Inventor · disambiguated record
Anish Tolia
Also filed as: TOLIA ANISH
10 granted patents·1 pending application·752 citations·filing 1998–2002
93Inventor score
Files withAPPLIED MATERIALS INC11
Top patents by PatentIndex Score
11 records- 0197US6117245AMethod and apparatus for controlling cooling and heating fluids for a gas distribution plateAPPLIED MATERIALS INC·Filed 1998·Granted Sep 12, 2000·252 cites·19 claims
- 0296US6413383B1Method for igniting a plasma in a sputter reactorAPPLIED MATERIALS INC·Filed 2000·Granted Jul 2, 2002·92 cites·15 claims
- 0395US6582569B1Process for sputtering copper in a self ionized plasmaAPPLIED MATERIALS INC·Filed 2000·Granted Jun 24, 2003·75 cites·21 claims
- 0494US6398929B1Plasma reactor and shields generating self-ionized plasma for sputteringAPPLIED MATERIALS INC·Filed 1999·Granted Jun 4, 2002·128 cites·22 claims
- 0592US6893541B2Multi-step process for depositing copper seed layer in a viaAPPLIED MATERIALS INC·Filed 2002·Granted May 17, 2005·51 cites·9 claims
- 0691US6433314B1Direct temperature control for a component of a substrate processing chamberAPPLIED MATERIALS INC·Filed 2000·Granted Aug 13, 2002·62 cites·32 claims
- 0776US6297147B1Plasma treatment for ex-situ contact fillAPPLIED MATERIALS INC·Filed 1998·Granted Oct 2, 2001·50 cites·25 claims
- 0871US6375753B1Method and apparatus for removing processing liquid from a processing liquid delivery lineAPPLIED MATERIALS INC·Filed 2001·Granted Apr 23, 2002·9 cites·19 claims
- 0965US6345642B1Method and apparatus for removing processing liquid from a processing liquid pathAPPLIED MATERIALS INC·Filed 1999·Granted Feb 12, 2002·31 cites·27 claims
- 1037US2003116427A1Self-ionized and inductively-coupled plasma for sputtering and resputteringAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
- 1133US6305392B1Method and apparatus for removing processing liquid from a processing liquid delivery lineAPPLIED MATERIALS INC·Filed 1999·Granted Oct 23, 2001·2 cites·13 claims
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