Inventor · disambiguated record
Haruki Nojo
Also filed as: NOJO HARUKI
11 granted patents·8 pending applications·187 citations·filing 1996–2018
90Inventor score
Files withTOSHIBA KK3DUPONT AIR PROD NANOMATERIALS2INFINEON TECHNOLOGIES AG2SAMSUNG SDI CO LTD2EKC TECHNOLOGY K K1
Top patents by PatentIndex Score
19 records- 0185US6443811B1Ceria slurry solution for improved defect control of silicon dioxide chemical-mechanical polishingINFINEON TECHNOLOGIES AG·Filed 2000·Granted Sep 3, 2002·40 cites·15 claims
- 0279US6059920ASemiconductor device polishing apparatus having improved polishing liquid supplying apparatus, and polishing liquid supplying methodTOSHIBA KK·Filed 1997·Granted May 9, 2000·59 cites·12 claims
- 0375US6224464B1Polishing method and polisher used in the methodTOSHIBA KK·Filed 1996·Granted May 1, 2001·39 cites·19 claims
- 0474US6419557B2Polishing method and polisher used in the methodTOSHIBA KK·Filed 2001·Granted Jul 16, 2002·14 cites·3 claims
- 0559US7968465B2Periodic acid compositions for polishing ruthenium/low K substratesDUPONT AIR PROD NANOMATERIALS·Filed 2004·Granted Jun 28, 2011·9 cites·22 claims
- 0656US8540894B2Polishing compositionMATSUSHITA TAKAYUKI·Filed 2008·Granted Sep 24, 2013·1 cites·25 claims
- 0756US7316976B2Polishing method to reduce dishing of tungsten on a dielectricDUPONT AIR PROD NANOMATERIALS·Filed 2005·Granted Jan 8, 2008·2 cites·29 claims
- 0855US6827752B2Cerium oxide slurry, and method of manufacturing substrateEKC TECHNOLOGY K K·Filed 2002·Granted Dec 7, 2004·7 cites·9 claims
- 0952US10723916B2Organic film CMP slurry composition and polishing method using sameSAMSUNG SDI CO LTD·Filed 2018·Granted Jul 28, 2020·0 cites·20 claims
- 1052US2016068711A1Organic Film CMP Slurry Composition and Polishing Method Using SameSAMSUNG SDI CO LTD·Filed 2014·Application pending·0 cites
- 1151US6303506B1Compositions for and method of reducing/eliminating scratches and defects in silicon dioxide during CMP processINFINEON TECHNOLOGIES AG·Filed 1999·Granted Oct 16, 2001·16 cites·17 claims
- 1250US2010163787A1Polishing compositionTANAKA RIKA·Filed 2008·Application pending·0 cites
- 1345US2004116315A1Liquid composition for cleaning hydrophobic substrate and cleaning method therewithNEC ELECTRONICS CORP·Filed 2003·Application pending·0 cites
- 1443US2015259575A1Polishing compositionNITTA HAAS INC·Filed 2015·Application pending·0 cites
- 1538US2007084828A1Polishing composition for a semiconductor substrateKAO CORP·Filed 2006·Application pending·0 cites
- 1631US2006037942A1Slurry, chemical mechanical polishing method using the slurry, and method of forming a surface of a capacitor using the slurryYUN SEONG-KYU·Filed 2005·Application pending·0 cites
- 1729US2001051597A1Cleaning solution for use in metal residue removal and a semiconductor device manufacturing method for executing cleaning by using the cleaning solution after cmpFiled 1998·Application pending·0 cites
- 1825US2002028580A1Substrate polishing methodFiled 1999·Application pending·0 cites
- 1923US9676966B2Chemical mechanical polishing composition and processNOJO HARUKI·Filed 2003·Granted Jun 13, 2017·0 cites·29 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →