Inventor · disambiguated record
Kiyotaka Komori
Also filed as: KOMORI KIYOTAKA
17 granted patents·6 pending applications·198 citations·filing 1991–2024
92Inventor score
Top patents by PatentIndex Score
23 records- 0189US5284807AGlass fiber forming composition, glass fibers obtained from the composition and substrate for circuit board including the glass fibers as reinforcing materialMATSUSHITA ELECTRIC WORKS LTD·Filed 1992·Granted Feb 8, 1994·70 cites·7 claims
- 0283US9307636B2Printed wiring boardKATO HIROAKI·Filed 2012·Granted Apr 5, 2016·6 cites·6 claims
- 0383US5407872AGlass fiber forming composition, glass fibers obtained from the composition and substrate for circuit board including the glass fibers as reinforcing materialMATSUSHITA ELECTRIC WORKS LTD·Filed 1993·Granted Apr 18, 1995·44 cites·7 claims
- 0481US2025040059A1Method for manufacturing multilayer printed wiring board and multilayer printed wiring boardPANASONIC IP MAN CO LTD·Filed 2024·Application pending·0 cites
- 0579US7288587B2Poly(phenylene oxide) resin composition, prepreg, laminates sheet, printed wiring board, and multilayer printed wiring boardMATSUSHITA ELECTRIC WORKS LTD·Filed 2002·Granted Oct 30, 2007·24 cites·23 claims
- 0677US12162257B2Metal clad laminated plate and method for manufacturing metal clad laminated platePANASONIC IP MAN CO LTD·Filed 2023·Granted Dec 10, 2024·0 cites·16 claims
- 0770US2021400810A1Metal clad laminated plate and method for manufacturing metal clad laminated platePANASONIC IP MAN CO LTD·Filed 2019·Application pending·0 cites
- 0866US11818835B2Multilayer printed wiring board, multilayer metal-clad laminated board, and resin-coated metal foilPANASONIC IP MAN CO LTD·Filed 2021·Granted Nov 14, 2023·0 cites·20 claims
- 0965US2022408568A1Method for manufacturing multilayer printed wiring board and multilayer printed wiring boardPANASONIC IP MAN CO LTD·Filed 2020·Application pending·0 cites
- 1064US6589656B2Epoxy resin composition, prepreg and metal-clad laminateMATSUSHITA ELECTRIC WORKS LTD·Filed 2001·Granted Jul 8, 2003·6 cites·13 claims
- 1160US8603624B2Prepreg, laminate, metal clad laminate, circuit board, and circuit board for LED mountingMATSUDA TAKASHI·Filed 2010·Granted Dec 10, 2013·2 cites·8 claims
- 1260US5275878AComposite dielectric and printed-circuit use substrate utilizing the sameMATSUSHITA ELECTRIC WORKS LTD·Filed 1991·Granted Jan 4, 1994·23 cites·7 claims
- 1356US6403690B1Flame retardant resin compositionMATSUSHITA ELECTRIC WORKS LTD·Filed 1999·Granted Jun 11, 2002·13 cites·12 claims
- 1451US2020114623A1Metal-clad laminate and method for manufacturing samePANASONIC IP MAN CO LTD·Filed 2018·Application pending·0 cites
- 1550US9775239B2Resin composition for printed wiring board, prepreg, metal-clad laminate, and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2015·Granted Sep 26, 2017·0 cites·13 claims
- 1650US2018270945A1Multilayer printed wiring board, multilayer metal-clad laminated board, and resin-coated metal foilPANASONIC IP MAN CO LTD·Filed 2016·Application pending·0 cites
- 1749US10568201B2Multilayer printed wiring board and multilayer metal clad laminated boardPANASONIC IP MAN CO LTD·Filed 2017·Granted Feb 18, 2020·0 cites·6 claims
- 1849US9730320B2Prepreg, laminate, metal foil-clad laminate, circuit board and LED moduleMATSUDA TAKASHI·Filed 2011·Granted Aug 8, 2017·0 cites·6 claims
- 1948US5334645ASubstrate for circuit board including the glass fibers as reinforcing materialMATSUSHITA ELECTRIC WORKS LTD·Filed 1993·Granted Aug 2, 1994·10 cites·16 claims
- 2047US9718941B2Thermosetting resin composition, prepreg, laminate, metal foil-clad laminate, and circuit boardMATSUDA TAKASHI·Filed 2012·Granted Aug 1, 2017·0 cites·10 claims
- 2146US11039533B2Printed wiring board and method for manufacturing printed wiring boardPANASONIC IP MAN CO LTD·Filed 2018·Granted Jun 15, 2021·0 cites·10 claims
- 2242US2020346437A1Metal-clad laminate and method for manufacturing the samePANASONIC IP MAN CO LTD·Filed 2018·Application pending·0 cites
- 2340US10668697B2Method for manufacturing metal clad laminated board, method for manufacturing electronic circuit board, and rigid body pendulum type viscoelasticity measuring devicePANASONIC IP MAN CO LTD·Filed 2017·Granted Jun 2, 2020·0 cites·14 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →