Inventor · disambiguated record
Haiguang Chen
Also filed as: CHEN HAIGUANG
37 granted patents·1 pending application·457 citations·filing 1993–2019
98Inventor score
Files withKLA TENCOR CORP13KLA TENCOR TECH CORP10CHEN HAIGUANG5BEIJING BAYI SPACE LCD TECH CO LTD3UNIV CALIFORNIA3
Top patents by PatentIndex Score
38 records- 0198US8010222B2Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or toolKLA TENCOR TECH CORP·Filed 2008·Granted Aug 30, 2011·29 cites·10 claims
- 0296US9355440B1Detection of selected defects in relatively noisy inspection dataKLA TENCOR CORP·Filed 2012·Granted May 31, 2016·28 cites·35 claims
- 0395US5602934AAdaptive digital image signal filteringUNIV CALIFORNIA·Filed 1993·Granted Feb 11, 1997·109 cites·37 claims
- 0493US6866559B2Windows configurable to be coupled to a process tool or to be disposed within an opening in a polishing padKLA TENCOR TECHNOLOGIES·Filed 2003·Granted Mar 15, 2005·31 cites·90 claims
- 0592US7332438B2Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or toolKLA TENCOR TECH CORP·Filed 2006·Granted Feb 19, 2008·11 cites·9 claims
- 0692US6884146B2Systems and methods for characterizing a polishing processKLA TENCOR TECH CORP·Filed 2003·Granted Apr 26, 2005·24 cites·39 claims
- 0791US10401279B2Process-induced distortion prediction and feedforward and feedback correction of overlay errorsKLA TENCOR CORP·Filed 2014·Granted Sep 3, 2019·10 cites·25 claims
- 0891US10025894B2System and method to emulate finite element model based prediction of in-plane distortions due to semiconductor wafer chuckingKLA TENCOR CORP·Filed 2016·Granted Jul 17, 2018·7 cites·19 claims
- 0990US9702829B1Systems and methods for wafer surface feature detection and quantificationKLA TENCOR CORP·Filed 2014·Granted Jul 11, 2017·12 cites·25 claims
- 1090US9430593B2System and method to emulate finite element model based prediction of in-plane distortions due to semiconductor wafer chuckingKLA TENCOR CORP·Filed 2013·Granted Aug 30, 2016·10 cites·36 claims
- 1188US10352691B1Systems and methods for wafer structure uniformity monitoring using interferometry wafer geometry toolKLA TENCOR CORP·Filed 2014·Granted Jul 16, 2019·10 cites·22 claims
- 1288US9865047B1Systems and methods for effective pattern wafer surface measurement and analysis using interferometry toolKLA TENCOR CORP·Filed 2015·Granted Jan 9, 2018·7 cites·29 claims
- 1386US6935922B2Methods and systems for generating a two-dimensional map of a characteristic at relative or absolute locations of measurement spots on a specimen during polishingKLA TENCOR TECH CORP·Filed 2003·Granted Aug 30, 2005·16 cites·100 claims
- 1485US9546862B2Systems, methods and metrics for wafer high order shape characterization and wafer classification using wafer dimensional geometry toolKLA TENCOR CORP·Filed 2012·Granted Jan 17, 2017·6 cites·14 claims
- 1584US8831767B2Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or toolLEHMAN KURT·Filed 2011·Granted Sep 9, 2014·3 cites·19 claims
- 1684US7030018B2Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or toolKLA TENCOR TECH CORP·Filed 2003·Granted Apr 18, 2006·14 cites·23 claims
- 1780US8494802B2Computer-implemented methods, computer-readable media, and systems for determining one or more characteristics of a waferCHEN HAIGUANG·Filed 2009·Granted Jul 23, 2013·8 cites·19 claims
- 1880US7373277B1Methods and systems for detection of selected defects particularly in relatively noisy inspection dataKLA TENCOR TECH CORP·Filed 2004·Granted May 13, 2008·26 cites·25 claims
- 1980US7175503B2Methods and systems for determining a characteristic of polishing within a zone on a specimen from combined output signals of an eddy current deviceKLA TENCOR TECH CORP·Filed 2003·Granted Feb 13, 2007·11 cites·47 claims
- 2079US9632038B2Hybrid phase unwrapping systems and methods for patterned wafer measurementKLA TENCOR CORP·Filed 2015·Granted Apr 25, 2017·3 cites·21 claims
- 2179US9177370B2Systems and methods of advanced site-based nanotopography for wafer surface metrologyKLA TENCOR CORP·Filed 2013·Granted Nov 3, 2015·5 cites·52 claims
- 2279US7052369B2Methods and systems for detecting a presence of blobs on a specimen during a polishing processKLA TENCOR TECH CORP·Filed 2003·Granted May 30, 2006·10 cites·38 claims
- 2378US10379061B1Systems, methods and metrics for wafer high order shape characterization and wafer classification using wafer dimensional geometry toolKLA TENCOR CORP·Filed 2017·Granted Aug 13, 2019·2 cites·14 claims
- 2473US9031810B2Methods and systems of object based metrology for advanced wafer surface nanotopographyCHEN HAIGUANG·Filed 2011·Granted May 12, 2015·3 cites·13 claims
- 2572US6514775B2In-situ end point detection for semiconductor wafer polishingKLA TENCOR TECH CORP·Filed 2001·Granted Feb 4, 2003·15 cites·16 claims
- 2665US5517122AT2 restoration and noise suppression of hybrid MR images using Wiener and linear prediction techniquesUNIV CALIFORNIA·Filed 1993·Granted May 14, 1996·20 cites·14 claims
- 2764US7711521B1Methods and systems for detection of selected defects particularly in relatively noisy inspection dataKLA TENCOR TECH CORP·Filed 2008·Granted May 4, 2010·3 cites·29 claims
- 2863US8630479B2Methods and systems for improved localized feature quantification in surface metrology toolsCHEN HAIGUANG·Filed 2011·Granted Jan 14, 2014·2 cites·19 claims
- 2961US11761880B2Process-induced distortion prediction and feedforward and feedback correction of overlay errorsKLA TENCOR CORP·Filed 2019·Granted Sep 19, 2023·0 cites·20 claims
- 3061US10330608B2Systems and methods for wafer surface feature detection, classification and quantification with wafer geometry metrology toolsCHEN HAIGUANG·Filed 2012·Granted Jun 25, 2019·1 cites·25 claims
- 3160US5578923AT2 restoration and noise suppression of hybrid MR images using wiener and linear prediction techniquesUNIV CALIFORNIA·Filed 1995·Granted Nov 26, 1996·21 cites·2 claims
- 3254US9646379B1Detection of selected defects in relatively noisy inspection dataKLA TENCOR CORP·Filed 2016·Granted May 9, 2017·0 cites·33 claims
- 3351US2006148383A1Methods and systems for detecting a presence of blobs on a specimen during a polishing processKLA TENCOR TECHNOLOGIES·Filed 2006·Application pending·0 cites
- 3445US12024665B2Polymer-stabilized liquid crystal composition and use thereofBEIJING BAYI SPACE LCD TECH CO LTD·Filed 2019·Granted Jul 2, 2024·0 cites·16 claims
- 3541US8594975B2Systems and methods for wafer edge feature detection and quantificationCHEN HAIGUANG·Filed 2011·Granted Nov 26, 2013·0 cites·14 claims
- 3636US10557082B2Liquid crystal composition and application thereofBEIJING BAYI SPACE LCD TECH CO LTD·Filed 2015·Granted Feb 11, 2020·0 cites·10 claims
- 3736US10414981B2Liquid crystal composition containing 2-methyl-3,4,5-trifluorobenzene liquid crystal compound and application thereofBEIJING BAYI SPACE LCD TECH CO LTD·Filed 2015·Granted Sep 17, 2019·0 cites·9 claims
- 3829US10655064B2Liquid crystal composition and its applicationJIANG TIANMENG·Filed 2014·Granted May 19, 2020·0 cites·11 claims
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