Inventor · disambiguated record
Chang-Lun Lu
Also filed as: LU CHANG · LU CHANG-LUN
17 granted patents·5 pending applications·28 citations·filing 2013–2021
89Inventor score
Files withSILICONWARE PRECISION INDUSTRIES CO LTD20BEIJING XIAOMI MOBILE SOFTWARE CO LTD1POWERTECH TECHNOLOGY INC1
Top patents by PatentIndex Score
22 records- 0190US9515039B2Substrate structure with first and second conductive bumps having different widthsSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Dec 6, 2016·8 cites·10 claims
- 0281USD983819SDisplay screen or portion thereof with graphical user interfaceBEIJING XIAOMI MOBILE SOFTWARE CO LTD·Filed 2021·Granted Apr 18, 2023·11 cites·1 claims
- 0375US9818635B2Carrier structure, packaging substrate, electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Nov 14, 2017·2 cites·11 claims
- 0473US9601403B2Electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Mar 21, 2017·2 cites·19 claims
- 0570US10796970B2Method for fabricating electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Oct 6, 2020·1 cites·9 claims
- 0666US10128178B2Electronic package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Nov 13, 2018·1 cites·8 claims
- 0765US10141233B2Electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Nov 27, 2018·1 cites·9 claims
- 0859US9263380B2Semiconductor interposer and package structure having the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Feb 16, 2016·2 cites·27 claims
- 0955US9735075B2Electronic module and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Aug 15, 2017·0 cites·9 claims
- 1053US11676983B2Sensor with dam structure and method for manufacturing the samePOWERTECH TECHNOLOGY INC·Filed 2020·Granted Jun 13, 2023·0 cites·8 claims
- 1153US10403570B2Method for fabricating electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Sep 3, 2019·0 cites·9 claims
- 1252US10461002B2Fabrication method of electronic moduleSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Oct 29, 2019·0 cites·11 claims
- 1352US10211082B2Fabrication method of electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Feb 19, 2019·0 cites·9 claims
- 1449US2015035164A1Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 1546US2017148761A1Method of fabricating semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Application pending·0 cites
- 1645US9831191B2Electronic package, semiconductor substrate of the electronic package, and method for manufacturing the electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Nov 28, 2017·0 cites·8 claims
- 1744US10201086B2Electronic deviceSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Feb 5, 2019·0 cites·6 claims
- 1843US9899309B2Electronic package and semiconductor substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Feb 20, 2018·0 cites·16 claims
- 1941US2015035163A1Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 2038US2017084562A1Package structure, chip structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Application pending·0 cites
- 2137US10242972B2Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Mar 26, 2019·0 cites·27 claims
- 2235US2015325545A1Package structure, chip structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →