Inventor · disambiguated record
Axel Brintzinger
Also filed as: BRINTZINGER AXEL · BRINTZINGER AXEL C · BRINTZINGER AXEL CHRISTOPH
41 granted patents·2 pending applications·1,045 citations·filing 1998–2005
98Inventor score
Top patents by PatentIndex Score
43 records- 0195US6251710B1Method of making a dual damascene anti-fuse with via before wireIBM·Filed 2000·Granted Jun 26, 2001·85 cites·21 claims
- 0294US6720212B2Method of eliminating back-end rerouting in ball grid array packagingINFINEON TECHNOLOGIES AG·Filed 2002·Granted Apr 13, 2004·96 cites·11 claims
- 0394US6495918B1Chip crack stop design for semiconductor chipsINFINEON TECHNOLOGIES AG·Filed 2000·Granted Dec 17, 2002·96 cites·18 claims
- 0492US6433404B1Electrical fuses for semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2000·Granted Aug 13, 2002·113 cites·18 claims
- 0589US6323535B1Electrical fuses employing reverse biasing to enhance programmingINFINEON TECHNOLOGIES CORP·Filed 2000·Granted Nov 27, 2001·56 cites·16 claims
- 0683US6218279B1Vertical fuse and method of fabricationINFINEON TECHNOLOGIES CORP·Filed 2000·Granted Apr 17, 2001·31 cites·24 claims
- 0782US6882027B2Methods and apparatus for providing an antifuse functionIBM·Filed 2003·Granted Apr 19, 2005·33 cites·11 claims
- 0882US6465282B1Method of forming a self-aligned antifuse linkINFINEON TECHNOLOGIES AG·Filed 2001·Granted Oct 15, 2002·35 cites·23 claims
- 0980US6008523AElectrical fuses with tight pitches and method of fabrication in semiconductorsSIEMENS AG·Filed 1998·Granted Dec 28, 1999·66 cites·17 claims
- 1078US7087975B2Area efficient stacking of antifuses in semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2000·Granted Aug 8, 2006·28 cites·16 claims
- 1176US6943101B2Manufacturing of a corrosion protected interconnect on a substrateINFINEON TECHNOLOGIES AG·Filed 2002·Granted Sep 13, 2005·22 cites·23 claims
- 1276US6638870B2Forming a structure on a waferINFINEON TECHNOLOGIES AG·Filed 2002·Granted Oct 28, 2003·22 cites·21 claims
- 1375US6252292B1Vertical electrical cavity-fuseIBM CORP·Filed 1999·Granted Jun 26, 2001·52 cites·21 claims
- 1474US6486526B1Crack stop between neighboring fuses for protection from fuse blow damageIBM·Filed 1999·Granted Nov 26, 2002·42 cites·7 claims
- 1573US6242789B1Vertical fuse and method of fabricationINFINEON TECHNOLOGIES CORP·Filed 1999·Granted Jun 5, 2001·38 cites·16 claims
- 1670US6274440B1Manufacturing of cavity fuses on gate conductor levelIBM·Filed 1999·Granted Aug 14, 2001·39 cites·16 claims
- 1769US6458631B1Method for fabricating an integrated circuit, in particular an antifuseINFINEON TECHNOLOGIES AG·Filed 2002·Granted Oct 1, 2002·17 cites·6 claims
- 1868US6566238B2Metal wire fuse structure with cavityINFINEON TECHNOLOGIES AG·Filed 2001·Granted May 20, 2003·12 cites·14 claims
- 1967US6888215B2Dual damascene anti-fuse with via before wireINFINEON TECHNOLOGIES·Filed 2001·Granted May 3, 2005·12 cites·9 claims
- 2065US6866943B2Bond pad structure comprising tungsten or tungsten compound layer on top of metallization levelINFINEON TECHNOLOGIES AG·Filed 2002·Granted Mar 15, 2005·10 cites·18 claims
- 2165US6288436B1Mixed fuse technologiesIBM·Filed 1999·Granted Sep 11, 2001·31 cites·13 claims
- 2264US6261937B1Method for forming a semiconductor fuseSIEMENS AG·Filed 1998·Granted Jul 17, 2001·31 cites·12 claims
- 2362US7393782B2Process for producing layer structures for signal distributionINFINEON TECHNOLOGIES AG·Filed 2005·Granted Jul 1, 2008·3 cites·25 claims
- 2461US7271095B2Process for producing metallic interconnects and contact surfaces on electronic componentsINFINEON TECHNOLOGIES AG·Filed 2005·Granted Sep 18, 2007·2 cites·20 claims
- 2560US6919264B2Method for the solder-stop structuring of elevations on wafersINFINEON TECHNOLOGIES AG·Filed 2003·Granted Jul 19, 2005·11 cites·10 claims
- 2658US7115496B2Method for protecting the redistribution layer on wafers/chipsINFINEON TECHNOLOGIES AG·Filed 2004·Granted Oct 3, 2006·8 cites·26 claims
- 2758US6495901B2Multi-level fuse structureINFINEON TECHNOLOGIES AG·Filed 2001·Granted Dec 17, 2002·9 cites·16 claims
- 2856US6436585B1Method of using optical proximity effects to create electrically blown fuses with sub-critical dimension neck downsIBM·Filed 2000·Granted Aug 20, 2002·8 cites·26 claims
- 2955US7390742B2Method for producing a rewiring printed circuit boardINFINEON TECHNOLOGIES AG·Filed 2005·Granted Jun 24, 2008·1 cites·21 claims
- 3047US6911390B2Fabrication method for an interconnect on a substrateINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jun 28, 2005·2 cites·24 claims
- 3147US6509208B1Method for forming structures on a waferINFINEON AG·Filed 2001·Granted Jan 21, 2003·3 cites·15 claims
- 3247US6060398AGuard cell for etchingSIEMENS AG·Filed 1998·Granted May 9, 2000·13 cites·19 claims
- 3344US7368375B2Electronic component with compliant elevations having electrical contact areas and method for producing itINFINEON TECHNOLOGIES AG·Filed 2004·Granted May 6, 2008·2 cites·23 claims
- 3444US7169647B2Connection between a semiconductor chip and an external conductor structure and method for producing itINFINEON TECHNOLOGIES AG·Filed 2004·Granted Jan 30, 2007·2 cites·13 claims
- 3543US7335591B2Method for forming three-dimensional structures on a substrateINFINEON TECHNOLOGIES AG·Filed 2003·Granted Feb 26, 2008·1 cites·23 claims
- 3643US6268638B1Metal wire fuse structure with cavityIBM·Filed 1999·Granted Jul 31, 2001·8 cites·12 claims
- 3741US7235859B2Arrangement and process for protecting fuses/anti-fusesINFINEON TECHNOLOGIES AG·Filed 2004·Granted Jun 26, 2007·1 cites·25 claims
- 3838US7514798B2Arrangement for the protection of three-dimensional structures on wafersINFINEON TECHNOLOGIES AG·Filed 2003·Granted Apr 7, 2009·0 cites·21 claims
- 3938US7172966B2Method for fabricating metallic interconnects on electronic componentsINFINEON TECHNOLOGIES AG·Filed 2005·Granted Feb 6, 2007·0 cites·20 claims
- 4038US2005277230A1Process for producing a chip arrangement provided with a molding compoundBRINTZINGER AXEL·Filed 2005·Application pending·0 cites
- 4137US7332430B2Method for improving the mechanical properties of BOC module arrangementsINFINEON TECHNOLOGIES AG·Filed 2004·Granted Feb 19, 2008·0 cites·19 claims
- 4237US2005275085A1Arrangement for reducing the electrical crosstalk on a chipBRINTZINGER AXEL·Filed 2005·Application pending·0 cites
- 4333US6210995B1Method for manufacturing fusible links in a semiconductor deviceIBM·Filed 1999·Granted Apr 3, 2001·4 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →