Inventor · disambiguated record
Hideo Numata
Also filed as: NUMATA HIDEO
41 granted patents·11 pending applications·369 citations·filing 1983–2021
97Inventor score
Files withTOSHIBA KK16HONDA MOTOR CO LTD13TANIDA KAZUMASA5SUMITOMO ELECTRIC INDUSTRIES3NUMATA HIDEO2
Top patents by PatentIndex Score
52 records- 0197US7629695B2Stacked electronic component and manufacturing method thereofTOSHIBA KK·Filed 2005·Granted Dec 8, 2009·51 cites·16 claims
- 0286US11398635B2Method of operating fuel cell systemHONDA MOTOR CO LTD·Filed 2021·Granted Jul 26, 2022·1 cites·9 claims
- 0386US9024424B2Stacked electronic component and manufacturing method thereofYOSHIMURA ATSUSHI·Filed 2012·Granted May 5, 2015·6 cites·7 claims
- 0485US8822307B2Semiconductor manufacturing apparatus and semiconductor manufacturing methodYAMAGUCHI NAOKO·Filed 2012·Granted Sep 2, 2014·10 cites·10 claims
- 0585US6352073B1Semiconductor manufacturing equipmentTOSHIBA KK·Filed 1999·Granted Mar 5, 2002·68 cites·13 claims
- 0683US8778778B2Manufacturing method of semiconductor device, semiconductor substrate, and camera moduleTANIDA KAZUMASA·Filed 2011·Granted Jul 15, 2014·8 cites·7 claims
- 0783US8338904B2Semiconductor device and method for manufacturing the sameTANIDA KAZUMASA·Filed 2010·Granted Dec 25, 2012·3 cites·11 claims
- 0883US7118294B2Optical semiconductor module and its manufacturing methodTOSHIBA KK·Filed 2004·Granted Oct 10, 2006·23 cites·4 claims
- 0983US6238515B1Wafer transfer apparatusLINTEC CORP·Filed 1999·Granted May 29, 2001·68 cites·10 claims
- 1078US8008763B2Stacked electronic component and manufacturing method thereofTOSHIBA KK·Filed 2008·Granted Aug 30, 2011·5 cites·7 claims
- 1178US6774011B2Chip pickup device and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2001·Granted Aug 10, 2004·21 cites·6 claims
- 1275US9893116B2Manufacturing method of electronic device and manufacturing method of semiconductor deviceTOSHIBA MEMORY CORP·Filed 2015·Granted Feb 13, 2018·2 cites·15 claims
- 1373US7531876B2Semiconductor device having power semiconductor elementsTOSHIBA KK·Filed 2005·Granted May 12, 2009·6 cites·14 claims
- 1473US7364369B2Lead frame, optical coupling part using lead frame, and manufacturing method of optical coupling partSUMITOMO ELECTRIC INDUSTRIES·Filed 2007·Granted Apr 29, 2008·5 cites·6 claims
- 1572US7892682B2Fuel cell system and method for controlling air-flow rate thereinHONDA MOTOR CO LTD·Filed 2008·Granted Feb 22, 2011·2 cites·4 claims
- 1671US8704337B2Semiconductor device and method for manufacturing the sameTAKANO EIJI·Filed 2010·Granted Apr 22, 2014·3 cites·13 claims
- 1771US7438481B2Optical semiconductor module and semiconductor device including the sameTOSHIBA KK·Filed 2005·Granted Oct 21, 2008·4 cites·20 claims
- 1870US8748316B2Method of manufacturing semiconductor device, semiconductor device, and camera moduleSHIRONO TAKASHI·Filed 2011·Granted Jun 10, 2014·1 cites·7 claims
- 1970US7775727B2Optical module and manufacturing method of the sameTOSHIBA KK·Filed 2008·Granted Aug 17, 2010·5 cites·20 claims
- 2067US7264900B2Fuel cell systemHONDA MOTOR CO LTD·Filed 2003·Granted Sep 4, 2007·7 cites·3 claims
- 2166US8980671B2Semiconductor device and manufacturing method of semiconductor deviceHONGO SATOSHI·Filed 2012·Granted Mar 17, 2015·3 cites·11 claims
- 2266US7255493B2Optical semiconductor module and its manufacturing methodTOSHIBA KK·Filed 2006·Granted Aug 14, 2007·3 cites·18 claims
- 2365US7371477B2Exhaust gas processing device for fuel cellHONDA MOTOR CO LTD·Filed 2003·Granted May 13, 2008·6 cites·9 claims
- 2464US7401983B2Method for manufacturing optical coupling part and optical coupling partSUMITOMO ELECTRIC INDUSTRIES·Filed 2006·Granted Jul 22, 2008·3 cites·10 claims
- 2563US11444294B2Method of operating fuel cell systemHONDA MOTOR CO LTD·Filed 2021·Granted Sep 13, 2022·0 cites·5 claims
- 2663US7604890B2Fuel cell discharge-gas processing deviceHONDA MOTOR CO LTD·Filed 2006·Granted Oct 20, 2009·1 cites·3 claims
- 2763US4627295AVortex flow meterOVAL ENG CO LTD·Filed 1986·Granted Dec 9, 1986·22 cites·18 claims
- 2861US7771130B2Method of producing optical fiber positioning component, and optical fiber positioning componentSUMITOMO ELECTRIC INDUSTRIES·Filed 2007·Granted Aug 10, 2010·2 cites·9 claims
- 2959US11799104B2Method of operating fuel cell systemHONDA MOTOR CO LTD·Filed 2021·Granted Oct 24, 2023·0 cites·6 claims
- 3059US8309430B2Semiconductor manufacturing apparatus and semiconductor manufacturing methodTANIDA KAZUMASA·Filed 2011·Granted Nov 13, 2012·1 cites·20 claims
- 3158US7358002B2Exhaust gas processing device for fuel cellHONDA MOTOR CO LTD·Filed 2003·Granted Apr 15, 2008·3 cites·18 claims
- 3257US11705445B2Semiconductor device manufacturing method and semiconductor deviceKIOXIA CORP·Filed 2021·Granted Jul 18, 2023·0 cites·4 claims
- 3357US10862142B2Flow rate adjustment structure and flow rate adjustment methodHONDA MOTOR CO LTD·Filed 2018·Granted Dec 8, 2020·0 cites·9 claims
- 3456US7678487B2Discharged fuel diluterHONDA MOTOR CO LTD·Filed 2006·Granted Mar 16, 2010·3 cites·7 claims
- 3553US7285351B2Apparatus for dilution of discharged fuelHONDA MOTOR CO LTD·Filed 2003·Granted Oct 23, 2007·1 cites·13 claims
- 3653US2015214193A1Stacked electronic component and manufacturing method thereofTOSHIBA KK·Filed 2015·Application pending·0 cites
- 3751US8268673B2Stacked electronic component and manufacturing method thereofYOSHIMURA ATSUSHI·Filed 2011·Granted Sep 18, 2012·0 cites·20 claims
- 3848US5871610AApparatus for automatically mounting a plurality of semiconductor chips on a lead frameTOSHIBA KK·Filed 1993·Granted Feb 16, 1999·19 cites·4 claims
- 3948US2010213564A1Sensor chip and method of manufacturing the sameTOSHIBA KK·Filed 2009·Application pending·0 cites
- 4048US2008280185A1Fuel cell systemHONDA MOTOR CO LTD·Filed 2008·Application pending·0 cites
- 4147US6739326B2Semiconductor manufacturing equipmentTOSHIBA KK·Filed 2001·Granted May 25, 2004·1 cites·12 claims
- 4245US7824811B2Fuel cell discharge-gas processing deviceHONDA MOTOR CO LTD·Filed 2005·Granted Nov 2, 2010·0 cites·8 claims
- 4345US2006035510A1LSI package having interface function with exterior, circuit device including the same, and manufacturing method of circuit deviceNUMATA HIDEO·Filed 2005·Application pending·0 cites
- 4443US2007235882A1Semiconductor device and method for fabricating the sameTOSHIBA KK·Filed 2007·Application pending·0 cites
- 4541US7235425B2Semiconductor device and fabrication method for the sameTOSHIBA KK·Filed 2005·Granted Jun 26, 2007·0 cites·2 claims
- 4641US2006055050A1Semiconductor device and manufacturing method thereofNUMATA HIDEO·Filed 2005·Application pending·0 cites
- 4740US2006102290A1Wafer support plate, holding method of thin wafer, and manufacturing method of semiconductor deviceHARADA SUSUMU·Filed 2005·Application pending·0 cites
- 4840US2006050493A1LSI package with interface module, transmission line package, and ribbon optical transmission lineHAMASAKI HIROSHI·Filed 2005·Application pending·0 cites
- 4938US2012190138A1Semiconductor manufacturing apparatus and semiconductor substrate bonding methodTANIDA KAZUMASA·Filed 2012·Application pending·0 cites
- 5037US2011304003A1Semiconductor device, camera module, and manufacturing method of semiconductor deviceTANIDA KAZUMASA·Filed 2011·Application pending·0 cites
Showing the top 50 of 52 patent records by PatentIndex Score.
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