Inventor · disambiguated record
Clint Thomas
Also filed as: THOMAS CLINT · THOMAS CLINT EDWARD
10 granted patents·7 pending applications·31 citations·filing 2000–2025
85Inventor score
Top patents by PatentIndex Score
17 records- 0185US7648584B2Method and apparatus for removing contamination from substrateLAM RES CORP·Filed 2006·Granted Jan 19, 2010·9 cites·27 claims
- 0278US8522799B2Apparatus and system for cleaning a substrateFREER ERIK M·Filed 2006·Granted Sep 3, 2013·6 cites·8 claims
- 0370US12198896B2Compact high density plasma sourceLAM RES CORP·Filed 2019·Granted Jan 14, 2025·1 cites·11 claims
- 0469US2025291253A1Apparatus for photoresist dry depositionLAM RES CORP·Filed 2025·Application pending·0 cites
- 0568US8555903B2Method and apparatus for removing contamination from substrateFREER ERIK M·Filed 2009·Granted Oct 15, 2013·2 cites·20 claims
- 0668US8314027B2Wafer electroless plating system and associated methodsTHIE WILLIAM·Filed 2011·Granted Nov 20, 2012·2 cites·15 claims
- 0761US8485120B2Method and apparatus for wafer electroless platingTHIE WILLIAM·Filed 2007·Granted Jul 16, 2013·1 cites·14 claims
- 0857US8069813B2Wafer electroless plating system and associated methodsTHIE WILLIAM·Filed 2007·Granted Dec 6, 2011·1 cites·18 claims
- 0957US6367357B1Positive engagement spanner wrenchFiled 2000·Granted Apr 9, 2002·9 cites·11 claims
- 1056US2022308462A1Apparatus for photoresist dry depositionLAM RES CORP·Filed 2020·Application pending·0 cites
- 1154US2025218774A1High energy atomic layer etch of a carbon containing layerLAM RES CORP·Filed 2023·Application pending·0 cites
- 1254US2025210363A1Fast atomic layer etchLAM RES CORP·Filed 2023·Application pending·0 cites
- 1352US9287110B2Method and apparatus for wafer electroless platingLAM RES CORP·Filed 2013·Granted Mar 15, 2016·0 cites·20 claims
- 1447US2023314954A1Dry backside and bevel edge clean of photoresistLAM RES CORP·Filed 2021·Application pending·0 cites
- 1546US2024295025A1Dual plenum fractal showerheadLAM RES CORP·Filed 2020·Application pending·0 cites
- 1643US8844461B2Fluid handling system for wafer electroless plating and associated methodsTHIE WILLIAM·Filed 2007·Granted Sep 30, 2014·0 cites·23 claims
- 1743US2015040947A1Method and Systems for Cleaning A SubstrateLAM RES CORP·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →