Inventor · disambiguated record

Hikari Murai

Also filed as: MURAI HIKARI

36 granted patents·16 pending applications·48 citations·filing 1996–2021

95Inventor score

Technology areasB32B C08J H05K C08G H10W

Files withHITACHI CHEMICAL CO LTD31 FUJIMOTO DAISUKE5 KOTAKE TOMOHIKO3 MIZUNO YASUYUKI3 TSUCHIKAWA SHINJI3

Top patents by PatentIndex Score

52 records

0192US10590001B2Aerogel composite, and supporting member and heat insulation material provided with aerogel compositeHITACHI CHEMICAL CO LTD·Filed 2015·Granted Mar 17, 2020·4 cites·17 claims
0291US9828466B2Polyphenylene ether derivative having N-substituted maleimide group, and heat curable resin composition, resin varnish, prepreg, metal-clad laminate, and multilayer printed wiring board using sameHITACHI CHEMICAL CO LTD·Filed 2015·Granted Nov 28, 2017·4 cites·17 claims
0385US11286346B2Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radarHITACHI CHEMICAL CO LTD·Filed 2016·Granted Mar 29, 2022·2 cites·22 claims
0483US10414943B2Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminateHITACHI CHEMICAL CO LTD·Filed 2016·Granted Sep 17, 2019·1 cites·11 claims
0579US10563016B2AerogelHITACHI CHEMICAL CO LTD·Filed 2015·Granted Feb 18, 2020·1 cites·6 claims
0679US9050780B2Laminate body, laminate plate, multilayer laminate plate, printed wiring board, and method for manufacture of laminate plateHITACHI CHEMICAL CO LTD·Filed 2012·Granted Jun 9, 2015·4 cites·18 claims
0776US11359055B2Thermosetting resin composition, prepreg, laminate and multilayer printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2019·Granted Jun 14, 2022·0 cites·18 claims
0876US11220579B2Sol compositionHITACHI CHEMICAL CO LTD·Filed 2020·Granted Jan 11, 2022·0 cites·13 claims
0975US10738165B2AerogelHITACHI CHEMICAL CO LTD·Filed 2018·Granted Aug 11, 2020·0 cites·7 claims
1074US11117353B2Production method for aerogel laminate, and aerogel laminate rollHITACHI CHEMICAL CO LTD·Filed 2019·Granted Sep 14, 2021·0 cites·3 claims
1174US10119047B2Thermosetting resin composition, and prepreg, insulating film with support, laminate plate, and printed wiring board, each obtained using sameHITACHI CHEMICAL CO LTD·Filed 2015·Granted Nov 6, 2018·1 cites·22 claims
1271US9101061B2Laminate body, laminate plate, multilayer laminate plate, printed wiring board, and method for manufacture of laminate plateHITACHI CHEMICAL CO LTD·Filed 2012·Granted Aug 4, 2015·2 cites·22 claims
1371US8568891B2Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the sameMIZUNO YASUYUKI·Filed 2012·Granted Oct 29, 2013·3 cites·17 claims
1470US11780735B2Aerogel composite, and supporting member and heat insulation material provided with aerogel compositeHITACHI CHEMICAL CO LTD·Filed 2020·Granted Oct 10, 2023·0 cites·6 claims
1570US11333288B2Aerogel laminate and thermal insulation materialHITACHI CHEMICAL CO LTD·Filed 2019·Granted May 17, 2022·0 cites·7 claims
1670US8404769B2Process for producing resin varnish containing semi-IPN composite thermosetting resin and, provided using the same, resin varnish for printed wiring board, prepreg and metal-clad laminateFUJIMOTO DAISUKE·Filed 2008·Granted Mar 26, 2013·2 cites·29 claims
1767US9079376B2Prepreg, laminate obtained with the same and printed-wiring boardKOTAKE TOMOHIKO·Filed 2012·Granted Jul 14, 2015·1 cites·22 claims
1867US2018094162A1Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminateHITACHI CHEMICAL CO LTD·Filed 2017·Application pending·0 cites
1964US10519279B2Thermosetting resin composition, prepreg, laminate and multilayer printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2016·Granted Dec 31, 2019·0 cites·15 claims
2063US8277948B2Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the sameMIZUNO YASUYUKI·Filed 2007·Granted Oct 2, 2012·3 cites·17 claims
2162US10556405B2Production method for aerogel laminate, and aerogel laminate rollHITACHI CHEMICAL CO LTD·Filed 2016·Granted Feb 11, 2020·0 cites·5 claims
2260US8796473B2Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminateTSUCHIKAWA SHINJI·Filed 2007·Granted Aug 5, 2014·0 cites·5 claims
2359US2018022061A1Aerogel laminate and thermal insulation materialHITACHI CHEMICAL CO LTD·Filed 2016·Application pending·0 cites
2458US9873771B2Film-like epoxy resin composition, method of producing film-like epoxy resin composition, and method of producing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2015·Granted Jan 23, 2018·1 cites·16 claims
2558US8461332B2Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminateTSUCHIKAWA SHINJI·Filed 2012·Granted Jun 11, 2013·0 cites·6 claims
2658US7538150B2Dihydrobenzoxazine ring-containing resin, phenolic-triazine-aldehyde condensate and epoxy resinHITACHI CHEMICAL CO LTD·Filed 2005·Granted May 26, 2009·0 cites·26 claims
2758US2012276392A1Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminateTAKAHASHI YOSHIHIRO·Filed 2010·Application pending·0 cites
2857US10465089B2Varnish, prepreg, film with resin, metal foil-clad laminate, and printed circuit boardHITACHI CHEMICAL CO LTD·Filed 2018·Granted Nov 5, 2019·0 cites·22 claims
2953US10544305B2Thermosetting resin composition, resin film for interlayer insulation, composite film, printed wiring board, and method for producing sameHITACHI CHEMICAL CO LTD·Filed 2015·Granted Jan 28, 2020·0 cites·17 claims
3052US10323126B2Siloxane compound, modified imide resin, thermosetting resin composition, prepreg, film with resin, laminated plate, multilayer printed wiring board, and semiconductor packageHITACHI CHEMICAL CO LTD·Filed 2013·Granted Jun 18, 2019·0 cites·17 claims
3152US9133308B2Resin composition, and printed wiring board, laminated sheet, and prepreg using sameNAGAI SHUNSUKE·Filed 2012·Granted Sep 15, 2015·0 cites·17 claims
3249US8501870B2Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the sameMIZUNO YASUYUKI·Filed 2012·Granted Aug 6, 2013·0 cites·25 claims
3349US2013180760A1Laminate body, laminate plate, multilayer laminate plate, printed wiring board, and method for manufacture of laminate plateHITACHI CHEMICAL CO LTD·Filed 2012·Application pending·0 cites
3449US2023397337A1Method for manufacturing substrate with built-in components, and substrate with built-in componentsSHOWA DENKO MATERIALS CO LTD·Filed 2021·Application pending·0 cites
3549US2013112459A1Laminate body, laminate plate, multilayer laminate plate, printed wiring board, and method for manufacture of laminate plateHITACHI CHEMICAL CO LTD·Filed 2012·Application pending·0 cites
3648US2009323300A1Conductor Foil with Adhesive Layer, Conductor-Clad Laminate, Printed Wiring Board and Multilayer Wiring BoardFUJIMOTO DAISUKE·Filed 2007·Application pending·0 cites
3748US2012077401A1Resin composition for production of clad layer, resin film for production of clad layer utilizing the resin composition, and optical waveguide and optical module each utilizing the resin composition or the resin filmKOTAKE TOMOHIKO·Filed 2010·Application pending·0 cites
3847US5766386AMethod of producing metal clad laminateHITACHI CHEMICAL CO LTD·Filed 1996·Granted Jun 16, 1998·12 cites·11 claims
3947US2023328897A1Member for forming wiring, method for forming wiring layer using member for forming wiring, and wiring forming memberSHOWA DENKO MATERIALS CO LTD·Filed 2021·Application pending·0 cites
4047US2013040153A1Process for producing resin varnish containing semi-ipn composite, thermosetting resin and, provided using the same, resin varnish for printed wiring board, prepreg and metal-clad laminateFUJIMOTO DAISUKE·Filed 2012·Application pending·0 cites
4147US2016083614A1Varnish, prepreg, film with resin, metal foil-clad laminate, and printed circuit boardHITACHI CHEMICAL CO LTD·Filed 2015·Application pending·0 cites
4246US9265145B2Varnish, prepreg, film with resin, metal foil-clad laminate, and printed circuit boardMORITA KOUJI·Filed 2010·Granted Feb 16, 2016·0 cites·6 claims
4345US2013180769A1Laminate body, laminate plate, multilayer laminate plate, printed wiring board, and method for manufacture of laminate plateHITACHI CHEMICAL CO LTD·Filed 2012·Application pending·0 cites
4443US2013172459A1Process for producing compatibilized resin, thermosetting resin composition, prepreg, and laminateTSUCHIKAWA SHINJI·Filed 2011·Application pending·0 cites
4542US11041045B2Resin composition, prepreg, laminate and multilayer printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2016·Granted Jun 22, 2021·0 cites·16 claims
4642US8735733B2Resin composition, prepreg laminate obtained with the same and printed-wiring boardMIYATAKE MASATO·Filed 2012·Granted May 27, 2014·0 cites·16 claims
4741US11401381B2Modified silicone compound, and thermosetting resin composition, prepreg, laminate plate and printed wiring board using sameKOTAKE TOMOHIKO·Filed 2012·Granted Aug 2, 2022·0 cites·17 claims
4841US2014151091A1Primer layer for plating process, laminate for circuit board and production method for same, and multilayer circuit board and production method for sameFUJIMOTO DAISUKE·Filed 2012·Application pending·0 cites
4941US2018171135A1Interlayer insulating resin film, interlayer insulating resin film having adhesive auxiliary layer, and printed circuit boardINTEL CORP·Filed 2016·Application pending·0 cites
5040US11930594B2Adhesive film for multilayer printed-wiring boardHITACHI CHEMICAL CO LTD·Filed 2016·Granted Mar 12, 2024·0 cites·17 claims

Showing the top 50 of 52 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →