Inventor · disambiguated record
Hikaru Nomura
Also filed as: NOMURA Hikaru
10 granted patents·9 pending applications·16 citations·filing 2012–2024
83Inventor score
Top patents by PatentIndex Score
19 records- 0188US10213879B2Solder alloySENJU METAL INDUSTRY CO·Filed 2016·Granted Feb 26, 2019·2 cites·4 claims
- 0285US9907155B2Printed wiring board and printed circuit boardCANON KK·Filed 2013·Granted Feb 27, 2018·7 cites·19 claims
- 0381US2024363571A1Lead-Free Solder BallSENJU METAL INDUSTRY CO·Filed 2024·Application pending·0 cites
- 0476US11167379B2Solder alloy, solder ball, solder preform, solder paste and solder jointSENJU METAL INDUSTRY CO·Filed 2020·Granted Nov 9, 2021·1 cites·13 claims
- 0575US9780055B2Lead-free solder ballYAMANAKA YOSHIE·Filed 2012·Granted Oct 3, 2017·4 cites·11 claims
- 0670US10343238B2Lead-free solder alloySENJU METAL INDUSTRY CO·Filed 2017·Granted Jul 9, 2019·1 cites·12 claims
- 0769US10500680B2Solder alloy, solder ball, and solder jointSENJU METAL INDUSTRY CO·Filed 2017·Granted Dec 10, 2019·1 cites·16 claims
- 0865US11241760B2Solder alloy, solder paste, solder ball, resin flux-cored solder and solder jointSENJU METAL INDUSTRY CO·Filed 2019·Granted Feb 8, 2022·0 cites·14 claims
- 0956US2019088611A1"Lead-Free Solder Ball"SENJU METAL INDUSTRY CO·Filed 2018·Application pending·0 cites
- 1054US9808890B2Solder alloySENJU METAL INDUSTRY CO·Filed 2013·Granted Nov 7, 2017·0 cites·8 claims
- 1153US2018005970A1Lead-Free Solder BallSENJU METAL INDUSTRY CO·Filed 2017·Application pending·0 cites
- 1253US2015328722A1Lead-free solder alloySENJU METAL INDUSTRY CO·Filed 2012·Application pending·0 cites
- 1352US2015037087A1Lead-Free Solder AlloySENJU METAL INDUSTRY CO·Filed 2013·Application pending·0 cites
- 1451US2021001431A1Solder alloy, solder paste, solder ball, resin flux-cored solder and solder jointSENJU METAL INDUSTRY CO·Filed 2018·Application pending·0 cites
- 1550US10076808B2Lead-free solder alloySENJU METAL INDUSTRY CO·Filed 2013·Granted Sep 18, 2018·0 cites·7 claims
- 1650US2019076966A1Lead-Free Solder AlloySENJU METAL INDUSTRY CO·Filed 2018·Application pending·0 cites
- 1748US2024377266A1Information processing method, information processing apparatus, and magnetic elementUNIV TOHOKU·Filed 2022·Application pending·0 cites
- 1840US2016074971A1Lead-Free Solder AlloySENJU METAL INDUSTRY CO·Filed 2013·Application pending·0 cites
- 1937US9482692B2Magnetic field value measuring device and method for measuring magnetic field valueUNIV AKITA·Filed 2014·Granted Nov 1, 2016·0 cites·12 claims
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