Inventor · disambiguated record
Munehisa Kishimoto
Also filed as: KISHIMOTO MUNEHISA
22 granted patents·3 pending applications·816 citations·filing 1983–2013
97Inventor score
Files withHITACHI LTD9RENESAS TECH CORP7KAJIWARA RYOICHI3RENESAS ELECTRONICS CORP3RENESAS TEHCNOLOGY CORP1
Top patents by PatentIndex Score
25 records- 0198US6774466B1Semiconductor deviceRENESAS TECH CORP·Filed 2000·Granted Aug 10, 2004·162 cites·2 claims
- 0294US7985991B2MOSFET packageRENESAS ELECTRONICS CORP·Filed 2008·Granted Jul 26, 2011·16 cites·30 claims
- 0394US6479888B1Semiconductor device and a method of manufacturing the sameHITACHI LTD·Filed 2000·Granted Nov 12, 2002·77 cites·5 claims
- 0493US6552421B2Semiconductor device and a method of manufacturing the sameHITACHI LTD·Filed 2001·Granted Apr 22, 2003·84 cites·17 claims
- 0591US8183607B2Semiconductor deviceKAJIWARA RYOICHI·Filed 2011·Granted May 22, 2012·8 cites·4 claims
- 0690US7400002B2MOSFET packageRENESAS TECH CORP·Filed 2006·Granted Jul 15, 2008·11 cites·20 claims
- 0790US7332757B2MOSFET packageRENESAS TECH CORP·Filed 2006·Granted Feb 19, 2008·11 cites·8 claims
- 0889US7342267B2MOSFET packageRENESAS TECH CORP·Filed 2006·Granted Mar 11, 2008·10 cites·48 claims
- 0989US5219765AMethod for manufacturing a semiconductor device including wafer aging, probe inspection, and feeding back the results of the inspection to the device fabrication processHITACHI LTD·Filed 1990·Granted Jun 15, 1993·160 cites·22 claims
- 1087US7812464B2Semiconductor device and a method of manufacturing for high output MOSFETRENESAS ELECTRONICS CORP·Filed 2008·Granted Oct 12, 2010·10 cites·7 claims
- 1186US8455986B2Mosfet packageKAJIWARA RYOICHI·Filed 2012·Granted Jun 4, 2013·4 cites·12 claims
- 1285US6569764B1Method of manufacturing a semiconductor package by attaching a lead frame to a semiconductor chip via projecting electrodes and an insulating sheet of resin materialHITACHI LTD·Filed 2000·Granted May 27, 2003·43 cites·5 claims
- 1385US4586789ALiquid crystal display unit with particular electrode terminal groupingsHITACHI LTD·Filed 1983·Granted May 6, 1986·63 cites·5 claims
- 1482US8816411B2Mosfet packageRENESAS ELECTRONICS CORP·Filed 2013·Granted Aug 26, 2014·3 cites·8 claims
- 1581US5406027AMounting structure and electronic device employing the sameHITACHI LTD·Filed 1991·Granted Apr 11, 1995·64 cites·10 claims
- 1678US7394146B2MOSFET packageRENESAS TEHCNOLOGY CORP·Filed 2006·Granted Jul 1, 2008·5 cites·30 claims
- 1775US6501160B1Semiconductor device and a method of manufacturing the same and a mount structureHITACHI LTD·Filed 2000·Granted Dec 31, 2002·23 cites·35 claims
- 1874US6812554B2Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2002·Granted Nov 2, 2004·14 cites·5 claims
- 1963US7160760B2Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2004·Granted Jan 9, 2007·7 cites·8 claims
- 2062US7385279B2Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2006·Granted Jun 10, 2008·1 cites·3 claims
- 2162US6573119B1Semiconductor device and method of manufacture thereofHITACHI LTD·Filed 1999·Granted Jun 3, 2003·28 cites·5 claims
- 2253US2007029540A1Semiconductor deviceKAJIWARA RYOICHI·Filed 2006·Application pending·0 cites
- 2344US2004217474A1Semiconductor deviceFiled 2004·Application pending·0 cites
- 2443US2004150082A1Semiconductor deviceFiled 2004·Application pending·0 cites
- 2542US5315482ASemiconductor apparatus of module installing typeHITACHI LTD·Filed 1992·Granted May 24, 1994·12 cites·10 claims
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