Inventor · disambiguated record
Hidehiro Nakamura
Also filed as: NAKAMURA HIDEHIRO
29 granted patents·23 pending applications·501 citations·filing 1985–2024
97Inventor score
Files withHITACHI CHEMICAL CO LTD23ALPS ELECTRIC CO LTD10AJINOMOTO KK6NAKAMURA HIDEHIRO5KYOCERA CONNECTOR PROD CORP2
Top patents by PatentIndex Score
52 records- 0191US10035099B2CO2 removal deviceHITACHI CHEMICAL CO LTD·Filed 2015·Granted Jul 31, 2018·9 cites·16 claims
- 0286US8648605B2Sensor, sensor system, portable sensor system, method of analyzing metal ions, mounting substrate, method of analyzing plating preventing chemical species, method of analyzing produced compound, and method of analyzing monovalent copper chemical speciesNAKAMURA HIDEHIRO·Filed 2008·Granted Feb 11, 2014·14 cites·37 claims
- 0385US6064111ASubstrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor packageHITACHI COMPANY LTD·Filed 1997·Granted May 16, 2000·84 cites·11 claims
- 0484US6133534AWiring board for electrical tests with bumps having polymeric coatingHITACHI CHEMICAL CO LTD·Filed 1994·Granted Oct 17, 2000·56 cites·2 claims
- 0580US8535623B2Concave connector substrate, method of manufacturing the same, measuring kit, sensor substrate, and sensor substrate interprolated cylinderNAKAMURA HIDEHIRO·Filed 2010·Granted Sep 17, 2013·4 cites·16 claims
- 0678US6761569B2Card connector deviceALPS ELECTRIC CO LTD·Filed 2002·Granted Jul 13, 2004·26 cites·6 claims
- 0778US6236108B1Substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor packageHITACHI CHEMICAL CO LTD·Filed 2000·Granted May 22, 2001·24 cites·14 claims
- 0877US5725385APC card connectorALPS ELECTRIC CO LTD·Filed 1996·Granted Mar 10, 1998·44 cites·4 claims
- 0976US2025020656A1Evaluating method, evaluating apparatus, evaluating program product, evaluating system, and terminal apparatusAJINOMOTO KK·Filed 2024·Application pending·0 cites
- 1075US8839513B2Concave connector substrate, method of manufacturing the same, measuring kit, sensor substrate, and sensor substrate interpolated cylinderHITACHI CHEMICAL CO LTD·Filed 2013·Granted Sep 23, 2014·2 cites·5 claims
- 1175US7205645B2Wiring board, semiconductor device, and method of manufacturing wiring boardHITACHI CHEMICAL CO LTD·Filed 2001·Granted Apr 17, 2007·16 cites·20 claims
- 1275US4694049AThermoplastic elastomer compositionTOYO BOSEKI·Filed 1985·Granted Sep 15, 1987·23 cites·7 claims
- 1374US6568073B1Process for the fabrication of wiring board for electrical testsHITACHI CHEMICAL CO LTD·Filed 1998·Granted May 27, 2003·37 cites·5 claims
- 1469US7874848B2Connector for inserting wiring board, and method for manufacturing the sameHITACHI CHEMICAL CO LTD·Filed 2009·Granted Jan 25, 2011·3 cites·11 claims
- 1568US5683258APc card connectorALPS ELECTRIC CO LTD·Filed 1996·Granted Nov 4, 1997·27 cites·14 claims
- 1667US8864525B2Memory card connectorKYOCERA CONNECTOR PROD CORP·Filed 2013·Granted Oct 21, 2014·2 cites·8 claims
- 1763US6800685B1Polyester resin composition for engine peripheral partsTOYO BOSEKI·Filed 2000·Granted Oct 5, 2004·6 cites·4 claims
- 1862US7704799B2Method of manufacturing wiring substrateHITACHI CHEMICAL CO LTD·Filed 2007·Granted Apr 27, 2010·1 cites·8 claims
- 1962US6062904APC card connectorALPS ELECTRIC CO LTD·Filed 1997·Granted May 16, 2000·22 cites·11 claims
- 2062US6042401AConnector device for IC cardALPS ELECTRIC CO LTD·Filed 1998·Granted Mar 28, 2000·28 cites·6 claims
- 2162US2024277783A1BACTERIUM MODIFIED TO EXPRESS HETEROLOGOUS Tat PROTEINAJINOMOTO KK·Filed 2024·Application pending·0 cites
- 2261US5738532AConnector pin contactALPS ELECTRIC CO LTD·Filed 1996·Granted Apr 14, 1998·18 cites·2 claims
- 2361US2019217241A1Adsorbent, method for removing carbon dioxide, carbon dioxide remover, and air conditionerHITACHI CHEMICAL CO LTD·Filed 2017·Application pending·0 cites
- 2458US2019151821A1Adsorbent, method for removing carbon dioxide, device for removing carbon dioxide, and system for removing carbon dioxideHITACHI CHEMICAL CO LTD·Filed 2017·Application pending·0 cites
- 2558US2019255509A1Adsorbent, method for removing carbon dioxide, device for removing carbon dioxide, and system for removing carbon dioxideHITACHI CHEMICAL CO LTD·Filed 2017·Application pending·0 cites
- 2658US2025297129A1Photosensitive resin composition, photosensitive resin film, printed wiring board, and semiconductor packageRESONAC CORP·Filed 2024·Application pending·0 cites
- 2758US2024091185A1Composition for improving cognitive function, agent for improving cognitive function, and food for improving cognitive functionAJINOMOTO KK·Filed 2023·Application pending·0 cites
- 2857US4791238AHigh-density wired circuit board using insulated wiresHITACHI CHEMICAL CO LTD·Filed 1987·Granted Dec 13, 1988·18 cites·20 claims
- 2957US2014158555A1Sensor, sensor system, portable sensor system, method of analyzing metal ions, mounting substrate, method of analyzing plating preventing chemical species, method of analyzing produced compound, and method of analyzing monovalent copper chemical speciesNAT INST OF ADVANCED IND SCIEN·Filed 2013·Application pending·0 cites
- 3056US9209538B2Memory card connectorKYOCERA CONNECTOR PROD CORP·Filed 2014·Granted Dec 8, 2015·4 cites·6 claims
- 3154US10456731B2CO2 concentration reducing deviceHITACHI CHEMICAL CO LTD·Filed 2016·Granted Oct 29, 2019·0 cites·9 claims
- 3254US2025231353A1Optical connector systemKYOCERA CORP·Filed 2022·Application pending·0 cites
- 3353US5735042AMethod of fabricating connector pin contactALPS ELECTRIC CO LTD·Filed 1996·Granted Apr 7, 1998·13 cites·4 claims
- 3453US2018017570A1Evaluating method, evaluating apparatus, evaluating program product, evaluating system, and terminal apparatusAJINOMOTO KK·Filed 2017·Application pending·0 cites
- 3551US10456743B2Exhaust-gas treatment equipment and gas-capture-material deterioration-state estimating methodHITACHI CHEMICAL CO LTD·Filed 2016·Granted Oct 29, 2019·0 cites·19 claims
- 3650US2009008141A1Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereofNAKAMURA HIDEHIRO·Filed 2008·Application pending·0 cites
- 3749US8028402B2Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereofHITACHI CHEMICAL CO LTD·Filed 2007·Granted Oct 4, 2011·0 cites·6 claims
- 3849US2016220943A1Carbon-dioxide recovery apparatus, and carbon-dioxide recovery methodHITACHI CHEMICAL CO LTD·Filed 2014·Application pending·0 cites
- 3949US2008289868A1Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereofNAKAMURA HIDEHIRO·Filed 2008·Application pending·0 cites
- 4047US2016199808A1Carbon-dioxide capturing material, and carbon-dioxide recovery apparatus using sameHITACHI CHEMICAL CO LTD·Filed 2014·Application pending·0 cites
- 4143US2019228844A1Evaluating method, evaluating apparatus, evaluating program product, evaluating system, and terminal apparatus for colorectal cancerAJINOMOTO KK·Filed 2019·Application pending·0 cites
- 4243US2019227071A1Evaluating method, evaluating apparatus, evaluating program product, evaluating system, and terminal apparatus for pancreatic cancerAJINOMOTO KK·Filed 2019·Application pending·0 cites
- 4342US2019201832A1Adsorbent and method for producing same, method for removing carbon dioxide, carbon dioxide removing device, and air conditioning deviceHITACHI CHEMICAL CO LTD·Filed 2017·Application pending·0 cites
- 4442US2019217242A1Adsorbent, method for producing same, method for removing carbon dioxide, device for removing carbon dioxide, and air conditionerHITACHI CHEMICAL CO LTD·Filed 2017·Application pending·0 cites
- 4540US6015309APC card connectorALPS ELECTRIC CO LTD·Filed 1998·Granted Jan 18, 2000·9 cites·2 claims
- 4640US2019301754A1Air conditioner, air conditioning system, method for removing carbon dioxide, adsorbent, and carbon dioxide removerHITACHI CHEMICAL CO LTD·Filed 2017·Application pending·0 cites
- 4740US2019262795A1Adsorbent, method for removing carbon dioxide, carbon dioxide remover, and air conditionerHITACHI CHEMICAL CO LTD·Filed 2017·Application pending·0 cites
- 4837US2019022572A1Carbon Dioxide Separation/Recovery Device, Combustion System Using Same, Thermal Power Generation System Using Same, and Method for Separating and Recovering Carbon DioxideHITACHI CHEMICAL CO LTD·Filed 2016·Application pending·0 cites
- 4937US2020016536A1Carbon dioxide removal device and method for recovering carbon dioxide adsorption capacity of adsorbentHITACHI CHEMICAL CO LTD·Filed 2017·Application pending·0 cites
- 5036US2006162956A1Connection substrate, multi-layer wiring board using the connection substrate, substrate for semiconductor package, and methods for manufacturing themNAKAMURA HIDEHIRO·Filed 2002·Application pending·0 cites
Showing the top 50 of 52 patent records by PatentIndex Score.
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