Inventor · disambiguated record
Dong He
Also filed as: HE DONG · HE DONG-QING
8 granted patents·2 pending applications·9 citations·filing 2008–2025
77Inventor score
Files withSAMSUNG ELECTRONICS CO LTD5FUKUI PREC COMPONENT SHENZHEN2YANGTZE MEMORY TECH CO LTD2WANG MING1
Top patents by PatentIndex Score
10 records- 0177US10477389B2Method and apparatus for configuring connection between devices in communication systemSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Nov 12, 2019·2 cites·20 claims
- 0277US8049113B2Printed circuit boardsFUKUI PREC COMPONENT SHENZHEN·Filed 2008·Granted Nov 1, 2011·5 cites·2 claims
- 0366USRE49969EMethod and apparatus for configuring connection between devices in communication systemSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 14, 2024·0 cites·24 claims
- 0464US12254950B2Dies, semiconductor package structures, enable pin configuration methods and memoriesYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted Mar 18, 2025·0 cites·11 claims
- 0561US8071884B2Flexible printed circuit board having curved edgeWANG MING·Filed 2008·Granted Dec 6, 2011·2 cites·8 claims
- 0659US2025191622A1Dies, semiconductor package structures, enable pin configuration methods and memoriesYANGTZE MEMORY TECH CO LTD·Filed 2025·Application pending·0 cites
- 0745US10595351B2Technique for supporting initial setup between connection request device and connection acceptance deviceSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Mar 17, 2020·0 cites·10 claims
- 0844US10462659B2Method and apparatus for proximal authentication of wireless electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Oct 29, 2019·0 cites·20 claims
- 0941US7987586B2Method for manufacturing printed circuit board having different thicknesses in different areasFUKUI PREC COMPONENT SHENZHEN·Filed 2008·Granted Aug 2, 2011·0 cites·6 claims
- 1041US2019213183A1Navigation updating method and deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →