Inventor · disambiguated record
Min-Chie Jeng
Also filed as: JENG MIN-CHIE
48 granted patents·3 pending applications·254 citations·filing 1999–2020
98Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD22TAIWAN SEMICONDUCTOR MFG10YEN HSIAO-TSUNG8SU TING CHIEH3CADENCE DESIGN SYSTEMS INC1
Top patents by PatentIndex Score
51 records- 0197US8941212B2Helical spiral inductor between stacking dieTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 27, 2015·34 cites·20 claims
- 0297US8754818B2Integrated antenna structure on separate semiconductor dieYEN HSIAO-TSUNG·Filed 2012·Granted Jun 17, 2014·41 cites·20 claims
- 0396US9171798B2Methods and apparatus for transmission lines in packagesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Oct 27, 2015·23 cites·20 claims
- 0496US8896094B2Methods and apparatus for inductors and transformers in packagesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Nov 25, 2014·28 cites·17 claims
- 0594US8860114B2Structure and method for a fishbone differential capacitorYEN HSIAO-TSUNG·Filed 2012·Granted Oct 14, 2014·18 cites·17 claims
- 0692US9041152B2Inductor with magnetic materialTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 26, 2015·11 cites·20 claims
- 0792US8809073B2Apparatus and methods for de-embedding through substrate viasYEN HSIAO-TSUNG·Filed 2011·Granted Aug 19, 2014·12 cites·11 claims
- 0891US8399961B2Tuning the efficiency in the transmission of radio-frequency signals using micro-bumpsYEN HSIAO-TSUNG·Filed 2010·Granted Mar 19, 2013·11 cites·14 claims
- 0988US8502620B2Balun system and methodLU JHE-CHING·Filed 2010·Granted Aug 6, 2013·16 cites·19 claims
- 1081US10521538B2Method and system for integrated circuit design with on-chip variation and spatial correlationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 31, 2019·3 cites·20 claims
- 1180US9203146B2Antenna using through-silicon viaTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Dec 1, 2015·4 cites·20 claims
- 1277US9331013B2Integrated capacitorTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 3, 2016·4 cites·20 claims
- 1376US10840201B2Methods and apparatus for transmission lines in packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 17, 2020·1 cites·20 claims
- 1476US8901752B2Tuning the efficiency in the transmission of radio-frequency signals using micro-bumpsTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 2, 2014·3 cites·20 claims
- 1575US10629756B2Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 21, 2020·1 cites·20 claims
- 1675US9472612B2Integrated capacitorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 18, 2016·2 cites·20 claims
- 1775US9385246B2Differential MOSCAP deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jul 5, 2016·2 cites·13 claims
- 1874US8901714B2Transmission line formed adjacent seal ringTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 2, 2014·3 cites·20 claims
- 1972US11978712B2Method of forming semiconductor package transmission lines with micro-bump linesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 7, 2024·0 cites·20 claims
- 2072US10665380B2Compact vertical inductors extending in vertical planesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 26, 2020·0 cites·20 claims
- 2171US11410952B2Filter and capacitor using redistribution layer and micro bump layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 9, 2022·0 cites·20 claims
- 2271US7642602B2System and method for I/O ESD protection with polysilicon regions fabricated by processes for making core transistorsSEMICONDUCTOR MFG INT SHANGHAI·Filed 2006·Granted Jan 5, 2010·5 cites·8 claims
- 2370US10971296B2Compact vertical inductors extending in vertical planesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 6, 2021·0 cites·20 claims
- 2470US8370774B2Constructing mapping between model parameters and electrical parametersTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Feb 5, 2013·4 cites·20 claims
- 2569US11145767B2Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 12, 2021·0 cites·20 claims
- 2669US10269746B2Methods and apparatus for transmission lines in packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 23, 2019·1 cites·20 claims
- 2769US9087838B2Structure and method for a high-K transformer with capacitive couplingYEN HSIAO-TSUNG·Filed 2011·Granted Jul 21, 2015·2 cites·21 claims
- 2869US8674883B2Antenna using through-silicon viaYEN HSIAO-TSUNG·Filed 2011·Granted Mar 18, 2014·2 cites·20 claims
- 2968US10216879B1Method for establishing aging model of device and analyzing aging state of device with aging modelTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Feb 26, 2019·1 cites·20 claims
- 3068US7933747B2Method and system for simulating dynamic behavior of a transistorCADENCE DESIGN SYSTEMS INC·Filed 2007·Granted Apr 26, 2011·4 cites·20 claims
- 3166US9147020B2Transmission line characterization using EM calibrationCHO HSIU-YING·Filed 2011·Granted Sep 29, 2015·2 cites·20 claims
- 3266US9121891B2Apparatus and methods for de-embedding through substrate viasTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Sep 1, 2015·1 cites·20 claims
- 3366US8686507B2System and method for I/O ESD protection with floating and/or biased polysilicon regionsSU TING CHIEH·Filed 2006·Granted Apr 1, 2014·5 cites·12 claims
- 3465US9449917B2Method of forming an inductor with magnetic materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Sep 20, 2016·1 cites·20 claims
- 3565US9141735B2Circuit device reliability simulation systemLO JIA-LIN·Filed 2010·Granted Sep 22, 2015·4 cites·14 claims
- 3664US9923101B2Semiconductor structureYEN HSIAO TSUNG·Filed 2012·Granted Mar 20, 2018·1 cites·15 claims
- 3763US10019545B2Simulation scheme including self heating effectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jul 10, 2018·2 cites·17 claims
- 3863US9530705B24 port L-2L de-embedding methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Dec 27, 2016·1 cites·20 claims
- 3963US9449945B2Filter and capacitor using redistribution layer and micro bump layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 20, 2016·1 cites·20 claims
- 4061US10860769B2Method and system for integrated circuit design with on-chip variation and spatial correlationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 8, 2020·0 cites·20 claims
- 4160US10714441B2Filter and capacitor using redistribution layer and micro bump layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 14, 2020·0 cites·20 claims
- 4257US10276295B2Compact vertical inductors extending in vertical planesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·0 cites·20 claims
- 4356US9960133B2Filter and capacitor using redistribution layer and micro bump layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 1, 2018·0 cites·20 claims
- 4456US9653531B2Methods of manufacturing a packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 16, 2017·0 cites·20 claims
- 4552US9559053B2Compact vertical inductors extending in vertical planesYEN HSIAO-TSUNG·Filed 2011·Granted Jan 31, 2017·0 cites·18 claims
- 4651US9633940B2Structure and method for a high-K transformer with capacitive couplingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 25, 2017·0 cites·20 claims
- 4750US2014117501A1Differential moscap deviceTAIWA SEMICONDUCTOR MFG CO LTD·Filed 2012·Application pending·0 cites
- 4846US8283726B2System and method for I/O ESD protection with polysilicon regions fabricated by processes for making core transistorsSU TING CHIEH·Filed 2009·Granted Oct 9, 2012·0 cites·10 claims
- 4939US2012278050A1Accelerated Generation of Circuit Parameter Distribution Using Monte Carlo SimulationHSIAO CHENG·Filed 2011·Application pending·0 cites
- 5033US8319286B2System and method for input pin ESD protection with floating and/or biased polysilicon regionsSU TING CHIEH·Filed 2010·Granted Nov 27, 2012·0 cites·10 claims
Showing the top 50 of 51 patent records by PatentIndex Score.
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