Inventor · disambiguated record
Takao Tanigawa
Also filed as: TANIGAWA TAKAO
13 granted patents·2 pending applications·11 citations·filing 2015–2023
84Inventor score
Top patents by PatentIndex Score
15 records- 0191US9828466B2Polyphenylene ether derivative having N-substituted maleimide group, and heat curable resin composition, resin varnish, prepreg, metal-clad laminate, and multilayer printed wiring board using sameHITACHI CHEMICAL CO LTD·Filed 2015·Granted Nov 28, 2017·4 cites·17 claims
- 0285US11286346B2Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radarHITACHI CHEMICAL CO LTD·Filed 2016·Granted Mar 29, 2022·2 cites·22 claims
- 0380US11377546B2Resin composition, laminate sheet, and multilayer printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2017·Granted Jul 5, 2022·1 cites·11 claims
- 0478US11339251B2Resin composition, resin film, laminate, multilayer printed wiring board and method for producing multilayer printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2017·Granted May 24, 2022·1 cites·20 claims
- 0578US10506705B2Multilayer transmission line plateHITACHI CHEMICAL CO LTD·Filed 2015·Granted Dec 10, 2019·3 cites·7 claims
- 0676US11359055B2Thermosetting resin composition, prepreg, laminate and multilayer printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2019·Granted Jun 14, 2022·0 cites·18 claims
- 0764US10907029B2Resin composition, resin layer-provided support, prepreg, laminate sheet, multilayer printed wiring board, and printed wiring board for millimeter-wave radarHITACHI CHEMICAL CO LTD·Filed 2017·Granted Feb 2, 2021·0 cites·16 claims
- 0864US10519279B2Thermosetting resin composition, prepreg, laminate and multilayer printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2016·Granted Dec 31, 2019·0 cites·15 claims
- 0958US12324105B2Maleimide resin composition, prepreg, resin film, laminated board, printed wiring board, and semiconductor packageRESONAC CORP·Filed 2021·Granted Jun 3, 2025·0 cites·15 claims
- 1057US11745482B2Fluororesin substrate laminateSHOWA DENKO MATERIALS CO LTD·Filed 2020·Granted Sep 5, 2023·0 cites·14 claims
- 1152US12024624B2Maleimide resin composition, prepreg, laminated board, resin film, printed wiring board, and semiconductor packageRESONAC CORP·Filed 2021·Granted Jul 2, 2024·0 cites·13 claims
- 1250US2025188263A1Resin composition, prepreg, laminated board, resin film, printed wiring board, and semiconductor packageRESONAC CORP·Filed 2023·Application pending·0 cites
- 1345US2023391940A1Maleimide resin composition, prepreg, laminate, resin film, printed wiring board, and semiconductor packageRESONAC CORP·Filed 2021·Application pending·0 cites
- 1442US11041045B2Resin composition, prepreg, laminate and multilayer printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2016·Granted Jun 22, 2021·0 cites·16 claims
- 1539US10957964B2Multilayer transmission line plateHITACHI CHEMICAL CO LTD·Filed 2016·Granted Mar 23, 2021·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →