172B2Image sensor and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 9, 2021·0 cites·20 claims
- 3556US11769780B2Image sensors with stress adjusting layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 26, 2023·0 cites·20 claims
- 3656US10516048B2Fabrication of semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 24, 2019·0 cites·20 claims
- 3754US11171199B2Metal-insulator-metal capacitors with high breakdown voltageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 9, 2021·0 cites·20 claims
- 3849US11990365B2Method for manufacturing semiconductor deviceWINBOND ELECTRONICS CORP·Filed 2021·Granted May 21, 2024·0 cites·13 claims
- 3945US2020407261A1Glass separation systems and glass manufacturing apparatuses comprising the sameCORNING INC·Filed 2019·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →