Inventor · disambiguated record
Yasuyuki Mizuno
Also filed as: MIZUNO YASUYUKI
20 granted patents·6 pending applications·224 citations·filing 1993–2019
94Inventor score
Top patents by PatentIndex Score
26 records- 0195US5413840ADecorative laminated sheet having a feeling of coating and a process for producing sameRIKEN VINYL IND·Filed 1993·Granted May 9, 1995·130 cites·8 claims
- 0291US9828466B2Polyphenylene ether derivative having N-substituted maleimide group, and heat curable resin composition, resin varnish, prepreg, metal-clad laminate, and multilayer printed wiring board using sameHITACHI CHEMICAL CO LTD·Filed 2015·Granted Nov 28, 2017·4 cites·17 claims
- 0377US9397381B2Electromagnetic coupling structure, multilayered transmission line plate, method for producing electromagnetic coupling structure, and method for producing multilayered transmission line plateKONDOU YUUSUKE·Filed 2011·Granted Jul 19, 2016·6 cites·12 claims
- 0476US11432400B2Interlayer insulating film and method for producing sameHITACHI CHEMICAL CO LTD·Filed 2017·Granted Aug 30, 2022·2 cites·19 claims
- 0576US11359055B2Thermosetting resin composition, prepreg, laminate and multilayer printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2019·Granted Jun 14, 2022·0 cites·18 claims
- 0676US6667107B2Thermosetting resin composition and use thereofHITACHI CHEMICAL CO LTD·Filed 2002·Granted Dec 23, 2003·18 cites·30 claims
- 0771US8568891B2Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the sameMIZUNO YASUYUKI·Filed 2012·Granted Oct 29, 2013·3 cites·17 claims
- 0870US8404769B2Process for producing resin varnish containing semi-IPN composite thermosetting resin and, provided using the same, resin varnish for printed wiring board, prepreg and metal-clad laminateFUJIMOTO DAISUKE·Filed 2008·Granted Mar 26, 2013·2 cites·29 claims
- 0968US7157506B2Resin composition with excellent dielectric characteristics, process for producing resin composition, varnish prepared from the same, process for producing the same, prepeg made with these, and metal-clad laminateHITACHI CHEMICAL CO LTD·Filed 2001·Granted Jan 2, 2007·7 cites·16 claims
- 1064US10519279B2Thermosetting resin composition, prepreg, laminate and multilayer printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2016·Granted Dec 31, 2019·0 cites·15 claims
- 1163US8277948B2Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the sameMIZUNO YASUYUKI·Filed 2007·Granted Oct 2, 2012·3 cites·17 claims
- 1262US5492589ADecorative laminated sheet having a feeling of coating and a process for producing sameRIKEN VINYL IND·Filed 1995·Granted Feb 20, 1996·24 cites·10 claims
- 1358US7816430B2Composition of polycyanate ester and biphenyl epoxy resinHITACHI CHEMICAL CO LTD·Filed 2003·Granted Oct 19, 2010·3 cites·29 claims
- 1457US6156831AModified cyanate ester group curable resin composition and varnish, prepreg, metal clad laminated board, film, printed circuit board, and multilayered circuit board using the sameHITACHI CHEMICAL CO LTD·Filed 1998·Granted Dec 5, 2000·18 cites·10 claims
- 1557US2007207326A1Resin composition excellent in dielectric properties, process for producing the same, varnish produced using the same, process for producing the varnish, and prepreg and metal-clad laminate using the resin composition and varnishMIZUNO YASUYUKI·Filed 2006·Application pending·0 cites
- 1654US7078106B2Thermosetting resin composition and use thereofHITACHI CHEMICAL CO LTD·Filed 2003·Granted Jul 18, 2006·1 cites·10 claims
- 1749US8501870B2Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the sameMIZUNO YASUYUKI·Filed 2012·Granted Aug 6, 2013·0 cites·25 claims
- 1848US6465083B1Method of making varnish of modified cyanate ester group curable resin composition, and prepreg, metal clad laminated board, film, printed circuit board, and multilayered circuit board using the compositionHITACHI CHEMICAL CO LTD·Filed 2000·Granted Oct 15, 2002·3 cites·30 claims
- 1948US2009323300A1Conductor Foil with Adhesive Layer, Conductor-Clad Laminate, Printed Wiring Board and Multilayer Wiring BoardFUJIMOTO DAISUKE·Filed 2007·Application pending·0 cites
- 2047US2013040153A1Process for producing resin varnish containing semi-ipn composite, thermosetting resin and, provided using the same, resin varnish for printed wiring board, prepreg and metal-clad laminateFUJIMOTO DAISUKE·Filed 2012·Application pending·0 cites
- 2146US10251265B2Pregreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2017·Granted Apr 2, 2019·0 cites·10 claims
- 2242US11041045B2Resin composition, prepreg, laminate and multilayer printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2016·Granted Jun 22, 2021·0 cites·16 claims
- 2342US2013057365A1Electromagnetic field coupling structure, multi-layer transmission-line plate, method of manufacturing electromagnetic field coupling structure, and method of manufacturing multi-layer transmission-line plateMIZUSHIMA ETSUO·Filed 2011·Application pending·0 cites
- 2441US2018171135A1Interlayer insulating resin film, interlayer insulating resin film having adhesive auxiliary layer, and printed circuit boardINTEL CORP·Filed 2016·Application pending·0 cites
- 2540US11930594B2Adhesive film for multilayer printed-wiring boardHITACHI CHEMICAL CO LTD·Filed 2016·Granted Mar 12, 2024·0 cites·17 claims
- 2638US2011272185A1Pregreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring boardKAWAGUCHI AKIKO·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →