Inventor · disambiguated record
Davis Andrew Mcclure
Also filed as: MCCLURE DAVIS ANDREW
9 granted patents·2 pending applications·66 citations·filing 2003–2025
83Inventor score
Top patents by PatentIndex Score
11 records- 0195US7422634B2Three inch silicon carbide wafer with low warp, bow, and TTVCREE INC·Filed 2005·Granted Sep 9, 2008·59 cites·17 claims
- 0268US12269123B1Laser edge shaping for semiconductor wafersWOLFSPEED INC·Filed 2024·Granted Apr 8, 2025·0 cites·21 claims
- 0364US8445386B2Smoothing method for semiconductor material and wafers produced by sameMCCLURE DAVIS ANDREW·Filed 2010·Granted May 21, 2013·2 cites·15 claims
- 0462US7138291B2Methods of treating a silicon carbide substrate for improved epitaxial deposition and resulting structures and devicesCREE INC·Filed 2003·Granted Nov 21, 2006·5 cites·21 claims
- 0560US2025312869A1Laser Edge Shaping for Semiconductor WafersWOLFSPEED INC·Filed 2025·Application pending·0 cites
- 0652US7675068B2Methods of treating a silicon carbide substrate for improved epitaxial deposition and resulting structures and devicesCREE INC·Filed 2005·Granted Mar 9, 2010·0 cites·10 claims
- 0751US7294859B2Methods of treating a silicon carbide substrate for improved epitaxial deposition and resulting structures and devicesCREE INC·Filed 2005·Granted Nov 13, 2007·0 cites·5 claims
- 0850US9070654B2Smoothing method for semiconductor material and wafers produced by sameCREE INC·Filed 2013·Granted Jun 30, 2015·0 cites·13 claims
- 0950US2025372382A1Treatments for Improving Fracture Strength for Semiconductor WorkpieceWOLFSPEED INC·Filed 2024·Application pending·0 cites
- 1045US6995398B2Methods of treating a silicon carbide substrate for improved epitaxial deposition and resulting structures and devicesCREE INC·Filed 2004·Granted Feb 7, 2006·0 cites·34 claims
- 1142US8822315B2Methods of treating a silicon carbide substrate for improved epitaxial deposition and resulting structures and devicesMCCLURE DAVIS ANDREW·Filed 2004·Granted Sep 2, 2014·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →