Inventor · disambiguated record
Ryohei Yumoto
Also filed as: YUMOTO RYOHEI
8 granted patents·1 pending application·2 citations·filing 2018–2022
73Inventor score
Technology areasH10W
Files withMITSUBISHI MATERIALS CORP9
Top patents by PatentIndex Score
9 records- 0171US11302602B2Power-module substrate with heat-sinkMITSUBISHI MATERIALS CORP·Filed 2018·Granted Apr 12, 2022·2 cites·6 claims
- 0269US11908768B2Method of manufacturing bonded body for insulation circuit substrate board and bonded body for insulation circuit substrate boardMITSUBISHI MATERIALS CORP·Filed 2022·Granted Feb 20, 2024·0 cites·1 claims
- 0363US2022223493A1Insulation circuit board with heat sinkMITSUBISHI MATERIALS CORP·Filed 2022·Application pending·0 cites
- 0455US12356554B2Method for manufacturing bonded body and method for manufacturing insulation circuit substrateMITSUBISHI MATERIALS CORP·Filed 2021·Granted Jul 8, 2025·0 cites·4 claims
- 0555US11289400B2Method of manufacturing bonded body for insulation circuit substrate board and bonded body for insulation circuit substrate boardMITSUBISHI MATERIALS CORP·Filed 2019·Granted Mar 29, 2022·0 cites·26 claims
- 0654US11322424B2Insulation circuit board with heat sinkMITSUBISHI MATERIALS CORP·Filed 2019·Granted May 3, 2022·0 cites·5 claims
- 0747US11289390B2Insulation circuit board with heat sinkMITSUBISHI MATERIALS CORP·Filed 2019·Granted Mar 29, 2022·0 cites·10 claims
- 0843US11013107B2Insulated circuit boardMITSUBISHI MATERIALS CORP·Filed 2019·Granted May 18, 2021·0 cites·20 claims
- 0937US11462456B2Power-module substrate with heat-sinkMITSUBISHI MATERIALS CORP·Filed 2018·Granted Oct 4, 2022·0 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →