Inventor · disambiguated record
Li-Wen Hung
Also filed as: HUNG LI-WEN
65 granted patents·4 pending applications·167 citations·filing 2010–2022
98Inventor score
Top patents by PatentIndex Score
69 records- 0198US10217637B1Chip handling and electronic component integrationIBM·Filed 2017·Granted Feb 26, 2019·35 cites·13 claims
- 0297US9886640B1Method and apparatus to identify a live face image using a thermal radiation sensor and a visual radiation sensorIBM·Filed 2016·Granted Feb 6, 2018·29 cites·20 claims
- 0395US10381255B2Double layer release temporary bond and debond processes and systemsIBM·Filed 2018·Granted Aug 13, 2019·7 cites·11 claims
- 0495US9653441B1Monolithic integration of a III-V optoelectronic device, a filter and a driving circuitIBM·Filed 2016·Granted May 16, 2017·13 cites·20 claims
- 0595US9114977B2MEMS device and process for RF and low resistance applicationsINVENSENSE INC·Filed 2012·Granted Aug 25, 2015·12 cites·18 claims
- 0694US10224229B2Double layer release temporary bond and debond processes and systemsIBM·Filed 2016·Granted Mar 5, 2019·8 cites·8 claims
- 0791US9324601B1Low temperature adhesive resins for wafer bondingIBM·Filed 2014·Granted Apr 26, 2016·8 cites·12 claims
- 0890US9900677B2System for continuous monitoring of body soundsIBM·Filed 2015·Granted Feb 20, 2018·10 cites·20 claims
- 0989US10490525B1High speed handling of ultra-small chips by selective laser bonding and debondingIBM·Filed 2018·Granted Nov 26, 2019·5 cites·16 claims
- 1089US9735077B1Heterogeneous miniaturization platformIBM·Filed 2016·Granted Aug 15, 2017·5 cites·10 claims
- 1187US9947570B2Handler bonding and debonding for semiconductor diesIBM·Filed 2016·Granted Apr 17, 2018·3 cites·16 claims
- 1286US10658182B2Chip handling and electronic component integrationIBM·Filed 2019·Granted May 19, 2020·1 cites·20 claims
- 1384US10325785B2Handler bonding and debonding for semiconductor diesIBM·Filed 2017·Granted Jun 18, 2019·2 cites·9 claims
- 1482US10224219B2Handler bonding and debonding for semiconductor diesIBM·Filed 2015·Granted Mar 5, 2019·2 cites·14 claims
- 1582US10174229B2Adhesive resins for wafer bondingIBM·Filed 2017·Granted Jan 8, 2019·2 cites·16 claims
- 1682US8704316B2Etchant-free methods of producing a gap between two layers, and devices produced therebyNGUYEN CLARK TU-CUONG·Filed 2012·Granted Apr 22, 2014·4 cites·11 claims
- 1781US10395929B2Chip handling and electronic component integrationIBM·Filed 2017·Granted Aug 27, 2019·2 cites·14 claims
- 1880US10380284B2Heterogeneous miniaturization platformIBM·Filed 2017·Granted Aug 13, 2019·2 cites·5 claims
- 1979US10050167B2Light sensitive switch for semiconductor package tamper detectionIBM·Filed 2016·Granted Aug 14, 2018·2 cites·15 claims
- 2079US9748131B2Low temperature adhesive resins for wafer bondingIBM·Filed 2015·Granted Aug 29, 2017·2 cites·13 claims
- 2178US10250963B2System for continuous monitoring of body soundsIBM·Filed 2017·Granted Apr 2, 2019·2 cites·20 claims
- 2278US9496230B1Light sensitive switch for semiconductor package tamper detectionIBM·Filed 2015·Granted Nov 15, 2016·2 cites·6 claims
- 2377US11599785B2Inference focus for offline training of SRAM inference engine in binary neural networkIBM·Filed 2018·Granted Mar 7, 2023·2 cites·19 claims
- 2476US11797851B2Inference focus for offline training of SRAM inference engine in binary neural networkIBM·Filed 2022·Granted Oct 24, 2023·0 cites·20 claims
- 2576US10586726B2Handler bonding and debonding for semiconductor diesIBM·Filed 2017·Granted Mar 10, 2020·1 cites·11 claims
- 2672US11121005B2Handler bonding and debonding for semiconductor diesIBM·Filed 2020·Granted Sep 14, 2021·0 cites·20 claims
- 2771US11424152B2Handler bonding and debonding for semiconductor diesIBM·Filed 2020·Granted Aug 23, 2022·0 cites·6 claims
- 2871US10276439B2Rapid oxide etch for manufacturing through dielectric via structuresIBM·Filed 2017·Granted Apr 30, 2019·2 cites·19 claims
- 2970US10811413B2Multi-threshold vertical FETs with common gatesIBM·Filed 2018·Granted Oct 20, 2020·1 cites·13 claims
- 3070US9850406B2Adhesive resins for wafer bondingIBM·Filed 2015·Granted Dec 26, 2017·1 cites·5 claims
- 3170US9601364B2Low temperature adhesive resins for wafer bondingIBM·Filed 2016·Granted Mar 21, 2017·1 cites·14 claims
- 3268US10833048B2Nanowire enabled substrate bonding and electrical contact formationIBM·Filed 2018·Granted Nov 10, 2020·1 cites·20 claims
- 3366US10160635B2MEMS device and process for RF and low resistance applicationsINVENSENSE INC·Filed 2017·Granted Dec 25, 2018·0 cites·10 claims
- 3465US10573538B2Handler bonding and debonding for semiconductor diesIBM·Filed 2019·Granted Feb 25, 2020·0 cites·19 claims
- 3565US10508022B2MEMS device and process for RF and low resistance applicationsINVENSENSE INC·Filed 2017·Granted Dec 17, 2019·0 cites·6 claims
- 3663US10651036B2Chip handling and electronic component integrationIBM·Filed 2019·Granted May 12, 2020·0 cites·9 claims
- 3762US11055459B2Heterogeneous miniaturization platformIBM·Filed 2019·Granted Jul 6, 2021·0 cites·19 claims
- 3862US10940554B2Planar fabrication of micro-needlesIBM·Filed 2018·Granted Mar 9, 2021·0 cites·20 claims
- 3962US10679887B2Handler bonding and debonding for semiconductor diesIBM·Filed 2018·Granted Jun 9, 2020·0 cites·20 claims
- 4062US9617141B2MEMS device and process for RF and low resistance applicationsINVENSENSE INC·Filed 2015·Granted Apr 11, 2017·0 cites·7 claims
- 4161US11201138B2Wafer level integration including design/co-design, structure process, equipment stress management and thermal managementIBM·Filed 2019·Granted Dec 14, 2021·0 cites·14 claims
- 4261US10651134B2Wafer level integration including design/co-design, structure process, equipment stress management and thermal managementIBM·Filed 2019·Granted May 12, 2020·0 cites·13 claims
- 4360US11043301B2Infrared detectors and thermal tags for real-time activity monitoringIBM·Filed 2019·Granted Jun 22, 2021·0 cites·19 claims
- 4460US10835156B2Thermal tags for real-time activity monitoring and methods for fabricating the sameIBM·Filed 2019·Granted Nov 17, 2020·0 cites·16 claims
- 4560US10505160B2Micro-battery using glass packageIBM·Filed 2017·Granted Dec 10, 2019·0 cites·18 claims
- 4660US10282646B2Tag with tunable retro-reflectorsIBM·Filed 2017·Granted May 7, 2019·0 cites·19 claims
- 4759US9818054B1Tag with tunable retro-reflectorsIBM·Filed 2017·Granted Nov 14, 2017·0 cites·7 claims
- 4857US11222862B2High speed handling of ultra-small chips by selective laser bonding and debondingIBM·Filed 2019·Granted Jan 11, 2022·0 cites·13 claims
- 4957US10168427B2Data readout via reflected ultrasound signalsIBM·Filed 2018·Granted Jan 1, 2019·0 cites·20 claims
- 5057US2016133486A1Double Layer Release Temporary Bond and Debond Processes and SystemsIBM·Filed 2014·Application pending·0 cites
Showing the top 50 of 69 patent records by PatentIndex Score.
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