Inventor · disambiguated record
Yong Ho Baek
Also filed as: BAEK YONG HO
75 granted patents·21 pending applications·195 citations·filing 2007–2024
98Inventor score
Top patents by PatentIndex Score
96 records- 0198US11031675B2Antenna moduleSAMSUNG ELECTRO MECH·Filed 2020·Granted Jun 8, 2021·7 cites·19 claims
- 0297US10347598B2Composite antenna substrate and semiconductor package moduleSAMSUNG ELECTRO MECH·Filed 2018·Granted Jul 9, 2019·22 cites·25 claims
- 0395US10547119B2Antenna ModuleSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jan 28, 2020·12 cites·16 claims
- 0495US10511080B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2018·Granted Dec 17, 2019·14 cites·19 claims
- 0592US10026678B1Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Jul 17, 2018·8 cites·18 claims
- 0690US11503713B2Antenna substrate and antenna module including the sameSAMSUNG ELECTRO MECH·Filed 2020·Granted Nov 15, 2022·2 cites·19 claims
- 0790US11217543B2Antenna moduleSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jan 4, 2022·2 cites·18 claims
- 0890US10985451B2Antenna moduleSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Apr 20, 2021·7 cites·13 claims
- 0990US10763225B2Antenna moduleSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 1, 2020·6 cites·20 claims
- 1090US10109541B2Board for electronic component package, electronic component package, and method of manufacturing board for electronic component packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Oct 23, 2018·5 cites·17 claims
- 1189US10608319B2Antenna moduleSAMSUNG ELECTRO MECH·Filed 2018·Granted Mar 31, 2020·5 cites·19 claims
- 1288US10887994B2Antenna substrate and antenna module including the sameSAMSUNG ELECTRO MECH·Filed 2019·Granted Jan 5, 2021·4 cites·19 claims
- 1388US9999131B2Printed circuit board with embedded electronic component and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2016·Granted Jun 12, 2018·6 cites·11 claims
- 1487US11812556B2Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2021·Granted Nov 7, 2023·1 cites·8 claims
- 1587US10177103B1Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Jan 8, 2019·5 cites·17 claims
- 1686US10325856B2Electronic component package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Jun 18, 2019·4 cites·15 claims
- 1786US10256192B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Apr 9, 2019·5 cites·23 claims
- 1885US9837343B2Chip embedded substrateSAMSUNG ELECTRO MECH·Filed 2015·Granted Dec 5, 2017·5 cites·5 claims
- 1984US10832986B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 10, 2020·4 cites·6 claims
- 2084US10297553B2Electronic component package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2018·Granted May 21, 2019·3 cites·14 claims
- 2184US10242973B2Fan-out-semiconductor package moduleSAMSUNG ELECTRO MECH·Filed 2018·Granted Mar 26, 2019·4 cites·30 claims
- 2284US9831142B2Board for electronic component package, electronic component package, and method of manufacturing board for electronic component packageSAMSUNG ELECTRO MECH·Filed 2016·Granted Nov 28, 2017·3 cites·29 claims
- 2384US9736927B2Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Granted Aug 15, 2017·4 cites·9 claims
- 2483US10741509B2Antenna moduleSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 11, 2020·3 cites·19 claims
- 2583US10674608B2Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2018·Granted Jun 2, 2020·2 cites·9 claims
- 2682US11096286B2Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2020·Granted Aug 17, 2021·1 cites·13 claims
- 2782US10061967B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Aug 28, 2018·3 cites·15 claims
- 2881US10306778B2Printed circuit board with dam around cavity and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2016·Granted May 28, 2019·3 cites·20 claims
- 2981US10076038B2Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2015·Granted Sep 11, 2018·2 cites·6 claims
- 3080US9736939B2Printed circuit board and method of manufacturing printed circuit boardSAMSUNG ELECTRO MECH·Filed 2015·Granted Aug 15, 2017·3 cites·19 claims
- 3179US11038279B2Antenna moduleSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 15, 2021·1 cites·12 claims
- 3279US10477683B2Printed circuit board including sub-circuit boardSAMSUNG ELECTRO MECH·Filed 2017·Granted Nov 12, 2019·2 cites·21 claims
- 3379US9578749B2Element embedded printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Granted Feb 21, 2017·3 cites·14 claims
- 3478US10153235B2Image sensor device and image sensor module comprising the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted Dec 11, 2018·3 cites·17 claims
- 3578US10045444B2Printed circuit board, package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Aug 7, 2018·3 cites·18 claims
- 3677US9999141B2Printed circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Jun 12, 2018·2 cites·10 claims
- 3776US11095037B2Antenna moduleSAMSUNG ELECTRO MECH·Filed 2018·Granted Aug 17, 2021·2 cites·10 claims
- 3876US10700024B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2018·Granted Jun 30, 2020·2 cites·2 claims
- 3975US10332843B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Jun 25, 2019·3 cites·20 claims
- 4075US9894764B2Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Feb 13, 2018·2 cites·16 claims
- 4174US10636743B2Electronic component package and manufacturing method of the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Apr 28, 2020·1 cites·16 claims
- 4271US11075175B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jul 27, 2021·1 cites·14 claims
- 4371US10475842B2Fan-out sensor package and camera moduleSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 12, 2019·1 cites·20 claims
- 4471US7465816B2Production of tetrahydrofuran from 1,4-butanediolHYOSUNG CORP·Filed 2007·Granted Dec 16, 2008·1 cites·5 claims
- 4570US10283439B2Fan-out semiconductor package including electromagnetic interference shielding layerSAMSUNG ELECTRO MECH·Filed 2018·Granted May 7, 2019·1 cites·10 claims
- 4670US7396945B1Method of preparing tetrahydrofuranHYOSUNG CORP·Filed 2007·Granted Jul 8, 2008·1 cites·5 claims
- 4769US10998247B2Board with embedded passive componentSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 4, 2021·1 cites·19 claims
- 4868US10811379B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 20, 2020·1 cites·17 claims
- 4967US10833040B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 10, 2020·1 cites·11 claims
- 5067US10790595B2Antenna module and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 29, 2020·1 cites·19 claims
Showing the top 50 of 96 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →