Inventor · disambiguated record
Yong-Gill Lee
Also filed as: LEE YONG-GILL
4 granted patents·1 pending application·160 citations·filing 2004–2005
80Inventor score
Technology areasH10W
Files withADVANCED SEMICONDUCTOR ENG5
Top patents by PatentIndex Score
5 records- 0194US7087462B1Method for forming leadless semiconductor packagesADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Aug 8, 2006·81 cites·17 claims
- 0287US7125747B2Process for manufacturing leadless semiconductor packages including an electrical test in a matrix of a leadless leadframeADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Oct 24, 2006·50 cites·26 claims
- 0377US6984878B2Leadless leadframe with an improved die pad for mold lockingADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Jan 10, 2006·22 cites·26 claims
- 0457US7211467B2Method for fabricating leadless packages with mold locking characteristicsADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted May 1, 2007·7 cites·16 claims
- 0539US2006199308A1Process for manufacturing sawing type leadless semiconductor packagesADVANCED SEMICONDUCTOR ENG·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →