Inventor · disambiguated record
Tomio Fukuda
Also filed as: FUKUDA TOMIO
21 granted patents·175 citations·filing 1983–2019
94Inventor score
Top patents by PatentIndex Score
21 records- 0191US9828466B2Polyphenylene ether derivative having N-substituted maleimide group, and heat curable resin composition, resin varnish, prepreg, metal-clad laminate, and multilayer printed wiring board using sameHITACHI CHEMICAL CO LTD·Filed 2015·Granted Nov 28, 2017·4 cites·17 claims
- 0285US11286346B2Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radarHITACHI CHEMICAL CO LTD·Filed 2016·Granted Mar 29, 2022·2 cites·22 claims
- 0381US6696155B1Prepreg for printed wiring boards, resin varnish, resin composition and laminate for printed wiring boards produced by using these substancesHITACHI CHEMICAL CO LTD·Filed 1996·Granted Feb 24, 2004·34 cites·59 claims
- 0481US6524717B1Prepreg, metal-clad laminate, and printed circuit board obtained from theseHITACHI CHEMICAL CO LTD·Filed 2000·Granted Feb 25, 2003·27 cites·25 claims
- 0578US11339251B2Resin composition, resin film, laminate, multilayer printed wiring board and method for producing multilayer printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2017·Granted May 24, 2022·1 cites·20 claims
- 0678US10506705B2Multilayer transmission line plateHITACHI CHEMICAL CO LTD·Filed 2015·Granted Dec 10, 2019·3 cites·7 claims
- 0777US6572968B2Method of producing prepreg for printed wiring boards, glass fiber material treated with silicone oligomer, and laminate for printed wiring boardsHITACHI CHEMICAL CO LTD·Filed 2001·Granted Jun 3, 2003·11 cites·59 claims
- 0876US11359055B2Thermosetting resin composition, prepreg, laminate and multilayer printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2019·Granted Jun 14, 2022·0 cites·18 claims
- 0975US4526838APolyamino-bis-imide resinHITACHI CHEMICAL CO LTD·Filed 1983·Granted Jul 2, 1985·43 cites·12 claims
- 1064US10519279B2Thermosetting resin composition, prepreg, laminate and multilayer printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2016·Granted Dec 31, 2019·0 cites·15 claims
- 1160US6329474B1Epoxidized phenol-hydroxybenzaldehyde condensate, bisphenol-formaldehyde condensate and masked imidazoleHITACHI CHEMICAL CO LTD·Filed 2000·Granted Dec 11, 2001·10 cites·18 claims
- 1254US10876000B2Thermosetting resin composition, prepreg, laminated board, printed wiring board, and high speed communication-compatible moduleHITACHI CHEMICAL CO LTD·Filed 2017·Granted Dec 29, 2020·0 cites·20 claims
- 1352US4598115APolyamino-bis-maleimide prepolymer, method for manufacture thereof, and method for manufacture of laminate using said prepolymerHITACHI CHEMICAL CO LTD·Filed 1984·Granted Jul 1, 1986·8 cites·9 claims
- 1451US6462147B1Epoxy resin compositions for printed circuit board and printed circuit board using the sameHITACHI CHEMICAL CO LTD·Filed 1999·Granted Oct 8, 2002·10 cites·13 claims
- 1549US6692792B2Prepreg for printed wiring boards, resin varnish, resin composition, and laminate for printed wiring boards produced by using these substancesHITACHI CHEMICAL CO LTD·Filed 2003·Granted Feb 17, 2004·0 cites·15 claims
- 1648US6706409B2Incombustible resin composition, prepreg, laminated plate, metal-clad laminated plate, printed wiring board and multi-layer printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2001·Granted Mar 16, 2004·3 cites·16 claims
- 1744US4707316APolyamino-bis-maleimide prepolymer, method for manufacture thereof, and method for manufacture of laminate using said prepolymerHITACHI CHEMICAL CO LTD·Filed 1986·Granted Nov 17, 1987·6 cites·6 claims
- 1842US11041045B2Resin composition, prepreg, laminate and multilayer printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2016·Granted Jun 22, 2021·0 cites·16 claims
- 1939US10957964B2Multilayer transmission line plateHITACHI CHEMICAL CO LTD·Filed 2016·Granted Mar 23, 2021·0 cites·9 claims
- 2035US6180250B1Epoxy composition for printed circuit boardsHITACHI CHEMICAL CO LTD·Filed 1997·Granted Jan 30, 2001·5 cites·8 claims
- 2133US5883699AMethod and apparatus for preparing photographic processing control toolFUJI PHOTO FILM CO LTD·Filed 1996·Granted Mar 16, 1999·8 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →